Abstract: An optical assembly of a microlithography imaging device comprises a holding device for holding an optical element. The holding device has a holding element having first and second interface sections. The first interface section for a first interface connecting the holding element and the optical element in an installed state. The second interface section forms a second interface connecting the holding element and a support unit in the installed state. The support unit connects the optical element to a support structure to support the optical element on the support structure via a supporting force. The holding device comprises an actuator device engaging on the holding element between the first and second interfaces. The actuator device acts on the holding element via a controller so that a specifiable interface deformation and/or a specifiable interface force distribution acting on the optical element is set on the first interface.

Abstract: A stop, such as a numerical aperture stop, obscuration stop or false-light stop, for a lithography apparatus, includes a light-transmissive aperture and a stop element, in which or at which the aperture is provided. The stop element is opaque and fluid-permeable outside the aperture.

Abstract: An optical component (100, 200) for a lithography apparatus (1) includes an optical element (102, 202), produced from a first material (G102) and having an optically effective surface (106, 206); and a carrying element (104, 204), produced from a second material (G104) and carrying the optical element (102, 202). The second material (G104) differs from the first material (G102) and a ratio of the densities of the first and second materials (G102, G104) deviates from 1 by less than 20%, preferably by less than 10% or even less than 5%. The optical element and the carrying element each have principal extension planes (H102, H202, H104, H204) having maximum extents. The maximum extent (D102, A202) of the optical element (102, 202) is less than 90%, preferably less than 80% or even less than 75% of the maximum extent (A104, D204) of the carrying element.

Abstract: A mirror, e.g. for a microlithographic projection exposure apparatus, includes an optical effective surface, a mirror substrate, a reflection layer stack for reflecting electromagnetic radiation incident on the optical effective surface, at least one first electrode arrangement, at least one second electrode arrangement, and an actuator layer system situated between the first and the second electrode arrangements. The actuator layer system is arranged between the mirror substrate and the reflection layer stack, has a piezoelectric layer, and reacts to an electrical voltage applied between the first and the second electrode arrangements with a deformation response in a direction perpendicular to the optical effective surface. The deformation response varies locally by at least 20% in PV value for a predefined electrical voltage that is spatially constant across the piezoelectric layer.

Abstract: In the case of a method for producing a temperature-controlling hollow structure in a substrate, first of all a substrate consisting of a substrate material is provided. The substrate is surveyed in order to ascertain where inclusions are in the substrate. Then, a temperature-controlling hollow structure is worked into the substrate by focusing a processing light beam with a beam axis aligned along a standard direction successively onto processing locations at which the temperature-controlling hollow structure is to be produced. As a result, the substrate material is modified or removed at the processing locations. If an inclusion is on the beam axis aligned along the standard direction, the direction of the beam axis relative to the mirror substrate is changed such that the beam axis does not intersect the inclusion.

Abstract: An optical system for a projection exposure apparatus comprises: an obscuration stop, a stop for the numerical aperture or an extraneous light stop, at least portions of which are arranged in a beam path of the optical system to shade at least portions of the beam path; a heating device for introducing heat into the stop, the stop being deformable from an initial geometry into a design geometry with the aid of the introduction of the heat; and a temperature sensor, a photo element and/or an infrared camera.

Abstract: Methods for characterizing the surface shapes of optical elements include the following steps: carrying out, in an interferometric test arrangement, at least a first interferogram measurement on the optical element by superimposing a test wave, which has been generated by diffraction of electromagnetic radiation on a diffractive element and has been reflected at the optical element, carrying out at least one additional interferogram measurement on in each case one calibrating mirror for determining calibration corrections, and determining the deviation from the target shape of the optical element based on the first interferogram measurement carried out on the optical element and the determined calibration corrections. At least two interferogram measurements are carried out for the at least one calibrating mirror, which differ from one another with regard to the polarization state of the electromagnetic radiation.

Abstract: A projection exposure method for exposing a radiation-sensitive substrate with at least one image of a pattern of a mask is provided in which an illumination field of the mask is illuminated by illumination radiation with an operating wavelength ? that was provided by an illumination system.

Abstract: A measuring system (MS) configured to measure a projection radiation property representing an aberration level at a plurality of spaced apart measuring points distributed in the image field; and an operating control system with at least one manipulator operatively connected to an optical element of a projection exposure system to modify imaging properties of the projection exposure system based on measurement results generated by the measuring system. In a measuring point distribution calculation (MPDC), a measuring point distribution defining a number and positions of measuring points is used. The MPDC is performed under boundary conditions representing at least: (i) manipulation capacities of the operating control system; (ii) measuring capacities of the measuring system; and (iii) predefined use case scenarios defining a set of representative use cases. Each use case corresponds to a specific aberration pattern generated by the projection exposure system under a predefined set of use conditions.

Abstract: A microlithographic projection exposure mirror has a mirror substrate (12, 32), a reflection layer system (21, 41) for reflecting electromagnetic radiation that is incident on the mirror's optical effective surface, and at least one piezoelectric layer (16, 36), which is arranged between the mirror substrate and the reflection layer system and to which an electric field for producing a locally variable deformation is applied by a first electrode arrangement situated on the side of the piezoelectric layer facing the reflection layer system, and by a second electrode arrangement situated on the side of the piezoelectric layer facing the mirror substrate. One of the electrode arrangements is assigned a mediator layer (17, 37, 51, 52, 53, 71) for setting an at least regionally continuous profile of the electrical potential along the respective electrode arrangement. The mediator layer has at least two mutually electrically insulated regions (17a, 17b, 17c, . . . ; 37a, 37b, 37c, . . . ).

