Patents by Inventor Toosaku Kojima

Toosaku Kojima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus of bonding insulated and coated wire
    Patent number: 4950866
    Abstract: A method of bonding an insulated and coated wire which has an insulated coating on the outside of an electrically conductive wire is disclosed which consists in connecting one end of said insulated and coated wire to the anode side of an arc power source and connecting a discharge torch to the cathode side of said arc power source with an arc discharge performed between the tip of said insulated and coated wire and the discharge torch to form a ball at said end, and said ball being positioned with respect to the bonding pad of an electrically conductive electrode and bonding being performed with a specified pressure applied to said ball.
    Type: Grant
    Filed: November 29, 1988
    Date of Patent: August 21, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Toosaku Kojima, Tsutomu Mimata, Susumu Okikawa, Michio Okamoto, Takeshi Kawana, Satoshi Urayama