Patents by Inventor Torsten Leichsenring

Torsten Leichsenring has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser machining system
    Patent number: 11878368
    Abstract: A laser processing system includes a laser beam source that produces a raw laser beam; a beam expansion system that receives the raw laser beam and produces an expanded laser beam; a homogenization system that receives the expanded laser beam and produces a laser beam that is homogenized and has a line-shaped beam cross section in the processing plane, wherein the homogenization system includes a first homogenization arrangement that homogenizes along the short axis and a second homogenization arrangement for homogenization along the long axis, each of the homogenization arrangements includes optical elements that split the laser beam into a multiplicity of partial beams and a condenser system that superposes the partial beams in a superposition plane, and the first homogenization arrangement includes a first condenser system with at least one first mirror and the second homogenization arrangement includes a second condenser system with at least one second mirror.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: January 23, 2024
    Assignee: 3D-Micromac AG
    Inventors: Sven Albert, Torsten Leichsenring, Thomas Schmidt, Uwe Wagner
  • Laser machining system
    Patent number: 11833610
    Abstract: A laser processing system includes a laser beam source that produces a raw laser beam; a beam expansion system that receives the raw laser beam and produces an expanded laser beam; a homogenization system that receives the expanded laser beam and produces a laser beam that is homogenized and has a line-shaped beam cross section in the processing plane, wherein the homogenization system includes a first homogenization arrangement that homogenizes along the short axis and a second homogenization arrangement for homogenization along the long axis, each of the homogenization arrangements includes optical elements that split the laser beam into a multiplicity of partial beams and a condenser system that superposes the partial beams in a superposition plane, and the first homogenization arrangement includes a first condenser system with at least one first mirror and the second homogenization arrangement includes a second condenser system with at least one second mirror.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: December 5, 2023
    Assignee: 3D-Micromac AG
    Inventors: Sven Albert, Torsten Leichsenring, Thomas Schmidt, Uwe Wagner
  • LASER MACHINING SYSTEM
    Publication number: 20210402515
    Abstract: A laser processing system includes a laser beam source that produces a raw laser beam; a beam expansion system that receives the raw laser beam and produces an expanded laser beam; a homogenization system that receives the expanded laser beam and produces a laser beam that is homogenized and has a line-shaped beam cross section in the processing plane, wherein the homogenization system includes a first homogenization arrangement that homogenizes along the short axis and a second homogenization arrangement for homogenization along the long axis, each of the homogenization arrangements includes optical elements that split the laser beam into a multiplicity of partial beams and a condenser system that superposes the partial beams in a superposition plane, and the first homogenization arrangement includes a first condenser system with at least one first mirror and the second homogenization arrangement includes a second condenser system with at least one second mirror.
    Type: Application
    Filed: September 20, 2019
    Publication date: December 30, 2021
    Inventors: Sven Albert, Torsten Leichsenring, Thomas Schmidt, Uwe Wagner