Abstract: A problem to be solved by the present disclosure is to realize a fan unit capable of determining occurrence or non-occurrence of a backflow during operation. In a second unit, a second controller calculates front-rear differential pressure by substituting a rotation speed and a volume of air or a wind speed that can be acquired in real time into a relational expression. The relational expression derives, from two values of the rotation speed, the volume of air or the wind speed, and the front-rear differential pressure, the remaining one value. Then, the second controller determines that a backflow occurs if the calculated front-rear differential pressure is within a range that cannot occur under a normal condition. Therefore, the occurrence of a backflow can be detected without using an expensive pressure sensor or a directional wind speed sensor.

Abstract: A problem to be solved by the present disclosure is to realize a fan unit capable of determining occurrence or non-occurrence of a backflow during operation. In a second unit, a second controller calculates front-rear differential pressure by substituting a rotation speed and a volume of air or a wind speed that can be acquired in real time into a relational expression. The relational expression derives, from two values of the rotation speed, the volume of air or the wind speed, and the front-rear differential pressure, the remaining one value. Then, the second controller determines that a backflow occurs if the calculated front-rear differential pressure is within a range that cannot occur under a normal condition. Therefore, the occurrence of a backflow can be detected without using an expensive pressure sensor or a directional wind speed sensor.

Abstract: The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.

Abstract: The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.

Abstract: The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.

Abstract: The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.

Abstract: The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.

Abstract: The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.