Patents by Inventor Tor Krog

Tor Krog has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9789572
    Abstract: A universal automation line is configured for the assembly of electronics and mechanical devices. The universal automation line includes universal cells or stations that can be programmed to perform a variety of automated assembly tasks such as glue dispensing, screw driving, pick and place, etc. The stations are interchangeable by different module design such as selective soldering, heat stacking, bottom lead trimming, bottom screwing and ultrasonic welding. Each station can also include an automated robot, which is also interchangeable, to perform different tasks and complete fully automated assemblies. The stations can be sequenced inline for a fully automated line or combined with some manual operation. The stations can communicate by standardized interfaces and local networks, and can be expanded to an intranet or the internet for remote control.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: October 17, 2017
    Assignee: Flextronics AP, LLC
    Inventors: Dason Cheung, Murad Kurwa, Tor Krog, Xiuchuan Wang, Hao Tan
  • Patent number: 9293636
    Abstract: A process for dressing a solder pad removes excess solder from locations that should be free of solder, such as circuit traces, other solder pads, and components near the solder pad being dressed. A first area of a substrate comprises solder to be removed and is heated to a first temperature. A second area of the substrate is heated to a second temperature. A vacuum nozzle is heated to a third temperature sufficient to melt the solder and is scanned across the area to be dressed, melting and vacuuming away the excess solder. The scanning process is controlled using a computer numerical controlled (CNC) machine.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: March 22, 2016
    Assignee: Flextronics AP, LLC
    Inventors: Dason Cheung, Murad Kurwa, Richard Loi, Tor Krog
  • Publication number: 20140034708
    Abstract: A process for dressing a solder pad removes excess solder from locations that should be free of solder, such as circuit traces, other solder pads, and components near the solder pad being dressed. A first area of a substrate comprises solder to be removed and is heated to a first temperature. A second area of the substrate is heated to a second temperature. A vacuum nozzle is heated to a third temperature sufficient to melt the solder and is scanned across the area to be dressed, melting and vacuuming away the excess solder. The scanning process is controlled using a computer numerical controlled (CNC) machine.
    Type: Application
    Filed: July 29, 2013
    Publication date: February 6, 2014
    Applicant: Flextronics AP, LLC
    Inventors: Dason Cheung, Murad Kurwa, Richard Loi, Tor Krog