Abstract: The invention relates to an integrated circuit module (3) comprising a carrier substrate (4) with terminals for electrically contacting the carrier substrate (4) and a motherboard (2) and comprising at least one semiconductor chip (9) that is electrically contacted to the carrier substrate (4) and integrated into the substrate (4). The carrier substrate (4) comprises at least one cavity (8) that adjoins a mounting surface (10) for the motherboard (2) and holds at least one semiconductor chip (9). The cavity (8) is equipped with connection contacts (11a, 11b) for assigned connections of the semiconductor chip or chips (9), said contacts electrically contacting the semiconductor chip (9) and the carrier substrate (4). The carrier substrate (4) is multi-layered and comprises conductor tracks that extend transversally through several layers and the cavity (8) is hermetically sealed by a thermally conductive cover (12).

Abstract: A coupler includes a first set of ports coupled to a first ring, a second set of ports coupled to a second ring, and a plurality of connecting elements coupled between the first and second rings. The coupler provides low loss insertion and high port isolation and may be used as a standalone coupler or as an elementary device for building Butler matrices of varying configurations.

Abstract: An apparatus is disclosed that substantially reduces or eliminates the resonance that occurs in vias that connect the layers of a printed circuit board by electrically coupling a first transmission line in a circuit board to a second transmission line in a circuit board by two electrical paths having substantially the same electrical length. The two electrical paths are created by connecting the first transmission line to a first via which is in turn connected to a second via having a second transmission line with a plurality of connecting electrical paths between the two vias. In one illustrative embodiment, electrical traces are used to connect the top of the first via to the top of the second via and the bottom of the first via to the bottom of the second via.

Abstract: A modulation method, transmission method, and transmitter circuit are described which may enable realization of a wireless link for ultra-high transmission rates in the downlink to users. In a method of modulating an input signal to obtain a desired intermediate signal, the intermediate signal is to be processed for transmission over a wireless link at a carrier frequency within a desired frequency band. The processing may include subjecting the intermediate signal to a frequency multiplier operation that exhibits an ambiguous transfer function. In the modulation method, an input signal is provided, and a set of signal states applicable to the desired intermediate signal are generated so that a signal output from the frequency multiplier operation has a substantially non-ambiguous relation to the desired intermediate signal. The input signal may thus be modulated according to I and Q baseband signals to obtain the desired intermediate signal with the generated set of signal states.

Abstract: A coupler includes a first set of ports coupled to a first ring, a second set of ports coupled to a second ring, and a plurality of connecting elements coupled between the first and second rings. The coupler provides low loss insertion and high port isolation and may be used as a standalone coupler or as an elementary device for building Butler matrices of varying configurations.

Abstract: An apparatus is disclosed that substantially reduces or eliminates the resonance that occurs in vias that connect the layers of a printed circuit board by electrically coupling a first transmission line in a circuit board to a second transmission line in a circuit board by two electrical paths having substantially the same electrical length. The two electrical paths are created by connecting the first transmission line to a first via which is in turn connected to a second via having a second transmission line with a plurality of connecting electrical paths between the two vias. In one illustrative embodiment, electrical traces are used to connect the top of the first via to the top of the second via and the bottom of the first via to the bottom of the second via.