Abstract: A switched capacitor arrangement for tuning a differential circuit is disclosed. The switched capacitor arrangement comprises a first node, a second node and a third node. The switched capacitor arrangement further comprises a first capacitor (C1) coupled between the first node and the second node, a second capacitor (C2) coupled between the second node and the third node, and a first switch branch comprising a first switch (S 1) coupled between the second node and a signal ground node. The first switch (S 1) has an on state and an off state. The first node and third node are configured to be connected to respective differential nodes (Vtank, ?Vtank) of the differential circuit. The switched capacitor arrangement is configured to tune the differential circuit by controlling the state of the first switch.

Abstract: The technology disclosed relates to methods and systems that can be used to reduce visible artifacts know as mura. In particular, it relates to producing alignment marks by physically modifying appearance of a layer of exposure or radiation sensitive material on a workpiece, then using those alignment marks or transferred direct or inverted images of those marks to realign a writing coordinate system between exposure writing passes, following physical movement of the workpiece within the writing system. The physical modifications described include mechanically pressing a mark into the layer, using a laser to ash or ablate the layer, or applying an ink or other substance to the surface of the laser.

Abstract: The technology disclosed relates to methods and devices that compensate for displacements in a pattern or deformations of a workpiece. In particular, this relates to using timing to compensate for displacements along a first axis along the scanning direction while using resampling, interpolation or a similar method to compensate for displacements along a second axis that is substantially orthogonal to the first axis. The scanning direction may be an actual direction of movement of the scanning head or it may be a direction perpendicular to an orientation of an image projected onto a workpiece.

Abstract: The problem of mura in large area photomasks is solved or at least reduced by setting up a writing system to write a pattern with high accuracy and with the optical axes essentially parallel to the movement axes of the stage, then writing photomasks in two passes with the substrate rotated to different angles on the stage. The angle between the orientation of the first and second pass is larger than about 10 degrees, larger than about 20 degrees or larger than about 35 degrees and it can be approximately 10 degrees, approximately 50 degrees, approximately 60 degrees or approximately 90 degrees. The substrate is physically rotated on the stage and aligned with high accuracy after the rotation and the data driving the first and second exposure passes are derived from the first input data specification but processed according to the known oblique angles, so that the second pass is accurately overlaid on the first pass.

Abstract: The technology disclosed relates to improved acousto-optic deflectors (AODs). In particular, it relates to compensation for subtle effects not previously addressed by AOD designers. A shifting center of gravity is described and addressed using advanced power equalization strategies. Denser writing brushes are provided by using a two-dimensional array of beams with corrections for factors such as angle of incidence at the AOD interface.

Abstract: The technology disclosed relates to improved acousto-optic deflectors (AODs). In particular, it relates to compensation for subtle effects not previously addressed by AOD designers. A shifting center of gravity is described and addressed using advanced power equalisation strategies. Denser writing brushes are provided by using a two-dimensional array of beams with corrections for factors such as angle of incidence at the AOD interface. The compensation and dense brush features can be used separately or in combination.

Abstract: The present invention relates to a reconfigurable micro-mechanical light modulator including a two-dimensional array of modulating elements with redundant rows of modulating elements. In particular, it relates to extending the life of the modulator by shifting the set of elements used, without physically replacing the micro-mechanical light modulator. The modulating elements are adapted to modulate light impinging on the micro-mechanical light modulator. The array of modulating elements comprises a first and a second set of modulating elements. The second set is a redundant set of modulating elements that can be selected to substitute for the first set of modulating elements in modulating light impinging on the micro-mechanical light modulator, without physically replacing the micro-mechanical light modulator. Devices and methods are described.

Abstract: The technology disclosed relates to methods and systems that can be used to reduce visible artifacts know as mura. In particular, it relates to producing alignment marks by physically modifying appearance of a layer of exposure or radiation sensitive material on a workpiece, then using those alignment marks or transferred direct or inverted images of those marks to realign a writing coordinate system between exposure writing passes, following physical movement of the workpiece within the writing system. The physical modifications described include mechanically pressing a mark into the layer, using a laser to ash or ablate the layer, or applying an ink or other substance to the surface of the laser.

Abstract: The problem of mura in large area photomasks is solved or at least reduced by setting up a writing system to write a pattern with high accuracy and with the optical axes essentially parallel to the movement axes of the stage, then writing photomasks in two passes with the substrate rotated to different angles on the stage. The angle between the orientation of the first and second pass is larger than about 10 degrees, larger than about 20 degrees or larger than about 35 degrees and it can be approximately 10 degrees, approximately 50 degrees, approximately 60 degrees or approximately 90 degrees. The substrate is physically rotated on the stage and aligned with high accuracy after the rotation and the data driving the first and second exposure passes are derived from the first input data specification but processed according to the known oblique angles, so that the second pass is accurately overlaid on the first pass.

