Patents by Inventor Tooru FURUSHIGE

Tooru FURUSHIGE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8992726
    Abstract: A device for peeling off silicon wafers, including: a supporting member that is configured to support a board-shaped member to which plural silicon wafers are bonded via an adhesive; a heating unit for heating the board-shaped member; a shifting mechanism that is configured to shift, in a horizontal direction, the supporting member relatively with respect to the heating unit; a peeling-off mechanism that is configured to peel off the silicon wafers one by one; and a container for allowing the silicon wafers, the board-shaped member and the supporting member to soak in a liquid.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: March 31, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Koso Matsuno, Michirou Yoshino, Masayuki Takahashi, Tooru Furushige, Yuji Yamamoto
  • Patent number: 8711482
    Abstract: A pressing mold for optical lenses, which molds a ring-zone-type diffraction lens having a plurality of concentric ring zones, the mold including: diffraction action transfer surfaces configured to form diffraction action surfaces that diffract light passing through the diffraction lens; and step transfer surfaces configured to form step surfaces that connect the adjacent diffraction action surfaces of the diffraction lens, wherein surface roughness of the step transfer surfaces is larger than surface roughness of the diffraction action transfer surfaces.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: April 29, 2014
    Assignee: Panasonic Corporation
    Inventors: Yoshifumi Takasu, Naomi Kishimoto, Yuta Moriyama, Tooru Furushige
  • Publication number: 20130319619
    Abstract: A device for peeling off silicon wafers, including: a supporting member that is configured to support a board-shaped member to which plural silicon wafers are bonded via an adhesive; a heating unit for heating the board-shaped member; a shifting mechanism that is configured to shift, in a horizontal direction, the supporting member relatively with respect to the heating unit; a peeling-off mechanism that is configured to peel off the silicon wafers one by one; and a container for allowing the silicon wafers, the board-shaped member and the supporting member to soak in a liquid.
    Type: Application
    Filed: May 23, 2013
    Publication date: December 5, 2013
    Applicant: Panasonic Corporation
    Inventors: Koso MATSUNO, Michirou YOSHINO, Masayuki TAKAHASHI, Tooru FURUSHIGE, Yuji YAMAMOTO
  • Publication number: 20110134531
    Abstract: A pressing mold for optical lenses, which molds a ring-zone-type diffraction lens having a plurality of concentric ring zones, the mold including: diffraction action transfer surfaces configured to form diffraction action surfaces that diffract light passing through the diffraction lens; and step transfer surfaces configured to form step surfaces that connect the adjacent diffraction action surfaces of the diffraction lens, wherein surface roughness of the step transfer surfaces is larger than surface roughness of the diffraction action transfer surfaces.
    Type: Application
    Filed: November 30, 2010
    Publication date: June 9, 2011
    Applicant: Panasonic Corporation
    Inventors: Yoshifumi TAKASU, Naomi KISHIMOTO, Yuta MORIYAMA, Tooru FURUSHIGE