Abstract: A laser marking system for IC packages including a tray input shuttle assembly and a tray transport borne by a transport actuator for moving a tray carrier carrying a tray of unmarked packaged ICs received from the tray input shuttle assembly to a tray output shuttle assembly over a transport actuator path extending under an open-bottomed enclosure of a laser marking station. The tray input shuttle assembly, laser marking station and tray output shuttle assembly each has associated therewith a lift mechanism for raising and lowering the tray carrier relative to the transport so as to facilitate tray loading of the tray carrier from the tray input shuttle assembly, insertion and withdrawal of the tray carrier bearing a tray of packaged ICs for marking into and out of the marking station and unloading of a tray of marked packaged ICs from the tray carrier to the output shuttle assembly.

Abstract: An apparatus for laser marking IC packages carried in trays includes a transport actuator extending from an input shuttle assembly to an output shuttle assembly. The laser marking apparatus further includes a tray transport movable on the transport actuator and configured to receive a cooperatively configured tray carrier. The input shuttle assembly is adapted to load a tray carrying unmarked IC packages onto the tray carrier from a stack of trays on the input shuttle assembly. A tray bearing unmarked IC packages may travel on the tray carrier borne by the tray transport to a laser marking station positioned above the transport actuator and having a single laser marking head traversing one mark field disposed within an enclosure. A first portion of the IC packages disposed in the tray that are positioned in the mark field may be laser marked after the tray is lifted into the enclosure by a rotational lift mechanism located proximate the laser marking station.

Abstract: A carrier tape recycling apparatus for receiving bare carrier tape from a manufacturing system and for winding the carrier tape onto a plurality of tape reels for reuse. The carrier tape recycling apparatus includes a reel drive mechanism configured to support and rotationally drive a plurality of tape reels such that bare carrier tape dispensed from the manufacturing system may be wound onto the tape reels. The reel drive mechanism provides a slip drive allowing each tape reel disposed in the recycling apparatus to rotate and receive carrier tape independent of other tape reels disposed in the recycling apparatus, so as to compensate for variation in the rate at which carrier tape is supplied to each tape reel disposed in the carrier tape recycling apparatus. The present invention also includes a method of using the recycling apparatus to recycle bare carrier tape dispensed from a manufacturing system.

Abstract: A laser marking system for IC packages including a tray input shuttle assembly, a tray transport borne by a transport actuator for moving a cooperatively configured tray carrier carrying a tray of unmarked packaged ICs received from the tray input shuttle assembly to a tray output shuttle assembly over a transport actuator path extending under an open-bottomed enclosure of a laser marking station. The tray input shuttle assembly, laser marking station and tray output shuttle assembly each has associated therewith a sliding wedge-type lift mechanism for raising and lowering the tray carrier vertically with respect to the transport so as to facilitate tray loading of the tray carrier from a stack of trays on the tray input shuttle assembly, insertion and withdrawal of the tray carrier bearing a tray of packaged ICs for marking into and out of the marking station and unloading of a tray of marked packaged ICs from the tray carrier onto a stack of trays on the output shuttle assembly.

Abstract: A laser marking system for IC packages including a tray input shuttle assembly, a tray transport borne by a transport actuator for moving a tray carrier carrying a tray of unmarked packaged ICs received from the tray input shuttle assembly to a tray output shuttle assembly over a transport actuator path extending under an open-bottomed enclosure of a laser marking station. The tray input shuttle assembly, laser marking station and tray output shuttle assembly each has associated therewith lift mechanism for raising and lowering the tray carrier relative to the transport so as to facilitate tray loading of the tray carrier from the tray input shuttle assembly, insertion and withdrawal of the tray carrier bearing a tray of packaged ICs for marking into and out of the marking station and unloading of a tray of marked packaged ICs from the tray carrier to the output shuttle assembly.

