Abstract: An end effector for a pod loader interface includes a gripper plate that attaches to the articulated arm. A pair of gripper blades are separated from each other along and are coupled to the gripper plate. During gripping of a wafer carrier, the gripper blades initially close toward each other and then draw nearer to the gripper plate. Nested outer and inner U-shaped yokes, which may attach the gripper plate to the articulated arm, are joined by rotational joints to permit their relative rotation for reorienting the wafer carrier. Yet other aspect of the present invention are a mechanical forearm drive that provides substantially linear motion of an articulated arm's wrist joint, and an end effector rotary-drive included in a forearm of the articulated arm.

Abstract: A three DOF SCARA arm, adapted for transporting semiconductor wafers, includes an end-effector assembly at a distal joint of the arm. In one configuration, the end-effector turns a workpiece over. The arm includes a support column having an open column assembly that projects above a base. Within the assembly, a Z-axis drive energizes extension and retraction of a hollow tube carried by the support column. A shaft, rotatable about the Z-axis and having a distal end furthest from the support column's base, receives an arm assembly. An arm-assembly rotary-drive energizes the shaft's rotation. An arm base-plate, secured to the shaft's distal end, supports the arm assembly therefrom. The arm base-plate carries a wrist joint that is displaced from the Z-axis, and receives the end-effector whose rotation about a wrist-joint axis is energized by an end-effector rotary-drive.

Abstract: A three DOF SCARA arm, adapted for transporting semiconductor wafers, includes an end-effector assembly at a distal joint of the arm. In one configuration, the end-effector turns a workpiece over. The arm includes a support column having an open column assembly that projects above a base. Within the assembly, a Z-axis drive energizes extension and retraction of a hollow tube carried by the support column. A shaft, rotatable about the Z-axis and having a distal end furthest from the support column's base, receives an arm assembly. An arm-assembly rotary-drive energizes the shaft's rotation. An arm base-plate, secured to the shaft's distal end, supports the arm assembly therefrom. The arm base-plate carries a wrist joint that is displaced from the Z-axis, and receives the end-effector whose rotation about a wrist-joint axis is energized by an end-effector rotary-drive.

Abstract: A load port interface for determining the presence or absence of wafers in a cassette, i.e. a wafer mapper, is integrated with a port closure assembly in a load port interface separating a process environment from an operator environment. A cover plate and a door are arranged in an L-shape, with both members being able to seal the port in a bulkhead of the load port interface. In one configuration, the cover plate seals the port, while door panel members rest horizontally on the operator side of the bulkhead. In this position, a wafer stack, W, inside of a cassette may be placed on the inside door panel, with the top of the wafer stack, W, being open. As the door is raised from the horizontal position to a vertical position, the wafer stack, W, is rotated through an opening in the bulkhead so that the wafer stack, W, is now on the process side. The wafer mapper features a moveable trolley connected to, or within, the door.

Abstract: A method for unloading silicon wafers contained in a cassette from a sealed pod and supplying the wafers to an IC manufacturing process. The method includes receiving a base of the pod onto a loading platform of a pod loader interface and then unlocking the pod cover from the base. While maintaining the wafers in a clean mini-environment, the method raises the pod cover away from the base, contacts the now exposed cassette with an end effector of an articulated arm, secures the cassette to the end effector, and activates the arm to transport the wafers out of mini-environment for supplying the wafers to an IC manufacturing process. Preferably, the method further includes raising the articulated arm to lift the cassette before transferring the wafers to the process. Even more preferred, the method directs a flow of clean air within the mini-environment horizontally past the wafers.

Abstract: The pod loader interface is a machine that is able to automatically open a SMIF pod and unload the contents thereof. An elevator raises the SMIF cover away from its base to reveal the wafer boat contained in the SMIF pod. An articulated arm thereafter reaches through an opening in a bulkhead of the machine, securing the wafer cassette and withdrawing it through the hole in the bulkhead. The wafer cassette is then placed in position to be operated upon by the next step in the manufacturing process. The machine includes an integrated clean air system to provide a clean environment for the wafers.

Abstract: An ionized airflow manifold for static reduction. The manifold may be installed in a stand-alone frame, or attached to any processing machine. The manifold includes a commercially available gas ionizer that provides an ionized air supply, and creates an air curtain around a target area.

Abstract: The present invention is a rotary, 3-stage wafer transfer machine. The transfer machine utilizes a pneumatically powered lift mechanism to raise wafers from a boat to a retaining area. If the next operation for the wafer is a single density operation (twenty-five wafers per boat), the wafers are the simply transferred to another boat for further processing. If the next operation for the wafers requires double density (fifty wafers per boat), a second set of wafers is lifted to the retaining area, where they are interspersed with the first set to create a double density set of fifth wafers. This set is then transferred to the appropriate boat (generally a quartz boat) for further processing. All components that could generate particulate contamination are sealed off from the transfer area. Extra duty materials are used for the components of the machine to provide unique reproducibility and eliminate much of the required maintenance as compared to the prior art.