Patents by Inventor Toru Fukano
Toru Fukano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10533971Abstract: A biosensor, including: a first cover member comprising an element-accommodating recess in an upper face thereof; a detection element using a surface acoustic wave, the detection element including an element substrate accommodated in the element-accommodating recess, and at least one detection unit located on an upper face of the element substrate configured to perform detection of an analyte; and a second cover member joined to the first cover member and covering the detection element, and including an inflow port from which the analyte flows in and a groove which extends from the inflow port to at least above the at least one detection unit and constitutes a capillary.Type: GrantFiled: September 25, 2017Date of Patent: January 14, 2020Assignee: KYOCERA CORPORATIONInventors: Atsuomi Fukuura, Toru Fukano, Yuji Kishida, Hiroyasu Tanaka, Hideharu Kurioka
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Patent number: 10193525Abstract: An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering the a side surface of the terminal (15). The terminal (15) comprises, in a first region in the height direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).Type: GrantFiled: February 20, 2015Date of Patent: January 29, 2019Assignee: KYOCERA CorporationInventors: Toru Fukano, Junya Nishii
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Publication number: 20180052139Abstract: A biosensor, including: a first cover member comprising an element-accommodating recess in an upper face thereof; a detection element using a surface acoustic wave, the detection element including an element substrate accommodated in the element-accommodating recess, and at least one detection unit located on an upper face of the element substrate configured to perform detection of an analyte; and a second cover member joined to the first cover member and covering the detection element, and including an inflow port from which the analyte flows in and a groove which extends from the inflow port to at least above the at least one detection unit and constitutes a capillary.Type: ApplicationFiled: September 25, 2017Publication date: February 22, 2018Inventors: Atsuomi Fukuura, Toru Fukano, Yuji Kishida, Hiroyasu Tanaka, Hideharu Kurioka
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Patent number: 9882540Abstract: Provided is a method for manufacturing a surface acoustic wave apparatus that can reduce degradation of electric characteristics and also reduce the number of manufacturing processes. The method for manufacturing a surface acoustic wave apparatus includes the steps of: forming an IDT electrode on an upper surface of a piezoelectric substrate, forming a frame member surrounding a formation area in which the IDT electrode is formed on the piezoelectric substrate, and mounting a film-shaped lid member on the upper surface of the frame member so as to be joined to the frame member so that a protective cover, used for covering the formation area and for providing a tightly-closed space between it and the formation area, is formed.Type: GrantFiled: May 5, 2015Date of Patent: January 30, 2018Assignee: KYOCERA CorporationInventor: Toru Fukano
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Patent number: 9772310Abstract: To provide a biosensor including a suctioning mechanism while using a detection element such as a surface acoustic wave device, included are: a first cover member 1 including an element-accommodating recess 5 on an upper face thereof; a detection element 3 including an element substrate 10, and at least one detection unit 13 located on the upper face of the element substrate 10 to perform detection of an analyte; and a second cover member 2 joined to the first cover member 1 and covering the detection element 3, and including an inflow port 14 from which the analyte flows in and a groove 15 extending from the inflow port 14 to at least above the detection unit.Type: GrantFiled: July 30, 2012Date of Patent: September 26, 2017Assignee: KYOCERA CORPORATIONInventors: Atsuomi Fukuura, Toru Fukano, Yuji Kishida, Hiroyasu Tanaka, Hideharu Kurioka
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Publication number: 20150236665Abstract: Provided is a method for manufacturing a surface acoustic wave apparatus that can reduce degradation of electric characteristics and also reduce the number of manufacturing processes. The method for manufacturing a surface acoustic wave apparatus includes the steps of: forming an IDT electrode on an upper surface of a piezoelectric substrate, forming a frame member surrounding a formation area in which the IDT electrode is formed on the piezoelectric substrate, and mounting a film-shaped lid member on the upper surface of the frame member so as to be joined to the frame member so that a protective cover, used for covering the formation area and for providing a tightly-closed space between it and the formation area, is formed.Type: ApplicationFiled: May 5, 2015Publication date: August 20, 2015Inventor: Toru FUKANO
