Abstract: Provided are a polyarylene sulfide having a chloroform soluble content of at most 0.5% by weight and having an inherent viscosity &eegr;inh of from 0.05 to 0.4; a polyarylene sulfide resin composition comprising a polyarylene sulfide and an inorganic filler, of which the chloroform soluble content is at most 0.5% by weight relative to the polyarylene sulfide in the composition; car parts produced through injection molding of the composition; and a method for producing a polyarylene sulfide. The polyarylene sulfide has a reduced content of low-molecular components, and has well balanced properties of fluidity, flexural strength and impact resistance.

Abstract: Provided are a polyarylene sulfide having a chloroform soluble content of at most 0.5% by weight and having an inherent viscosity &eegr;inh of from 0.05 to 0.4; a polyarylene sulfide resin composition comprising a polyarylene sulfide and an inorganic filler, of which the chloroform soluble content is at most 0.5% by weight relative to the polyarylene sulfide in the composition; car parts produced through injection molding of the composition; and a method for producing a polyarylene sulfide. The polyarylene sulfide has a reduced content of low-molecular components, and has well balanced properties of fluidity, flexural strength and impact resistance.

Abstract: Provided is a production process for polyarylene sulfide having a high molecular weight and an excellent heat stability. It is a production process for polyarylene sulfide by reacting a dihalogenoaromatic compound with metal sulfide in a polar solvent, wherein all or a part of water required for the reaction is added on a condition that the reaction system is 100° C. or higher, whereby obtained is polyarylene sulfide which is reduced in an intrinsic viscosity [&eegr;] by 0.05 deciliter/g or less at 206° C. when added to an N-methyl-2-pyrrolidone solvent is the polyarylene sulfide of an amount equivalent to the solvent and it is maintained at 265° C. for 8 hours.

Abstract: A resin-coated, bonding fine wire for use in forming bonded electrical connections on a semiconductor device, wherein the wire is characterized as having a tensile strength exceeded when the wire is further elongated in length in a range of 0.5% to 3.5% of its original length by breaking of the wire during tension testing. It has been determined that an insulated bonding fine wire exhibiting such relatively low ductility produces a loop profile maintainable in a stable condition during a bonding operation while providing reliable bonding strength.

Abstract: The thermoplastic resin composition containing a fluorine-containing elastomer, which is produced by incorporating a base-treated fluorine-containing elastomer into a thermoplastic resin and has a base-treated fluorine-containing elastomer content of 0.1 to 50% by weight, the composition being excellent in impact resistance and heat resistance and useful for producing various products in the fields of aviation, machinery, office machines, electricity and electronics.