Patents by Inventor Tooru Nishimura

Tooru Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11530490
    Abstract: In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 ?m to 5.00 ?m and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 ?m to 1.00 ?m and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: December 20, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenji Kubota, Tooru Nishimura, Takashi Tamagawa, Kiyotaka Nakaya
  • Publication number: 20220194502
    Abstract: A vehicle inspection method in a production line of a vehicle includes: performing a part inspection in steps of manufacturing parts of the vehicle, the part inspection in which each of the parts after being manufactured is inspected with an inspection device and which includes one or more inspection items; storing a result of the part inspection in a storage device such that the result is associated with the part; and displaying the result of the part inspection, on a display device used in a completed vehicle inspection for inspecting a completed vehicle serving as the vehicle that is completed, information indicating at least the part of the parts corresponding to a failed item serving as the inspection item which is determined not to be passed in the result of the part inspection stored in the storage device and information indicating the failed item.
    Type: Application
    Filed: November 15, 2021
    Publication date: June 23, 2022
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tatsuhiro TAKAHASHI, Hiromitsu KAMATA, Satoru KOSHI, Kazuki INOUE, Tetsuya TAMOTO, Tooru NISHIMURA, Kiyoshi SUZUKI, Shinya IMAI, Seiya SHIBATA
  • Publication number: 20210158990
    Abstract: In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 ?m to 5.00 ?m and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 ?m to 1.00 ?m and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.
    Type: Application
    Filed: August 8, 2018
    Publication date: May 27, 2021
    Inventors: Kenji Kubota, Tooru Nishimura, Takashi Tamagawa, Kiyotaka Nakaya
  • Patent number: 5663284
    Abstract: A copolymerized polyamide, comprising amide bonds formed by an aliphatic diamine with 4 to 14 carbon atoms and terephthalic acid, with the existence ratios of distributed respectively adjacent amide bonds satisfying the following formulae (A) and (B), and with the half-crystallization time satisfying the following formula (C).0.9.ltoreq.[XY]obs./[XY]calcd.<1.1 (A)0.9.ltoreq.[XX]obs./[XX]calcd.<1.1 (B)wherein X stands for an amide bond formed by an aliphatic diamine with 4 to 14 carbon atoms and terephthalic acid, and Y stands for any other amide bond than X. [XY] refers to the rate at which X and Y are adjacent to each other among all the amide bonds in the polymer structure, and [XX] refers to the rate at which X and X are adjacent to each other among all the amide bonds in the polymer structure. [XY] calcd. and [XX] calcd. are respectively the values of [XY] and [XX] calculated on the assumption that X and Y amide bonds are distributed statistically at random, and [XY] obs. and [XX] obs.
    Type: Grant
    Filed: August 17, 1995
    Date of Patent: September 2, 1997
    Assignee: Toray Industries, Inc.
    Inventors: Kazuhiko Kominami, Tooru Nishimura, Kazuhiko Kobayashi, Shoji Yamamoto