Patents by Inventor Toru Arahata

Toru Arahata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding method, wire bonding apparatus, and wire bonding control program
    Patent number: 8042725
    Abstract: The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed.
    Type: Grant
    Filed: April 22, 2010
    Date of Patent: October 25, 2011
    Assignee: Kaijo Corporation
    Inventors: Toru Arahata, Shinobu Ishii, Hiromi Fujisawa
  • WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTROL PROGRAM
    Publication number: 20100206940
    Abstract: The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed.
    Type: Application
    Filed: April 22, 2010
    Publication date: August 19, 2010
    Applicant: KAIJO CORPORATION
    Inventors: Toru Arahata, Shinobu Ishii, Hiromi Fujisawa
  • Wire bonding method, wire bonding apparatus, and wire bonding control program
    Patent number: 7748599
    Abstract: The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed.
    Type: Grant
    Filed: November 3, 2008
    Date of Patent: July 6, 2010
    Assignee: Kaijo Corporation
    Inventors: Toru Arahata, Shinobu Ishii, Hiromi Fujisawa
  • WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTROL PROGRAM
    Publication number: 20100059574
    Abstract: The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed.
    Type: Application
    Filed: November 3, 2008
    Publication date: March 11, 2010
    Applicant: KAIJO CORPORATION
    Inventors: Toru ARAHATA, Shinobu Ishii, Hiromi Fujisawa