Patents by Inventor Torsten NOWAK

Torsten NOWAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Analyzing web pages to facilitate automatic navigation
    Patent number: 11971936
    Abstract: Implementations are described herein for analyzing existing interactive web sites to facilitate automatic engagement with those web sites, e.g., by automated assistants or via other user interfaces, with minimal effort from the hosts of those websites. For example, in various implementations, techniques described herein may be used to extract, validate, maintain, generalize, extend and/or distribute individual actions and “traces” of actions that are useable to navigate through various interactive websites. Additionally, techniques are described herein for leveraging these actions and/or traces to automate aspects of interaction with a third party website.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: April 30, 2024
    Assignee: GOOGLE LLC
    Inventors: Gökhan Bakir, Andre Elisseeff, Torsten Marek, João Paulo Pagaime da Silva, Mathias Carlen, Dana Ritter, Lukasz Suder, Ernest Galbrun, Matthew Stokes, Marcin Nowak-Przygodzki, Mugurel-Ionut Andreica, Marius Dumitran
  • Method for determining a bonding connection in a component arrangement and test apparatus
    Patent number: 9793179
    Abstract: The application relates to a method for determining a bonding connection (1) in a component arrangement (2), wherein the method has the following steps: producing a bonding connection (1) between a bonding section (3) of a bonding wire (4) and a metallic contact point (5), structuring a top-side surface of the bonding wire (4) in the region of the bonding section (3) and determining the bonding connection (1), wherein in this case a test voltage is applied to the bonding wire (4) and the bonding connection (1) so that the bonding connection (1) heats up owing to the current flow, generating a thermogram for the heated bonding connection (1) and determining whether the bonding connection (1) has been produced correctly by evaluating the thermogram. Furthermore, the application relates to a test apparatus for determining a bonding connection (1) in a component arrangement (2).
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: October 17, 2017
    Assignees: Technische Universitat Berlin, Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V.
    Inventors: Andreas Middendorf, Torsten Nowak, Sergei Janzen
  • METHOD FOR DETERMINING A BONDING CONNECTION IN A COMPONENT ARRANGEMENT AND TEST APPARATUS
    Publication number: 20170025316
    Abstract: The application relates to a method for determining a bonding connection (1) in a component arrangement (2), wherein the method has the following steps: producing a bonding connection (1) between a bonding section (3) of a bonding wire (4) and a metallic contact point (5), structuring a top-side surface of the bonding wire (4) in the region of the bonding section (3) and determining the bonding connection (1), wherein in this case a test voltage is applied to the bonding wire (4) and the bonding connection (1) so that the bonding connection (1) heats up owing to the current flow, generating a thermogram for the heated bonding connection (1) and determining whether the bonding connection (1) has been produced correctly by evaluating the thermogram. Furthermore, the application relates to a test apparatus for determining a bonding connection (1) in a component arrangement (2).
    Type: Application
    Filed: March 3, 2015
    Publication date: January 26, 2017
    Inventors: Andreas MIDDENDORF, Torsten NOWAK, Sergei JANZEN