Abstract: An apparatus for consistently and accurately applying adhesive bar code labels to a target surface on the edge of trays such as JEDEC trays. The bar code applicator includes a base having a label seat for supporting a bar code label that is to be applied to a JEDEC tray. Slidably disposed within a carriage way on the base is a carriage for holding a JEDEC tray. The carriage has a plurality of structural features that allows for the accurate and repetitive longitudinal and lateral alignment of a JEDEC tray within the carriage. The carriage also has a target window. The label seat extends up from the carriage way and into the target window of the carriage, thereby enabling a label resting on the label seat to make contact with the target surface of a JEDEC tray supported within the carriage when the carriage is moved downward with respect to the base.

Abstract: A self-aligning tray carrier for supporting a tray carrying a large group of ICs therein. The invention includes self-aligning, cooperative tray carrier and tray transport configurations to ensure precise, repeatable alignment of a tray carrier with an underlying tray transport through gravity alone when a tray carrier which has been raised off the transport is again lowered into supporting contact therewith. Another, optional, feature of the mutually cooperative configurations of the tray carrier and tray transport permits the tilting of the tray carrier while still supported on the transport so as to effect precise alignment of IC packages carried in rectangular recesses on a tray on the tray carrier with respect to common alignment points (i.e., the same corner of each tray recess) to facilitate repeatability of the IC package surface location being marked on each IC package borne by the tray. Such alignment may be further enhanced by vibration or tapping of the tray carrier while in a tilted orientation.

Abstract: A laser marking station housing a laser marking head within a walled, substantially bottomless enclosure defining an opening into which a tray carrier bearing a tray of IC packages to be marked may be raised to place the tray at correct laser focal length and effect complete (laser) light containment within the enclosure using the tray carrier to effect closure of the opening. A lift mechanism for raising the tray carrier into the enclosure is also disclosed.

Abstract: A lift mechanism for controlled lifting and lowering, especially suitable for lifting and lowering a tray of ICs. The lift mechanism includes a horizontally movable drive wedge element having an upper inclined surface and a slave wedge element having a lower inclined surface slidingly supported on the drive wedge element upper inclined surface. Horizontal movement of the slave wedge element is constrained while vertical movement is permitted, so that horizontal movement of the drive wedge element raises or lowers the slave wedge element. A lift structure extending upwardly from the slave wedge element may be employed to engage a tray as, for example, when loading or unloading trays from a transport at a shuttle assembly. A dual-action drive mechanism may move the drive wedge element horizontally, while a dual-action stop mechanism may be employed to limit travel of the drive wedge element at a position short of full vertical extension.

Abstract: A shuttle assembly for handling trays of IC packages. The shuttle assembly is configured to accept cooperatively-configured trays in a vertically-extending tray stack volume in only a single rotational orientation. Trays are selectively released from or accepted by the tray stack volume by operation of selectively extendable and retractable tray support elements driven by actuators, which may comprise air cylinders. A lift mechanism for raising and lowering a tray in alignment with the tray stack volume may be included. A method of operation of the shuttle assembly is also disclosed.

Abstract: A de-marking apparatus and method are provided for de-marking a marked packaged integrated circuit (IC). The de-marking apparatus comprises a de-marking head for removing a thin layer of material from the marked surface. The apparatus may also include mechanisms for feeding, transferring and conveying the marked ICs to and from the de-marking head, and washing, drying, and receiving the de-marked ICs in an automated fashion. The method includes physically removing package material from a marked IC surface and producing a surface reflectivity suitable for re-marking with a laser beam.

Abstract: A de-marking apparatus and method are provided for de-marking a marked packaged integrated circuit (IC). The de-marking apparatus comprises a de-marking head for removing a thin layer of material from the marked surface. The apparatus may also include mechanisms for feeding, transferring and conveying the marked ICs to and from the de-marking head, and washing, drying, and receiving the de-marked ICs in an automated fashion. The method includes physically removing package material from a marked IC surface and producing a surface reflectivity suitable for re-marking with a laser beam.