Abstract: A first non-recording region is situated in one of both outer sides of a recording region in a main scanning direction of recording. A second non-recording region is situated in the other one of the both sides of the recording region. A power source provides a driving force. A driving gear is interconnected with the power source. A transmission gear is operable to be coupled with the driving gear to transmit the driving force to a rotatable member. An actuator is operable to move in the main scanning direction. A first trigger is disposed in the first non-recording region. A second trigger is disposed in the second non-recording region. A clutch is interconnected with the trigger so as to couple the driving gear and the transmission gear when the one of the first trigger and the second trigger is actuated by the actuator.

Abstract: An optical semiconductor module includes an optical semiconductor element; an optical fiber optically coupled with the semiconductor element; a base having an upper surface and a lower surface; and a package. The package has a bottom plate on which the base is mounted, a front wall having a hole through which the optical fiber is inserted, and a rear wall opposite to the front wall. The optical fiber and the optical semiconductor element are mounted on the upper surface. The base has a rear face formed on an end portion opposite to the front wall, and the rear face is positioned above the lower surface of the base.

Abstract: A controller includes a circuit board on which an electronic component is mounted to control operations of a recording apparatus. An electromagnetic wave shielding member having electric conductivity and thermal conductivity covers the electronic component. The electromagnetic wave shielding member is formed with a contact portion which is brought into contact with the electronic component.

Abstract: An optical module includes a package; an optical device housed in the package, and having a temperature-dependent characteristic; a thermo-module connected to the optical device to control its temperature and configured to heat or cool the optical device when supplied with a first electric current in one direction or a second electric current in a direction opposite to the first electric current, respectively; and a heating element disposed close to the optical device and configured to heat the optical device when supplied with an electric current.

Abstract: An anomaly detection system that can detect physical-positional anomalies or probably abnormal symptoms in a product on a wafer even if an inspector passively monitors map data or anomalies in a unit of test such as a lot of products do not reach a predetermined anomaly reference value. An input module 32 of an anomaly detection system 30 inputs positional data 15 about the position of each of a plurality of semiconductor product on a wafer from a wafer prober and inputs a predetermined test result data 25 about the semiconductor product from an LSI tester 20 each time a test on the plurality of semiconductor products. A detector 33 detects a predetermined abnormal value pattern in a plurality of semiconductor products having a predetermined abnormal value in the predetermined test result data 25 inputted by the input module 32. An output section 34 outputs detection result data 35 (an alarm if the abnormal pattern is detected).

Abstract: A recording apparatus has a paper feeder wherein single sheets of paper can be set, a paper delivery device for transporting paper fed from the paper feeder to a recorder, and a control unit for controlling operation of the paper feeder and the paper delivery device. The control unit has a skew removal execution mode of only the first sheet of paper where the paper tip is bitten into a paper delivery roller forming a part of the paper delivery device and then the paper delivery roller is reversely rotated for ejecting the paper tip for the first sheet of paper at the start of recording and then forward rotating the paper delivery roller for delivering the sheet of paper whose skew is removed to the recorder and delivering the second and later sheets of paper to a record area without executing the skew removal.

Abstract: A paper feed unit includes a hopper on which sheets are stacked and which is turned around a rotation shaft. The hopper is turned to move apart from or move to a paper feed roller. The paper feed unit has three modes: a large release mode in which the hopper is turned to be most apart from the paper feed roller, a non-release mode in which the printing sheet is abutted against the paper feed roller, and a small release mode in which the printing sheet is slightly separated from the paper feed roller, and is at a medium level between the above two modes. When a paper feeding job is still present, a state that the uppermost printing sheet is slightly separated from the paper feed roller is retained by the small release mode, whereby a swing range of the hopper is minimized.

Abstract: The present invention provides a semiconductive light-emitting device involving a light-emitting layer of the multilayer strained quantum well structure that has a plurality of quantum well layers and a plurality of barrier layers, where each of said quantum well layers is constituted of a semiconductive crystal subjected to intraplanar compressive strain; each of the barrier layers is constituted of semiconductor crystal of AlInAs, AlGaInAs or AlGaInAsP. For high differential gain, each quantum well layer is 6nm thick or less, and the summed quantum well layers measure 13 to 1000 nm in thickness.

Abstract: With an ink jet recording head (8) comprising two common ink chambers (26) and (27) communicating with both sides of a pressure generation chamber (24) and ink supply ports (30) and (31) where ink flows into the common ink chambers (26) and (27) from the outside, one ink supply port (30) is connected to a subtank (10) and the other ink supply port (31) is connected to an ink cartridge (6). The subtank (10) is replenished with ink through the ink jet recording head (8). Since ink reversely flows into the ink cartridge (6) via the recording head (8) from the subtank (10) due to the head difference, ink in the recording head (8) can be forcibly circulated without complicating a flow passage configuration.

Abstract: Data is printed on a recording sheet by heating the recording sheet at a pre-printing heating region of a heat roller 20, and the recording sheet is further heated at a post-printing heating and fusing region to thereby be dried and fused. In the meantime, air introduced from an exhaust fan 50 is blown into a data writing section from bottom up in the same direction as a recording sheet feeding direction, so that not only the vapor generated from the recording sheet during the heating and the vapor generated from the ink during the printing are eliminated, but also a recording head 40 is cooled.

Abstract: There is provided a semiconductor laser device comprising a lower optical confinement layer 31, an active layer 3 and an upper optical confinement layer 34, said active layer 3 being inserted between said upper and lower optical confinement layers 31 and 34, characterized in that an electron injection path (along an n-type electrode 10.fwdarw.the upper optical confinement layer 34.fwdarw.the active layer 3) for injecting electrons into the active layer 3 by way of the optical confinement layers and a hole injection path (along p-type electrodes 6.fwdarw.the p-type InP layer 5.fwdarw.the active layer 3) for injecting holes into the active layer 3 without passing through the optical confinement layers are formed therein. With such an arrangement, electrons are injected into the active layer by way of the optical confinement layers, whereas holes are injected into the active layer without passing through the optical confinement layers.

Abstract: A semiconductor device having a current blocking layer and confinement current passing part formed on a semiconductor layer, and an electrode metal layer disposed on said current blocking layer and confinement current passing part, wherein the current blocking layer is made of semiconductor material, and the contact resistance of current blocking layer and electrode metal layer is higher than the contact resistance of electrode metal layer and semiconductor layer, and/or the resistivity of the current blocking layer is higher than that of the semiconductor layer.