Abstract: A method of producing a cover-packing assembly for a hard disk device is disclosed which comprises applying a liquid self-adhesive silicone rubber material to a predetermined position of a cover member, and curing the rubber material. According to the method, the formation of a packing member and the adhesion of the packing member to the cover member are performed simultaneously on the cover member. Thus, use of a pressure sensitive adhesive, an adhesive or the like, as in the case of employing a packing member comprising a molded or die-cut product, is unnecessary in this method, which is extremely advantageous.

Abstract: Different from a conventional casing for fixed disc memory assembly constructed by conjoining two covering members at the flanges by sandwiching a gasket prepared by punching a sheet of a spongy rubber, the invention proposes a covering member in which a gasket of a solid silicone rubber is adhesively and integrally bonded to the flange thereof in advance so that the fixed disc memory assembly can be constructed with greatly improved work-ability in addition to the advantage obtained by the absence of any tiny rubber particles formed by pubching of a spongy rubber sheet as the dusts to cause serious troubles. The gasket may be shaped either by a conventional rubber molding method and bonded to the flange using a silicone-based adhesive or may be formed by the techniques of the so-called FIPG method.

Abstract: The invention provides a novel curable epoxy resin composition suitable for resin encapsulation of various electronic devices such as transistors, ICs, LSIs and the like with high anti-moisture resistance and without causing excessive stress upon curing to the electronic devices. The resin composition comprises an epoxy resin, a curing agent such as a phenol novolac resin, a filler and a curing catalyst such as an imidazole compound as well as an organosilicon polymer represented by the general formula ##STR1## in which R is a monovalent hydrocarbon group such as methyl, Z is a divalent organic group such as ethylene and phenylene, n is a positive number of at least 10 on an average and a and b are each zero or a positive number not exceeding 1 with the proviso that a+b is in the range from 1 to 2 inclusive, in a limited amount.

Abstract: In an electric charge transfer apparatus, first capacitance elements have the one end grounded and the other end connected to a first main electrode of a field effect transistor. Second capacitance elements have the one end grounded and the other end connected to a second main electrode of the field effect transistor. Third capacitance elements have the one end connected to the second main electrode of the field effect transistor and the other end connected to a transfer auxiliary pulse application terminal. Switch element have the one end connected to the second main electrode of the field effect transistor and the other end connected to a voltage source. A transfer pulse application terminal is connected to a control electrode of the field effect transistor.

Abstract: A solid state image sensing device comprising a matrix-disposed photoelectric diodes 27+21, 27+21, . . . . on a monolithic substrate, wherein each one transferring switching means 24, . . . . and each one noise eliminating MOS switch 26, . . . . are provided for each vertical column of said matrix-disposed photoelectric transducing element, and the transferring switches 24, . . . . twice transfers information on a connecting line 22 of each column to a node point N.sub.ST during each horizontal fly-back period, so that the first one of said twice transferring transfers noise signal to the node points N.sub.ST for throwing it away, and the second one of said transferring transfers genuine light information of the photodiode 27, . . . to the node points N.sub.ST, . . . . for outputting the light information, whereby noises such as spurious noise, fixed pattern noise and blooming are eliminated and also scanning speed is improved.