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Publication number: 20150162893Abstract: An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering the a side surface of the terminal (15). The terminal (15) comprises, in a first region in the height direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).Type: ApplicationFiled: February 20, 2015Publication date: June 11, 2015Inventors: Toru FUKANO, Junya NISHII
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Patent number: 9021669Abstract: Provided is a method for manufacturing a surface acoustic wave apparatus that can reduce degradation of electric characteristics and also reduce the number of manufacturing processes. The method for manufacturing a surface acoustic wave apparatus includes the steps of: forming an IDT electrode on an upper surface of a piezoelectric substrate, forming a frame member surrounding a formation area in which the IDT electrode is formed on the piezoelectric substrate, and mounting a film-shaped lid member on the upper surface of the frame member so as to be joined to the frame member so that a protective cover, used for covering the formation area and for providing a tightly-closed space between it and the formation area, is formed.Type: GrantFiled: August 7, 2007Date of Patent: May 5, 2015Assignee: KYOCERA CorporationInventor: Toru Fukano
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Patent number: 8975803Abstract: An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering the a side surface of the terminal (15). The terminal (15) comprises, in a first region in the height direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).Type: GrantFiled: July 1, 2014Date of Patent: March 10, 2015Assignee: KYOCERA CorporationInventors: Toru Fukano, Junya Nishii
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Publication number: 20140368084Abstract: An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering the a side surface of the terminal (15). The terminal (15) comprises, in a first region in the height direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).Type: ApplicationFiled: July 1, 2014Publication date: December 18, 2014Applicant: KYOCERA CORPORATIONInventors: Toru FUKANO, Junya NISHII
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Patent number: 8810111Abstract: An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering a side surface of the terminal (15). The terminal (15) comprises, in a first region in the direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).Type: GrantFiled: November 24, 2009Date of Patent: August 19, 2014Assignee: Kyocera CorporationInventors: Toru Fukano, Junya Nishii
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Publication number: 20140224002Abstract: To provide a biosensor including a suctioning mechanism while using a detection element such as a surface acoustic wave device, included are: a first cover member 1 including an element-accommodating recess 5 on an upper face thereof; a detection element 3 including an element substrate 10, and at least one detection unit 13 located on the upper face of the element substrate 10 to perform detection of an analyte; and a second cover member 2 joined to the first cover member 1 and covering the detection element 3, and including an inflow port 14 from which the analyte flows in and a groove 15 extending from the inflow port 14 to at least above the detection unit.Type: ApplicationFiled: July 30, 2012Publication date: August 14, 2014Applicant: KYOCERA COPRORATIONInventors: Atsuomi Fukuura, Toru Fukano, Yuji Kishida, Hiroyasu Tanaka, Hideharu Kurioka
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Patent number: 8436514Abstract: Provided is a highly reliable acoustic wave device wherein deterioration of electrical characteristics due to deformation of a protective cover is suppressed. A method for manufacturing such acoustic wave device is also provided. The acoustic wave device has a piezoelectric substrate 1 propagating an acoustic wave; an excitation electrode arranged on a first main surface of the piezoelectric substrate 1; a columnar outside connection-use electrode 10 electrically connected to the excitation electrode; a protective cover 17 having a hollow accommodating space 8 in which the excitation electrode is accommodated on the first main surface; and a conductive layer 18 connected to the electrode 10 on the protective cover 17.Type: GrantFiled: October 30, 2008Date of Patent: May 7, 2013Assignee: Kyocera CorporationInventors: Toru Fukano, Yoshihiro Ookubo, Junya Nishii
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Patent number: 8384272Abstract: A small and highly reliable acoustic wave device and a method for production of the same will be provided. The acoustic wave device has a piezoelectric substrate 1; a SAW element 2 on one main surface of the piezoelectric substrate 1; an outside connection-use conductor 3 formed on the one main surface of the piezoelectric substrate 1 and electrically connected to the SAW element 2; a columnar electrode 10 on the outside connection-use conductor 3; and a protective cover 6 defining inner walls of a vibration space 7 for vibration of the SAW element 2 and planarly surrounding a side surface of the columnar electrode 10.Type: GrantFiled: January 30, 2009Date of Patent: February 26, 2013Assignee: Kyocera CorporationInventors: Toru Fukano, Yoshihiro Ookubo, Junya Nishii
