Patents by Inventor Tony Ping-Chen Chiang

Tony Ping-Chen Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tantalum-containing barrier layers for copper
    Patent number: 6057237
    Abstract: An improved barrier layer of tantalum to prevent diffusion of copper into a dielectric layer or silicon substrate is made by alternately sputter depositing thin amorphous tantalum layers and tantalum nitride layers. The resultant wholly amorphous tantalum-containing layer leads to a stronger barrier and prevents formation of a columnar structure in thick tantalum layers. The sputter depositions of tantalum and tantalum nitride can be repeated until the desired thickness of the barrier is obtained.
    Type: Grant
    Filed: April 29, 1997
    Date of Patent: May 2, 2000
    Assignee: Applied Materials, Inc.
    Inventors: Peijun Ding, Tony Ping-Chen Chiang