Patents by Inventor Torsten Maehr

Torsten Maehr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods including a processing of wafers and spin coating tool
    Patent number: 9653367
    Abstract: A method includes performing a spin coating process. In the spin coating process, a first fluid is dispensed to a surface of a wafer. The method further includes performing an inspection of an edge area of the wafer. On the basis of the inspection of the edge area of the wafer, a defect analysis is performed. In the defect analysis, it is determined if the edge area of the wafer has a defect that is indicative of an insufficient coating of the surface of the wafer by the first fluid.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: May 16, 2017
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Torsten Maehr, Martin Freitag, Arthur Hotzel
  • METHODS INCLUDING A PROCESSING OF WAFERS AND SPIN COATING TOOL
    Publication number: 20160379900
    Abstract: A method includes performing a spin coating process. In the spin coating process, a first fluid is dispensed to a surface of a wafer. The method further includes performing an inspection of an edge area of the wafer. On the basis of the inspection of the edge area of the wafer, a defect analysis is performed. In the defect analysis, it is determined if the edge area of the wafer has a defect that is indicative of an insufficient coating of the surface of the wafer by the first fluid.
    Type: Application
    Filed: June 29, 2015
    Publication date: December 29, 2016
    Inventors: Torsten Maehr, Martin Freitag, Arthur Hotzel
  • Mask with registration marks and method of fabricating integrated circuits
    Patent number: 7939224
    Abstract: A photomask for a lithography apparatus includes a chip pattern configured to be transferred into a resist layer on a workpiece and at least one registration mark that is configured not to be transferred into the resist layer. Mask qualification may be improved without impacting wafer level processes.
    Type: Grant
    Filed: September 14, 2007
    Date of Patent: May 10, 2011
    Assignee: Qimonda AG
    Inventors: Andreas Jahnke, Ralf Ziebold, Torsten Maehr
  • Mask with Registration Marks and Method of Fabricating Integrated Circuits
    Publication number: 20090075178
    Abstract: A photomask for a lithography apparatus includes a chip pattern configured to be transferred into a resist layer on a workpiece and at least one registration mark that is configured not to be transferred into the resist layer. Mask qualification may be improved without impacting wafer level processes.
    Type: Application
    Filed: September 14, 2007
    Publication date: March 19, 2009
    Applicant: QIMONDA AG
    Inventors: Andreas Jahnke, Ralf Ziebold, Torsten Maehr