Patents by Inventor Tooru Nagamine

Tooru Nagamine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-encapsulated semiconductor device having a particular mounting structure
    Patent number: 5150193
    Abstract: The present invention consists in that a through hole of large area is provided in a die pad or a tab, thereby to prevent a resin from cracking at the rear surface of a surface-packaging resin package in a high-temperature soldering atmosphere of vapor-phase reflow or the like, whereby a resin-molded surface-packaged IC of high reliability is provided.
    Type: Grant
    Filed: February 11, 1991
    Date of Patent: September 22, 1992
    Assignees: Hitachi, Ltd., Hitachi Tobu Semiconductor, Ltd.
    Inventors: Toshihiro Yasuhara, Masachika Masuda, Gen Murakami, Kunihiko Nishi, Masanori Sakimoto, Ichio Shimizu, Akio Hoshi, Sumio Okada, Tooru Nagamine