Abstract: Patterns are written on workpieces, such as, glass sheets and/or plastic sheets used in, for example, electronic display devices such as LCDs. The workpiece may be larger than about 1500 mm may be used. An optical writing head with a plurality of writing units may be used. The workpiece and the writing head may be moved relative to one another to provide oblique writing.

Abstract: This invention relates to an improved micro lithographic writer that sweeps a modulated pattern across the surface of a workpiece. The SLM disclosed works in a diffractive mode with a continuous or quasi-continuous radiation source. It uses a long and narrow SLM and takes advantage of diffractive effects along the narrow axis of the SLM to improve writing characteristics along that axis.

Abstract: In general, one aspect of the technology described can be embodied in methods that include the action of applying a writing mechanism having non-isotropic writing properties resulting from different degrees of coherence interaction in a sweep direction and a cross-sweep direction, writing an image pattern twice on a work piece using the writing mechanism rotated relative to the image pattern written on the workpiece between first and second writings, whereby writing with the rotated writing mechanism averages the non-isotropic properties. The lesser included angle separating first and second relative directions of movement between a workpiece and writing mechanism may be 20 degrees or greater, or somewhat less, under conditions described herein.

Abstract: The present invention relates to laser ablation microlithography. In particular, we disclose a new SLM design and patterning method that uses multiple mirrors per pixel to concentrate energy to an energy density that facilitates laser ablation, while keeping the energy density on the SLM mirror surface at a level that does not damage the mirrors. Multiple micro-mirrors can be reset at a very high frequency, far beyond current DMD devices.

Abstract: The technology disclosed relates to methods and devices that compensate for displacements in a pattern or deformations of a workpiece. In particular, this relates to using timing to compensate for displacements along a first axis along the scanning direction while using resampling, interpolation or a similar method to compensate for displacements along a second axis that is substantially orthogonal to the first axis. The scanning direction may be an actual direction of movement of the scanning head or it may be a direction perpendicular to an orientation of an image projected onto a workpiece.

Abstract: The technology disclosed relates to translating between a Cartesian grid and a curved scanning path that produces varying exposure doses as the scanning head traces the curved scanning path. It can be applied to writing to or reading from a workpiece. In particular, we teach use of varying exposure dose that compensates for the time it takes for the curved scan path to transit a straight axis. This simplifies either modulation of a modulator, from which data is projected onto the workpiece, or analysis of data collected by a detector, onto which partial images of the workpiece are projected.

Abstract: The present invention describes a micro-mechanical light modulator including a two-dimensional array of modulating elements, in which small modulating elements are organized into larger modulating areas. Using smaller elements organized into larger areas increases the resonant frequency of the modulators and the modulation speed. In some implementations, multiple modulating elements are driven by shared signals, allowing the number of elements driven and the resulting area to increase without increasing the data traffic. In some implementations, an anamorphic optical path is used that leaves individual modulating elements of the micro-mechanical light modulator that are operated as a single area unresolved at an image plane of the workpiece being patterned. Devices and methods are described.

Abstract: The technology disclosed relates to handling varying pixel overlaps long a first axis as a scanning head sweeps a curved path that is not parallel to the first axis. In particular, we teach use of a variable frequency pixel clock to produce equally spaced pixels along the first axis as a rotor arm scans a curved path that is not parallel to the first axis. The pixel clock has a varying frequency that varies approximately sinusoidally with the position of the scanning head relative to the first axis.

Abstract: The present invention relates to laser ablation microlithography. In particular, we disclose a new SLM design and patterning method that uses multiple mirrors per pixel to concentrate energy to an energy density that facilitates laser ablation, while keeping the energy density on the SLM mirror surface at a level that does not damage the mirrors. Multiple micro-mirrors can be reset at a very high frequency, far beyond current DMD devices.

Abstract: This disclosure relates to lithography using pulsed laser illumination. In particular it relates to lithography for producing electronic devices on wafers using multi-mode excimer and molecular lasers, e.g. KrF, ArF, and F2 lasers. It may also apply to illumination systems where several single-mode sources are mixed or one single-mode laser beam is split and recombined with time delays, thereby creating an equivalent multimode source and to EUV lithography. Particular aspects of the present invention are described in the claims, specification and drawings.

Abstract: The technology disclosed relates to scanning of large flat substrates for reading and writing images. Examples are flat panel displays, PCB's and photovoltaic panels. Reading and writing is to be understood in a broad sense: reading may mean microscopy, inspection, metrology, spectroscopy, interferometry, scatterometry, etc. of a large workpiece, and writing may mean exposing a photoresist, annealing by optical heating, ablating, or creating any other change to the surface by an optical beam. In particular, we disclose a technology that uses a rotating or swinging arm that describes an arc across a workpiece as it scans, instead of following a traditional straight-line motion.