Abstract: A steering device includes a pipe, a housing, a telescopic mechanism, and a load absorbing mechanism. The load absorbing mechanism includes an extending portion provided in the telescopic mechanism and extending in a front-rear direction, a first sliding portion provided on a first side in the left-right direction with respect to the extending portion, and a second sliding portion provided on a second side in the left-right direction with respect to the extending portion. The sliding portion includes a front pressing portion that comes into contact with a side surface of the extending portion, and a rear pressing portion provided behind the front pressing portion, and in which a distance in the left-right direction between the rear pressing portion and the other sliding portion facing the one sliding portion across the extending portion is shorter than a distance in the left-right direction between the front pressing portion and the other sliding portion.

Abstract: A water content sensor includes: a light emitter that emits detection light having a first wavelength band and reference light a second wavelength band toward a road surface; a first light receiver that converts the detection light reflected by the road surface to a first electric signal; a second light receiver that converts the reference light reflected by the road surface to a second electric signal; and a computation processor that detects the amount of water based on a signal ratio between the first electric signal and the second electric signal. The computation processor detects the amount of water based on the signal ratio obtained when the signal intensity of at least one of the first electric signal and the second electric signal is within a predetermined range defined relative to a reference value.

Abstract: A functional water concentration sensor includes: a light source which emits ultraviolet light; a container capable of holding functional water having a pH between 6 and 9, inclusive, and containing hypochlorous acid and hypochlorite dissociated from the hypochlorous acid; a light-receiving element; and a signal processor. The signal processor calculates the concentration of the hypochlorite in the functional water on the basis of the output signal, calculates the percentages of the hypochlorous acid and the hypochlorite in the functional water on the basis of the pH of the functional water and the dissociation constant of the hypochlorous acid, and calculates the concentration of the hypochlorous acid in the functional water on the basis of the calculated hypochlorite concentration and the calculated percentages.

Abstract: A water content sensor includes: a light emitter that emits detection light having a first wavelength band and reference light a second wavelength band toward a road surface; a first light receiver that converts the detection light reflected by the road surface to a first electric signal; a second light receiver that converts the reference light reflected by the road surface to a second electric signal; and a computation processor that detects the amount of water based on a signal ratio between the first electric signal and the second electric signal. The computation processor detects the amount of water based on the signal ratio obtained when the signal intensity of at least one of the first electric signal and the second electric signal is within a predetermined range defined relative to a reference value.

Abstract: A functional water concentration sensor includes: a light source which emits ultraviolet light; a container capable of holding functional water having a pH between 6 and 9, inclusive, and containing hypochlorous acid and hypochlorite dissociated from the hypochlorous acid; a light-receiving element; and a signal processor. The signal processor calculates the concentration of the hypochlorite in the functional water on the basis of the output signal, calculates the percentages of the hypochlorous acid and the hypochlorite in the functional water on the basis of the pH of the functional water and the dissociation constant of the hypochlorous acid, and calculates the concentration of the hypochlorous acid in the functional water on the basis of the calculated hypochlorite concentration and the calculated percentages.

Abstract: An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.

Abstract: A functional water concentration sensor includes: a container used to contain functional water; a light source that emits ultraviolet light; a phosphor that emits fluorescence when excited by ultraviolet light emitted from the light source and transmitted through the container; and a light-receiving element that receives the fluorescence, wherein a peak wavelength of the ultraviolet light emitted from the light source is in a predetermined range that includes an absorption peak specific to the functional water.

Abstract: A functional water concentration sensor includes: a container used to contain functional water; a light source that emits ultraviolet light; a phosphor that emits fluorescence when excited by ultraviolet light emitted from the light source and transmitted through the container; and a light-receiving element that receives the fluorescence, wherein a peak wavelength of the ultraviolet light emitted from the light source is in a predetermined range that includes an absorption peak specific to the functional water.

Abstract: An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.