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Patent number: 8299678Abstract: A method for fabricating a small and low-profile surface acoustic wave device which can be formed collectively by a wafer process without causing deterioration in characteristics is provided. The surface acoustic wave device has a piezoelectric substrate 1, an IDT 2 formed on one major surface of the piezoelectric substrate 1 and having at least one comb-shaped electrode, and a protective cover 6 forming a hollow containing space 7 with the one major surface by covering the IDT 2 above the one major surface. The protective cover 6 is provide with a through hole 15 and composed, at least partially, of a photocurable material containing an acid generator which contains fluorine.Type: GrantFiled: May 30, 2008Date of Patent: October 30, 2012Assignee: Kyocera CorporationInventors: Toru Fukano, Junya Nishii
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Publication number: 20110234055Abstract: An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering a side surface of the terminal (15). The terminal (15) comprises, in a first region in the direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).Type: ApplicationFiled: November 24, 2009Publication date: September 29, 2011Applicant: KYOCERA CORPORATIONInventors: Toru Fukano, Junya Nishii
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Patent number: 8008837Abstract: A surface acoustic wave device excellent in reliability and a method of manufacturing the same are provided. The surface acoustic wave device comprises a piezoelectric substrate (1) for propagating an surface acoustic wave thereon, an IDT (2) formed on a first main surface of the piezoelectric substrate (1) and a protective cover (6) formed of a photocurable material and covering a formation region of the IDT (2), thereby forming a hollow containing space (7) together with the first main surface, which has an acid generating portion containing an acid-generating agent in a region at its lower end.Type: GrantFiled: December 28, 2007Date of Patent: August 30, 2011Assignee: Kyocera CorporationInventors: Toru Fukano, Atsuomi Fukuura
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Publication number: 20110018389Abstract: A small and highly reliable acoustic wave device and a method for production of the same will be provided. The acoustic wave device has a piezoelectric substrate 1; a SAW element 2 on one main surface of the piezoelectric substrate 1; an outside connection-use conductor 3 formed on the one main surface of the piezoelectric substrate 1 and electrically connected to the SAW element 2; a columnar electrode 10 on the outside connection-use conductor 3; and a protective cover 6 defining inner walls of a vibration space 7 for vibration of the SAW element 2 and planarly surrounding a side surface of the columnar electrode 10.Type: ApplicationFiled: January 30, 2009Publication date: January 27, 2011Applicant: KYOCERA CORPORATIONInventors: Toru Fukano, Yoshihiro Ookubo, Junya Nishii
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Publication number: 20100277037Abstract: A surface acoustic wave device excellent in reliability and a method of manufacturing the same are provided. The surface acoustic wave device comprises a piezoelectric substrate (1) for propagating an surface acoustic wave thereon, an IDT (2) formed on a first main surface of the piezoelectric substrate (1) and a protective cover (6) formed of a photocurable material and covering a formation region of the IDT (2), thereby forming a hollow containing space (7) together with the first main surface, which has an acid generating portion containing an acid-generating agent in a region at its lower end.Type: ApplicationFiled: December 28, 2007Publication date: November 4, 2010Applicant: KYOCERA CORPORATIONInventors: Toru Fukano, Atsuomi Fukuura
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Publication number: 20100244625Abstract: A method for fabricating a small and low-profile surface acoustic wave device which can be formed collectively by a wafer process without causing deterioration in characteristics is provided. The surface acoustic wave device has a piezoelectric substrate 1, an IDT 2 formed on one major surface of the piezoelectric substrate 1 and having at least one comb-shaped electrode, and a protective cover 6 forming a hollow containing space 7 with the one major surface by covering the IDT 2 above the one major surface. The protective cover 6 is provide with a through hole 15 and composed, at least partially, of a photocurable material containing an acid generator which contains fluorine.Type: ApplicationFiled: May 30, 2008Publication date: September 30, 2010Applicant: Kyocera CorporationInventors: Toru Fukano, Junya Nishi