Abstract: The present invention relates to an arrangement for non-destructive inspection of joint layer(s) in a multilayer structure (40) comprising at least a first layer (1) with a first outer surface, a second layer (2) with a second outer surface and a joint layer (3) for joining said first and second layers. It comprises a heating arrangement (10) for homogeneously heating up said second outer surface of the multilayer structure (40), a detecting arrangement (20) comprising a thermographic imaging system for registering the infrared radiation pattern representative of the temperature distribution on said first outer surface of the multilayer structure (40) and processing means (30) for, based on the temperature distribution, establishing at least the eventual presence of (a) cavity/cavities in the joint layer (3).

Abstract: The present invention relates to a field that includes methods and arrangements pertaining to chip carriers. The invention addresses mainly the problem of mounting microchips (3) to chip carriers (1) so as to avoid an earth fault between chip (3) and carrier (1). When mounting chips in accordance with the invention, the chip (13) is placed on a chip carrier (1) that includes an electrically and thermally conductive element (13), said element including a surface (17) and a recess (15) arranged relative to said surface. The microwave chip (3) is arranged at the surface (17) of the electrically and thermally conductive element (13) by means of a fixing or bonding substance (19), which is disposed at least partially in the recess (15). When mounting the chip, the chip (3) is positioned so that an earth plane (3d) of the microwave chip (3) will lie level with the surface (17) of the electrically and thermally conductive element (13).