Abstract: An optical system, for example in a microlithographic projection exposure apparatus, comprises a mirror and a temperature-regulating device. The mirror has an optical effective surface and a mirror substrate. A plurality of temperature-regulating zones are arranged in the mirror substrate. The temperature-regulating device is used to adjust the temperatures present in each of the temperature-regulating zones independently of one another. The temperature-regulating zones are arranged in at least two planes at different distances from the optical effective surface. The temperature-regulating zones in the at least two planes are configured as cooling channels through which, independently of one another, a cooling fluid at a variably adjustable cooling fluid temperature is able to flow. A method for operating such an optical system is provided.

Abstract: A mirror, such as for a microlithographic projection exposure apparatus, comprises an optical effective surface. The mirror comprises a mirror substrate and a plurality of cavities in the mirror substrate. Fluid can be applied to each cavity. A deformation is transferable to the optical effective surface by varying the fluid pressure in the cavities. Related optical systems methods are provided.

Abstract: An optical assembly of a microlithography imaging device comprises a holding device for holding an optical element. The holding device has a holding element having first and second interface sections. The first interface section for a first interface connecting the holding element and the optical element in an installed state. The second interface section forms a second interface connecting the holding element and a support unit in the installed state. The support unit connects the optical element to a support structure to support the optical element on the support structure via a supporting force. The holding device comprises an actuator device engaging on the holding element between the first and second interfaces. The actuator device acts on the holding element via a controller so that a specifiable interface deformation and/or a specifiable interface force distribution acting on the optical element is set on the first interface.

Abstract: Disclosed are an optical system, in particular for microlithography, and a method for operating an optical system. According to one disclosed aspect, the optical system includes at least one mirror (100, 500, 600) having an optical effective surface (101, 501, 601) and a mirror substrate (110, 510, 610), wherein at least one cooling channel (115, 515, 615) in which a cooling fluid is configured to flow is arranged in the mirror substrate, for dissipating heat that is generated in the mirror substrate due to absorption of electromagnetic radiation incident from a light source on the optical effective surface, and a unit (135, 535, 635) to adjust the temperature and/or the flow rate of the cooling fluid either dependent on a measured quantity that characterizes the thermal load in the mirror substrate or dependent on an estimated/expected thermal load in the mirror substrate for a given power of the light source.

Abstract: A projection exposure apparatus comprises a projection objective, and the projection objective comprises an optical device, wherein the optical device comprises an optical element having an optically effective surface and an electrostrictive actuator. The electrostrictive actuator is deformable by a control voltage being applied. The electrostrictive actuator is functionally connected to the optical element to influence the surface shape of the optically effective surface. A control device supplies the electrostrictive actuator with the control voltage. A measuring device is configured, at least at times while the electrostrictive actuator influences the optically effective surface of the optical element, to measure directly and/or to determine indirectly the temperature and/or a temperature change of the electrostrictive actuator and/or the surroundings thereof to take account of a temperature-dependent influence during driving of the electrostrictive actuator by the control device.

Abstract: A mirror, e.g. for a microlithographic projection exposure apparatus, includes an optical effective surface, a mirror substrate, a reflection layer stack for reflecting electromagnetic radiation incident on the optical effective surface, at least one first electrode arrangement, at least one second electrode arrangement, and an actuator layer system situated between the first and the second electrode arrangements. The actuator layer system is arranged between the mirror substrate and the reflection layer stack, has a piezoelectric layer, and reacts to an electrical voltage applied between the first and the second electrode arrangements with a deformation response in a direction perpendicular to the optical effective surface. The deformation response varies locally by at least 20% in PV value for a predefined electrical voltage that is spatially constant across the piezoelectric layer.

Abstract: A facet assembly is a constituent part of a facet mirror for an illumination optical unit for projection lithography. The facet assembly has a facet with a reflection surface for reflecting illumination light. A facet main body of the facet assembly has at least one hollow chamber. A reflection surface chamber wall of the hollow chamber forms at least one portion of the reflection surface. An actuator control apparatus of the facet assembly is operatively connected to the hollow chamber for the controlled deformation of the reflection surface chamber wall. The result is a facet assembly that is usable flexibly as a constituent part of a facet mirror equipped therewith within an illumination optical unit for projection lithography.

Abstract: A projection exposure apparatus for semiconductor lithography includes a mirror and a temperature-regulating device for regulating temperature on the basis of radiation. The mirror includes at least one cutout. The temperature-regulating device includes a temperature-regulating body arranged without contact in the cutout of the mirror. The temperature-regulating body has a cavity. A fluid for temperature regulation of the temperature-regulating body is present in the cavity.

Abstract: A projection exposure apparatus for semiconductor lithography includes an optical correction element and an electromagnetic heating radiation source for at least partly irradiating an optically active region of the correction element with electromagnetic heating radiation. The optical correction element is provided with at least one electrical heating element outside the optically active region.

Abstract: An arrangement of a microlithographic optical imaging device includes first and second supporting structures. The first supporting structure supports at least one optical element of the imaging device via an active relative situation control device of a control device. The first supporting structure supports the second supporting structure via supporting spring devices of a vibration decoupling device. The supporting spring devices act kinematically parallel to one another. Each supporting spring device defines a supporting force direction and a supporting length along the supporting force direction. The second supporting structure supports a measuring device of the control device. The measuring device is connected to the relative situation control device. The measuring device outputs to the relative situation control device measurement information representative for the position and/or the orientation of the at least one optical element in relation to a reference in at least one degree of freedom in space.