Abstract: A method for fabricating a ferroelectric device includes providing a lower electrode layer on a substrate, forming a retention enhancement layer by oxidizing a surface of the lower electrode layer using a gas phase oxidation process, and depositing a ferroelectric high-k metal oxide layer over the retention enhancement layer on the lower electrode layer using a vapor deposition process. The retention enhancement layer on the lower electrode layer increases the retention performance and reliability of the ferroelectric device.

Abstract: Various aspects relate to a memory cell including: a first electrode; a second electrode; and a memory element disposed between the first electrode and the second electrode. The memory element includes a spontaneously polarizable material. The first electrode, the second electrode, and the memory element forming a memory capacitor. The first electrode and/or the second electrode includes: an electrically conductive electrode layer, and a functional layer comprising a semi-conductive material, wherein the functional layer is in direct physical contact with the memory element.

Abstract: Various aspects relate to a memory cell including: a first electrode; a second electrode; and a memory element, the first electrode, the second electrode, and the memory element forming a memory capacitor; wherein the memory element includes a spontaneously polarizable layer stack which includes an alternating sequence of first sublayers and second sublayers, wherein each of the second sublayers substantially consists of a mixed material of an oxide of a first transition metal and an oxide of a second transition metal, wherein each of the first sublayers substantially consists of the oxide of the first transition metal or second transition metal; wherein a first concentration of the first transition metal and a second concentration of the second transition metal in the mixed material are substantially different from one another, and/or wherein the alternating sequence starts with one of the first sublayers and ends with another one of the first sublayers.

Abstract: Various aspects relate to a destructive read out operation to read out a memory state of a remanent polarizable capacitive memory element. The destructive read out operation may include causing a voltage drop sequence over the remanent polarizable capacitive memory element, wherein the voltage drop sequence includes one or more voltage drops of a first polarity and one or more voltage drops of a second polarity opposite the first polarity. In some aspects, the destructive read out operation is configured as a bipolar read out operation to determine the memory state of the remanent polarizable capacitive memory element based on an electrical behavior of the remanent polarizable capacitive memory element during the voltage drop sequence.

Abstract: Various aspects relate to a functional layer and the formation thereof. A method for manufacturing a functional layer of an electronic device may include: forming a plurality of sublayers of the functional layer by a plurality of consecutive sublayer processes, each sublayer process of the plurality of consecutive sublayer processes comprising: forming a sublayer of the plurality of sublayers by vapor deposition, the sublayer comprising one or more materials, and, subsequently, crystallizing the one or more materials comprised in the sublayer.

Abstract: Various aspects relate to a threshold switch structure and a use of such threshold switch structure as a threshold switch in a memory cell arrangement, the threshold switch structure including: a first electrode, a second electrode, a switch element in direct physical contact with the first electrode and the second electrode, the switch element including a layer of a spontaneously polarizable material. The first electrode, the second electrode, and the switch element are configured to allow for a switching of the switch element between a first electrical conductance state and a second electrical conductance state as a function of a voltage drop provided over the switch element by the first electrode and the second electrode.

Abstract: Various aspects relate to a threshold switch structure and a use of such threshold switch structure as a threshold switch in a memory cell arrangement, the threshold switch structure including: a first electrode, a second electrode, a switch element in direct physical contact with the first electrode and the second electrode, the switch element including a layer of a spontaneously polarizable material. The first electrode, the second electrode, and the switch element are configured to allow for a switching of the switch element between a first electrical conductance state and a second electrical conductance state as a function of a voltage drop provided over the switch element by the first electrode and the second electrode.

Abstract: Various aspects relate to a functional layer and the formation thereof. A method for manufacturing a functional layer of an electronic device may include: forming a plurality of sublayers of the functional layer by a plurality of consecutive sublayer processes, each sublayer process of the plurality of consecutive sublayer processes comprising: forming a sublayer of the plurality of sublayers by vapor deposition, the sublayer comprising one or more materials, and, subsequently, crystallizing the one or more materials comprised in the sublayer.