Abstract: A test board can be inserted to a test head and removed from the test head while the connecting section for mounting thereon devices under test is mounted on the upper portion of the test head. A test head for retaining therein at least one test board for testing devices under test, includes: a casing provided with, on one side surface thereof, an opening through which the at least one test board is inserted and removed, the casing retaining therein the at least one test board with an upper side thereof oriented towards an upper surface of the casing; and a mounting member that guides a lower side of the at least one test board through the opening to a pre-set position, imposes an upward force to the lower side of the at least one test board, thereby mounting the at least one test board to the casing.

Abstract: A test board can be inserted to a test head and removed from the test head while the connecting section for mounting thereon devices under test is mounted on the upper portion of the test head. A test head for retaining therein at least one test board for testing devices under test, includes: a casing provided with, on one side surface thereof, an opening through which the at least one test board is inserted and removed, the casing retaining therein the at least one test board with an upper side thereof oriented towards an upper surface of the casing; and a mounting member that guides a lower side of the at least one test board through the opening to a pre-set position, imposes an upward force to the lower side of the at least one test board, thereby mounting the at least one test board to the casing.

Abstract: A burn-in system enabling the temperatures of a large number of electronic devices differing in amount of self generated heat to be simultaneously reliably adjusted to a predetermined temperature, that is, a burn-in system bringing heater blocks having heaters, cooling blocks formed with channels able to carry a coolant, and sensor blocks having temperature sensors into contact with a plurality of DUTs mounted on a burn-in board and simultaneously performing a burn-in test on the plurality of DUTs, wherein each cooling block is formed with a first accommodating space and second accommodating space, each heater block is accommodated in a first accommodating space in a state maintaining clearance from the inside wall surfaces, and each sensor block is accommodated in a second accommodating space in a state maintaining clearance from the inside wall surfaces.

Abstract: A burn-in system enabling the temperatures of a large number of electronic devices differing in amount of self generated heat to be simultaneously reliably adjusted to a predetermined temperature, that is, a burn-in system bringing heater blocks having heaters, cooling blocks formed with channels able to carry a coolant, and sensor blocks having temperature sensors into contact with a plurality of DUTs mounted on a burn-in board and simultaneously performing a burn-in test on the plurality of DUTs, wherein each cooling block is formed with a first accommodating space and second accommodating space, each heater block is accommodated in a first accommodating space in a state maintaining clearance from the inside wall surfaces, and each sensor block is accommodated in a second accommodating space in a state maintaining clearance from the inside wall surfaces.

Abstract: A burn-in system enabling the temperatures of a large number of electronic devices differing in amount of self generated heat to be simultaneously reliably adjusted to a predetermined temperature, that is, a burn-in system bringing heater blocks having heaters, cooling blocks formed with channels able to carry a coolant, and sensor blocks having temperature sensors into contact with a plurality of DUTs mounted on a burn-in board and simultaneously performing a burn-in test on the plurality of DUTs, wherein each cooling block is formed with a first accommodating space and second accommodating space, each heater block is accommodated in a first accommodating space in a state maintaining clearance from the inside wall surfaces, and each sensor block is accommodated in a second accommodating space in a state maintaining clearance from the inside wall surfaces.

Abstract: A burn-in system enabling the temperatures of a large number of electronic devices differing in amount of self generated heat to be simultaneously reliably adjusted to a predetermined temperature, that is, a burn-in system bringing heater blocks having heaters, cooling blocks formed with channels able to carry a coolant, and sensor blocks having temperature sensors into contact with a plurality of DUTs mounted on a burn-in board and simultaneously performing a burn-in test on the plurality of DUTs, wherein each cooling block is formed with a first accommodating space and second accommodating space, each heater block is accommodated in a first accommodating space in a state maintaining clearance from the inside wall surfaces, and each sensor block is accommodated in a second accommodating space in a state maintaining clearance from the inside wall surfaces.

Abstract: A burn-in system enabling the temperatures of a large number of electronic devices differing in amount of self generated heat to be simultaneously reliably adjusted to a predetermined temperature, that is, a burn-in system bringing heater blocks having heaters, cooling blocks formed with channels able to carry a coolant, and sensor blocks having temperature sensors into contact with a plurality of DUTs mounted on a burn-in board and simultaneously performing a burn-in test on the plurality of DUTs, wherein each cooling block is formed with a first accommodating space and second accommodating space, each heater block is accommodated in a first accommodating space in a state maintaining clearance from the inside wall surfaces, and each sensor block is accommodated in a second accommodating space in a state maintaining clearance from the inside wall surfaces.