Abstract: A method of manufacturing a housing and a housing for an inductive sensor having at least one sleeve-like housing part and at least one beaker-like end cap for a sensor element, wherein the beaker-like end cap, wherein the end cap is composed of plastic, wherein the end cap is arranged in the sleeve-like housing part, wherein the end cap has a peripheral annular pressing surface that has an excess size with respect to an inner diameter of the housing part along an outer diameter of the sleeve-like section so that a press fit is formed between the sleeve like housing part and the end cap, and wherein a jacket-like outer surface of the sleeve-like section of the end cap does not have a step that projects beyond the inner diameter of the sleeve-like housing part.

Abstract: A method of manufacturing a housing and a housing for an inductive sensor having at least one sleeve-like housing part and at least one beaker-like end cap for a sensor element, wherein the beaker-like end cap, wherein the end cap is composed of plastic, wherein the end cap is arranged in the sleeve-like housing part, wherein the end cap has a peripheral annular pressing surface that has an excess size with respect to an inner diameter of the housing part along an outer diameter of the sleeve-like section so that a press fit is formed between the sleeve like housing part and the end cap, and wherein a jacket-like outer surface of the sleeve-like section of the end cap does not have a step that projects beyond the inner diameter of the sleeve-like housing part.

Abstract: To enable fine adjustment of a sensor in a mounting device, a mounting device is provided for holding the sensor in an operating position. The mounting device comprises a base body having a first through-hole, a holding member having a second through-hole. The sensor is held in these through-holes by displacement of the holding member versus the base body and shifting the through-holes out of alignment. The holding member comprises an adjustment element, in particular a thread, which engages with an outer surface of the sensor in such a way that, when the sensor is rotated about a sensor central axis, the adjustment element causes the sensor to move along the central axis.

Abstract: To enable fine adjustment of a sensor in a mounting device, a mounting device is provided for holding the sensor in an operating position. The mounting device comprises a base body having a first through-hole, a holding member having a second through-hole. The sensor is held in these through-holes by displacement of the holding member versus the base body and shifting the through-holes out of alignment. The holding member comprises an adjustment element, in particular a thread, which engages with an outer surface of the sensor in such a way that, when the sensor is rotated about a sensor central axis, the adjustment element causes the sensor to move along the central axis.

Abstract: A sensing system having at least one magnetic or inductive sensor for determining the position of a piston. The sensor system has a positioning device with which at least two sensing positions for the sensing system can be set and adjusted.

Abstract: A sensor with a carrier board which is arranged in a housing is at least partly produced by an injection molding process and fitted with electronic, optical, electromechanical and/or opto-electronic components. A region of the carrier board and at least some of the components disposed thereon are arranged in a hollow space formed inside the at least partly injection molded housing.

Abstract: A sensing system having at least one magnetic or inductive sensor for determining the position of a piston. The sensor system has a positioning device with which at least two sensing positions for the sensing system can be set and adjusted.

Abstract: An arrangement for axially variably mounting a magnetic field sensor in a guide groove arranged on the exterior of an operating cylinder in which a piston reciprocates. The groove is longitudinally slitted and the sensor has a generally elliptical cross-section which is dimensioned so that the sensor can be inserted into the groove through the slit. By turning the sensor about its longitudinal axis, it becomes restrained to the groove while permitting sliding movement of the sensor over the length of the groove. A screw with an oval head is threaded into the sensor, is disposed inside the groove, and upon turning it the head of the groove engages interior shoulders extending along both sides of the slit. By turning the screw so that the head engages the shoulder, the sensor becomes clamped and thereby fixedly positioned at the desired location along the groove.

Abstract: A sensor with a carrier board which is arranged in a housing is at least partly produced by an injection molding process and fitted with electronic, optical electromechanical and/or opto-electronic components. A region of the carrier board and at least some of the components disposed thereon are arranged in a hollow space formed inside the at least partly injection molded housing.

Abstract: An arrangement for axially variably mounting a magnetic field sensor in a guide groove arranged on the exterior of an operating cylinder in which a piston reciprocates. The groove is longitudinally slitted and the sensor has a generally elliptical cross-section which is dimensioned so that the sensor can be inserted into the groove through the slit. By turning the sensor about its longitudinal axis, it becomes restrained to the groove while permitting sliding movement of the sensor over the length of the groove. A screw with an oval head is threaded into the sensor, is disposed inside the groove, and upon turning it the head of the groove engages interior shoulders extending along both sides of the slit. By turning the screw so that the head engages the shoulder, the sensor becomes clamped and thereby fixedly positioned at the desired location along the groove.

Abstract: The invention relates to a sensor with a carrier board which is arranged in a housing produced at least partly in an injection molding process and which is fitted with electronic, optical, electromechanical and/or opto-electronic components, wherein a region of the carrier board and at least some of the components disposed thereon are arranged in a hollow space formed inside the at least partly injection molded housing.