Patents by Inventor TORU FURUSHIGE

TORU FURUSHIGE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing apparatus and polishing method
    Patent number: 11541503
    Abstract: A polishing apparatus is a polishing apparatus polishing a target object formed on a surface of a film-shaped substrate. A polishing apparatus includes: a rotatable polishing tool acting on the target object; a slurry nozzle supplying a polishing slurry; and a polishing stage pressing the polishing tool against the target object. A surface of the polishing stage has an unevenness shape.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: January 3, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yuji Yamamoto, Toru Furushige
  • POLISHING APPARATUS AND POLISHING METHOD
    Publication number: 20200324383
    Abstract: A polishing apparatus is a polishing apparatus polishing a target object formed on a surface of a film-shaped substrate. A polishing apparatus includes: a rotatable polishing tool acting on the target object; a slurry nozzle supplying a polishing slurry; and a polishing stage pressing the polishing tool against the target object. A surface of the polishing stage has an unevenness shape.
    Type: Application
    Filed: March 23, 2020
    Publication date: October 15, 2020
    Inventors: YUJI YAMAMOTO, TORU FURUSHIGE
  • Wafer separating apparatus and wafer separating method
    Patent number: 9190301
    Abstract: A wafer separating apparatus can separate a plurality of wafers bonded to a slicing base with an adhesive from the slicing base. The apparatus includes: a water tank configured to store therein water; a retainer configured to retain the slicing base; a first nozzle configured to apply a jet of water to side of a wafer of the wafers; and a tray configured to contain a wafer separated from the slicing base, wherein the tray is disposed inside the water tank.
    Type: Grant
    Filed: October 16, 2013
    Date of Patent: November 17, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Michirou Yoshino, Kojiro Nakamura, Toru Furushige
  • WAFER SEPARATING APPARATUS AND WAFER SEPARATING METHOD
    Publication number: 20140130986
    Abstract: A wafer separating apparatus can separate a plurality of wafers bonded to a slicing base with an adhesive from the slicing base. The apparatus includes: a water tank configured to store therein water; a retainer configured to retain the slicing base; a first nozzle configured to apply a jet of water to side of a wafer of the wafers; and a tray configured to contain a wafer separated from the slicing base, wherein the tray is disposed inside the water tank.
    Type: Application
    Filed: October 16, 2013
    Publication date: May 15, 2014
    Applicant: Panasonic Corporation
    Inventors: MICHIROU YOSHINO, KOJIRO NAKAMURA, TORU FURUSHIGE