Abstract: A method of working a workpiece with an apparatus comprising the steps of holding the workpiece by a holding means, rotating the held workpiece by a rotational means in a direction of a tool to match a rotational axis line of the workpiece with a rotation axis line of the tool, matching a vertical axis of the holding means holding the workpiece with an intersection of a swingable rotation axis line of a means for swingably rotating the tool and the tool rotation axis line, and holding the workpiece above the tool and the working the workpiece by exerting work pressure on the workpiece.

Abstract: A brittle-material machining method and apparatus achieves grinding in a ductile mode region using an ordinary grinding apparatus. Grinding or polishing of a workpiece consisting of a brittle material is performed by relative movement between the workpiece and a grinding wheel, which includes innumerable abrasive grains provided on a support base, while the grinding wheel is brought into pressured contact with the workpiece at a prescribed pressure. The grinding or polishing is carried out upon setting the prescribed pressure in such a manner that depth of cut d, into the workpiece, of abrasive grains among the innumerable number thereof that participate in the grinding or polishing is made less than a critical depth of cut d.sub.c, which is a minimum depth of cut at which brittle fracture is produced in the workpiece.

Abstract: Disclosed is a precise grinding grindstone in which the-heights of the grinding particles can be aligned even if large particles are employed. An underlying plated layer is formed on a substrate, and grinding particles are dispersed as a single layer thereon. The grinding particles are pressed toward the plated layer by a mold member and are partly pressed into the plated layer, whereby the heights of the grinding particles are aligned. Then, the particles are supported by a binding plated layer. The protrusion of the particles can be arbitrarily selected by regulating the thickness of the binding plated layer.