Abstract: A fault content identification device 40 identifies details of a fault of a power supply control system in a short time by including: a detection unit 41 which, while a power supply control processing for turning on or turning off a power supply device 60 that supplies power to a main device 50 is in progress, detects that a value indicated by a power supply sequence signal generated by the main device 50 or the power supply device 60 and having a value that transitions in accordance with a prescribed specification, transitions to a value indicating non-conformance to the prescribed specification; and a generation unit 42 for generating information that indicates details of the power supply control processing performed at a timing when the detection unit 41 detects that the value indicated by the power supply sequence signal transitions to the value indicating non-conformance to the prescribed specification.

Abstract: A fault content identification device 40 identifies details of a fault of a power supply control system in a short time by including: a detection unit 41 which, while a power supply control processing for turning on or turning off a power supply device 60 that supplies power to a main device 50 is in progress, detects that a value indicated by a power supply sequence signal generated by the main device 50 or the power supply device 60 and having a value that transitions in accordance with a prescribed specification, transitions to a value indicating non-conformance to the prescribed specification; and a generation unit 42 for generating information that indicates details of the power supply control processing performed at a timing when the detection unit 41 detects that the value indicated by the power supply sequence signal transitions to the value indicating non-conformance to the prescribed specification.

Abstract: An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (111) plane is 0.1-0.45 in the X-ray diffraction by CuKal rays. This electrolytic copper-plating film is formed by an electrolytic copper-plating method using an electrolytic copper-plating solution which contains 20-150 g/L of copper sulphate and 30-250 g/L of chelating agent and contains no agent for reducing copper ions and has a pH adjusted to 10.5-13.5.

Abstract: An R—T—B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co.) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (111) plane is 0.1-0.45 in the X-ray diffraction by CuKal rays. This electrolytic copper-plating film is formed by an electrolytic copper-plating method using an electrolytic copper-plating solution which contains 20-150 g/L of copper sulphate and 30-250 g/L of chelating agent and contains no agent for reducing copper ions and has a pH adjusted to 10.5-13.5.