Abstract: A light source device includes: a substrate; a light-emitting unit matrix including a plurality of light-emitting units disposed in a matrix on the substrate; and a reflective resin disposed in a region, on the substrate, including a region where the light-emitting unit matrix is disposed. The plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit adjacent to each other in a column direction of the light-emitting unit matrix. The reflective resin includes a first reflective portion disposed between the first light-emitting unit and the second light-emitting unit and extending in a direction intersecting the column direction. At least a portion of an upper surface of the first reflective portion protrudes beyond an upper surface of the first light-emitting unit and an upper surface of the second light-emitting unit.

Abstract: A light source device includes: a substrate; a light-emitting unit matrix including a plurality of light-emitting units disposed in a matrix on the substrate; and a reflective resin disposed in a region, on the substrate, including a region where the light-emitting unit matrix is disposed. The plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit adjacent to each other in a column direction of the light-emitting unit matrix. The reflective resin includes a first reflective portion disposed between the first light-emitting unit and the second light-emitting unit and extending in a direction intersecting the column direction. At least a portion of an upper surface of the first reflective portion protrudes beyond an upper surface of the first light-emitting unit and an upper surface of the second light-emitting unit.

Abstract: A light emitting device including: a light emitting element including a growth substrate and a semiconductor layer located below the growth substrate; a light transmissive member disposed above a top surface of the light emitting element; and a transparent resin bonding the top surface and a bottom surface of the light transmissive member, wherein the bottom surface encompasses the top surface, the transparent resin continuously covers the bottom surface and a side surface of the semiconductor layer. The transparent resin is disposed to cover a covered portion located at a central portion of the semiconductor layer and to expose an exposed portion located at a side edge portion of the semiconductor layer in a direction parallel to the top surface in a side view, and covers the side surface of the semiconductor layer so that at least 20% in length of the semiconductor layer in the direction is covered.

Abstract: A light emitting device including: a light emitting element including a growth substrate and a semiconductor layer located below the growth substrate; a light transmissive member disposed above a top surface of the light emitting element; and a transparent resin bonding the top surface and a bottom surface of the light transmissive member, wherein the bottom surface encompasses the top surface, the transparent resin continuously covers the bottom surface and a side surface of the semiconductor layer. The transparent resin is disposed to cover a covered portion located at a central portion of the semiconductor layer and to expose an exposed portion located at a side edge portion of the semiconductor layer in a direction parallel to the top surface in a side view, and covers the side surface of the semiconductor layer so that at least 20% in length of the semiconductor layer in the direction is covered.

Abstract: A semiconductor device includes: a lead frame; a semiconductor element held by the lead frame; a frame body which is formed on the lead frame to surround the semiconductor element, cover a side surface of the lead frame, and expose a bottom surface of the lead frame; and a protective resin filling a region surrounded by the frame body. The lead frame includes an uneven part formed in a section which is part of an upper surface of the lead frame, and is covered with the frame body.

Abstract: A light distribution controller of a light-emitting device includes a first optical member formed of ZnO disposed over an LED interposing a transparent adhesive, and a second optical member which covers the first optical member. The first optical member includes a first concave portion having an opening in a regular hexagon shape whose area gradually increases. In the first concave portion, inner wall surfaces having inclined surfaces, each of whose bases is formed by one side of the hexagon of the opening shape, are formed. Outside of the first optical member, outer wall surfaces each having a trapezoidal shape are formed. The second optical member includes a second concave portion arranged so that light at an annular peak in the light distribution characteristic of the light traveled through the first optical member is totally reflected.

Abstract: A light-emitting device includes a light-emitting element 110; and a lens section 132 covering over the light-emitting element 110. The lens section 132 includes an entrance surface S1 on which light from the light-emitting element 110 is incident; an exit surface S2 from which the light incident on the entrance surface S1 is emitted; and an optical axis L extending so as to penetrate the entrance surface S1 and the exit surface S2. A concave section 132a is formed in an area of the exit surface S2, which contains the optical axis L, and two flat sections 132b are formed so as to face each other across the optical axis L. The exit surface S2 defines an upwardly-protruding curved surface formed between the two flat sections 132b, and the optical axis L is coincidence with a reference optical axis of the light-emitting element 110.

Abstract: A light emitting device includes a board 112 and a light-emitting element 110 fixed onto the board and having a light emission region facing upward. The board includes a plurality of projections 125 and 126 spaced from one another and each surrounding the light-emitting element 110. A side surface of each of the projections facing the light-emitting element is a reflective surface 125A, 126A that reflects light emitted sideways from the light emission region. The reflective surfaces are concentric about the light-emitting element. Upper ends of the reflective surfaces are located higher with increasing distance from the light-emitting element.

Abstract: A light emitting device includes: a light-emitting element 110 fixed onto a board 112 and having a light emission region that faces upward; and a light-control lens 114 located above the light-emitting element 110 and having an optical axis L that coincides with an optical axis of the light emission region. The light-control lens 114 includes a recess 141a located around the optical axis L, a first reflective surface that is located in the recess 141a and totally reflects light incident from the light emission region in a direction away from the optical axis L, and a first refractive surface that is located outside the first reflective surface in the recess 141a and refracts light incident from the light emission region at an emission angle larger than an incident angle of the light.

Abstract: A light distribution controller of a light-emitting device includes a first optical member formed of ZnO disposed over an LED interposing a transparent adhesive, and a second optical member which covers the first optical member. The first optical member includes a first concave portion having an opening in a regular hexagon shape whose area gradually increases. In the first concave portion, inner wall surfaces having inclined surfaces, each of whose bases is formed by one side of the hexagon of the opening shape, are formed. Outside of the first optical member, outer wall surfaces each having a trapezoidal shape are formed. The second optical member includes a second concave portion arranged so that light at an annular peak in the light distribution characteristic of the light traveled through the first optical member is totally reflected.

Abstract: A light emitting device includes a light emitting element mounted on a lead frame which is a base; and a photochromic lens sealing the light emitting element. The light emitting element is in a rectangular parallelepiped shape and has a rectangular upper surface. The photochromic lens has a circular lower surface and has, at a side surface, a convex lens part inwardly inclined from bottom to top. Two flat parts are formed at the side surface by cutting off the photochromic lens in parallel with a long side of the upper surface of the light emitting element.

Abstract: A semiconductor device includes a lead frame, a first semiconductor element mounted on the lead frame, a frame-like member formed on the lead frame, surrounding the first semiconductor element, and a protective resin filling a space surrounded by the frame-like member. The lead frame has an external terminal protruding outside the frame-like member. The external terminal has a barrier portion which is located at an end portion thereof protruding from the frame-like member and rises from a top surface of the external terminal.