Abstract: In an embodiment a sensor includes a ceramic substrate and two metallization layers deposited on opposite surfaces of the ceramic substrate, wherein each of the two metallization layers includes an adhesive layer deposited directly on the ceramic substrate, and wherein each of the two metallization layers comprises a gold layer deposited on a respective adhesive layer.

Abstract: In an embodiment a sensor arrangement includes a sensor element including a ceramic base body and at least two electrodes, wherein the electrodes are arranged on an outer side of the ceramic base body, at least two contacting elements configured for making electrical contact with the sensor element, the contacting elements being connected to the electrodes in a connection region and a glass sheath, wherein at least the ceramic base body and the connection region are completely enclosed in the glass sheath, wherein the glass sheath is pressure tensioned, and wherein a coefficients of expansion of the glass sheath, the contacting elements and the sensor element are adapted to one another for the pressure tensioning of the glass sheath.

Abstract: A semiconductor ceramic composition may include, as a main component, a BaTiO3-based compound according to the formula [BabCacSrsPbpRx][TitAaMnm]O3+z. R may represent at least one element selected from a group consisting of Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, and Yb. A may represent at least one element selected from a group consisting of V, Nb, and Ta. The variables b, c, s, p, x, t, a, m, and z may be defined as: b=1?c?s?p?x; 0<c+s+p<0.51; 0.490<b<0.999; 0.0<c<0.5; 0.0<s<0.5; 0.05<p<0.5; 0.001<x<0.01; 1.0001<(t+a+m)<1.011575; 0.9889<t<1.000375; 0.00010<a<0.0012; 0.0001<m<0.01; and 0.0001<z<0.01.

Abstract: In an embodiment a sensor arrangement includes a sensor element including a ceramic base body and at least two electrodes, wherein the electrodes are arranged on an outer side of the ceramic base body, at least two contacting elements configured for making electrical contact with the sensor element, the contacting elements being connected to the electrodes in a connection region and a glass sheath, wherein at least the ceramic base body and the connection region are completely enclosed in the glass sheath, wherein the glass sheath is pressure tensioned, and wherein a coefficients of expansion of the glass sheath, the contacting elements and the sensor element are adapted to one another for the pressure tensioning of the glass sheath.