Abstract: A continuous machine (100) for coating substrates (103) comprises a process module (130) and a vacuum lock (110, 150) for introducing the substrates (103) or removing the substrates (103). The vacuum lock (110, 150) comprises a chamber for receiving a substrate carrier (102) with a plurality of substrates (103) and a flow channel arrangement for evacuating and venting the chamber. The flow channel arrangement comprises a first channel for evacuating and venting the chamber and a second channel for evacuating and venting the chamber, wherein the first channel and the second channel are arranged at opposing sides of the chamber.

Abstract: A method for coating a substrate with an AlOx layer, in particular an Al2O3 layer, comprising the following method steps: (a) providing an inductively coupled plasma source (ICP source) having a reaction chamber and at least one RF inductor, (b) introducing an aluminium compound, preferably trimethylaluminium (TMA) into the ICP source, (c) introducing oxygen and/or an oxygen compound as reactive gas into the ICP source and inductively coupling of energy into the ICP source for forming a plasma, and (d) depositing the AlOx layer on the substrate. The invention also relates to a coating assembly for depositing thin layers on a substrate, in particular for carrying out the above method. The coating assembly comprises an inductively coupled plasma source (ICP) having a reaction chamber and at least one RF inductor, a substrate holder for arranging the substrate in the reaction chamber and channels for introducing the aluminium compound and a reactive gas in the ICP source.