Abstract: To more securely hold reliability of an electronic component. There is provided an electronic component including a base material having a main face, at least one wiring formed on the main face of the base material, at least one pad provided at each end of the at least one wiring on the main face of the base material, a resist part formed to cover the at least one wiring on the main face of the base material, and a chip flip-chip mounted on the main face of the base material and connected to the base material via a bump bonded to the at least one pad, in which the resist part has a pad opening configured to expose the at least one pad bonded with the bump, and a circulation groove formed to be connected to the pad opening at one end as a connection end to the pad opening.

Abstract: To enhance reliability of an electronic component. There is provided an electronic component including a base material having a first face and a second face, a first layer provided on the first face of the base material and including a plurality of pads connected to a plurality of bumps of a chip flip-chip mounted on the first face of the base material, respectively, and a second layer provided on the second face of the base material, in which a contacting member arranged at apart contacting with the second face of the base material at a position corresponding to each of the plurality of pads in the second layer is made of the same material.

Abstract: To enable a structure to be downsized, and to restrict a reduction in image quality. There is provided an electronic component including a circuit board having a first face, a second face opposite to the first face, and a first opening, a translucent member provide to oppose the first face of the circuit board, an imaging device flip-chip mounted on the second face of the circuit board and having a light receiving face on a side opposing the translucent member, and a light absorption member provided between the circuit board and the translucent member and formed in a region other than the first opening in plan view on the first face of the circuit board.

Abstract: To more securely hold reliability of an electronic component. There is provided an electronic component including a base material having a main face, at least one wiring formed on the main face of the base material, at least one pad provided at each end of the at least one wiring on the main face of the base material, a resist part formed to cover the at least one wiring on the main face of the base material, and a chip flip-chip mounted on the main face of the base material and connected to the base material via a bump bonded to the at least one pad, in which the resist part has a pad opening configured to expose the at least one pad bonded with the bump, and a circulation groove formed to be connected to the pad opening at one end as a connection end to the pad opening.

Abstract: To enable a structure to be downsized, and to restrict a reduction in image quality. There is provided an electronic component including a circuit board having a first face, a second face opposite to the first face, and a first opening, a translucent member provide to oppose the first face of the circuit board, an imaging device flip-chip mounted on the second face of the circuit board and having a light receiving face on a side opposing the translucent member, and a light absorption member provided between the circuit board and the translucent member and formed in a region other than the first opening in plan view on the first face of the circuit board.

Abstract: To enhance reliability of an electronic component. There is provided an electronic component including a base material having a first face and a second face, a first layer provided on the first face of the base material and including a plurality of pads connected to a plurality of bumps of a chip flip-chip mounted on the first face of the base material, respectively, and a second layer provided on the second face of the base material, in which a contacting member arranged at apart contacting with the second face of the base material at a position corresponding to each of the plurality of pads in the second layer is made of the same material.

Abstract: In a surface inspection method in which parallel rays passing through a thin slit are projected onto a surface of a specimen and a luminous line formed on the specimen surface by the parallel rays is viewed by a television camera so as to inspect the specimen surface, a photo-electric signal showing the luminous line is picked up from an output video signal of the television camera. The time from rising state of the horizontal synchronizing signal contained in the video signal to occurrence of a pulse of the photo-electric signal is measured in each period of the horizontal synchronizing signal. The time data in each period is compared with a previously set reference value, and whether or not the specimen passes the inspection is discriminated based on variation of the comparison result.

Abstract: A method and apparatus for detecting external defects of a circular sealing member by means of irradiation of detecting rays. A laser detecting ray for scanning is irradiated to a surface of the circular member which is rotated at the detecting section, and reflected light from the surface is received to be converted into electric signals so that the surface defects can be optically inspected. In case there is a defective surface, an irregularly reflected light can be received and based on an extracted signal a defective surface can be easily discriminated from the normal surface. The circular member is delivered one after another to the detecting section wherein discrimination is automatically made whether the circular member is non-defective or defective by means of rotation, irradiation of detecting rays and defect detecting action.