Abstract: An organic EL element includes an organic EL substrate 4 including an organic light emitting unit provided on a translucent substrate, and a sealing cap substrate sealing the light emitting unit. The organic EL substrate includes first electrode taking-out pads and provided in electrodes which feed power to the light emitting unit, and a first bonding portion 40 provided in a peripheral portion of the translucent substrate. The sealing cap substrate includes second electrode taking-out pads and facing the first electrode taking-out pads, through-wiring and passing through the sealing cap substrate, and a second bonding portion facing the first bonding portion. The first bonding portion and the second bonding portion are bonded together through surface activated bonding.

Abstract: An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.

Abstract: A wafer level package structure, in which a plurality of compact sensor devices with small variations in sensor characteristics are formed, and a method of producing the same are provided. This package structure has a semiconductor wafer having plural sensor units, and a package wafer bonded to the semiconductor wafer. The semiconductor wafer has a first metal layer formed with respect to each of the sensor units. The package wafer has a bonding metal layer at a position facing the first metal layer. Since a bonding portion between the semiconductor wafer and the package wafer is formed at room temperature by a direct bonding between activated surfaces of the first metal layer and the bonding metal layer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding portion.

Abstract: A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface.

Abstract: A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion, and a package substrate made of a semiconductor material, and bonded to a surface of the sensor unit. The package substrate has an electrical insulating film on a surface facing the sensor unit. The package substrate is bonded to the sensor unit by forming a direct bonding between an activated surface of the electrical insulating film and an activated surface of the sensor unit at room temperature.

Abstract: Apparatus and method for modifying an object with electrons are provided, by which the object can be uniformly and efficiently modified with the electrons under a pressure substantially equal to atmospheric pressure even when having a relatively wide surface area to be treated. This method uses a cold-cathode electron emitter having the capability of emitting electrons from a planar electron emitting portion according to tunnel effect, and preferably comprising a pair of electrodes, and a strong field drift layer including nanocrystalline silicon disposed between the electrodes. The object is exposed to electrons emitted from the planar electron emitting portion by applying a voltage between the electrodes.

Abstract: An image reading device having plural image sensors and a reading controller is disclosed. The image reading device is for obtaining image data over a subject by joining sub-image data outputs read by the image sensors, each image sensor comprising: a signal amplifier; and an A/D converter for converting an analog value output from the image sensor to a digital value; whereby the reading controller adjusts an amplification factor of each signal amplifier so that a read value of a white board read by each image sensor becomes a predetermined value.

Abstract: A compact sensor device having stable sensor characteristics and the production method are provided. The sensor device is formed with a sensor substrate and a pair of package substrates bonded to both surface of the sensor substrate. The sensor substrate has a frame with an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Surface-activated regions are formed on the frame of the sensor substrate and the package substrates by use of an atomic beam, an ion beam or a plasma of an inert gas. By forming a direct bonding between the surface-activated regions of the sensor substrate and each of the package substrates at room temperature, it is possible to avoid inconvenience resulting from residual stress at the bonding portion.

Abstract: A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface.

Abstract: A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion, and a package substrate made of a semiconductor material, and bonded to a surface of the sensor unit. The package substrate has an electrical insulating film on a surface facing the sensor unit. The package substrate is bonded to the sensor unit by forming a direct bonding between an activated surface of the electrical insulating film and an activated surface of the sensor unit at room temperature.

Abstract: A wafer level package structure, in which a plurality of compact sensor devices with small variations in sensor characteristics are formed, and a method of producing the same are provided. This package structure has a semiconductor wafer having plural sensor units, and a package wafer bonded to the semiconductor wafer. The semiconductor wafer has a first metal layer formed with respect to each of the sensor units. The package wafer has a bonding metal layer at a position facing the first metal layer. Since a bonding portion between the semiconductor wafer and the package wafer is formed at room temperature by a direct bonding between activated surfaces of the first metal layer and the bonding metal layer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding portion.