Patents by Inventor Toru Itani

Toru Itani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9024198
    Abstract: A flexible circuit board with high connection reliability and a manufacturing method thereof, wherein the flexible circuit board has a bent section formed thereon, can be deformed flexibly, and wherein a wiring layer will not be peeled off or ruptured even when deformation is repeated onto the flexible circuit board, heat is radiated from electronic parts, or minute wiring is formed on the flexible circuit board. The flexible circuit board is provided with an insulating film comprised of liquid crystal polymer, a wiring layer formed upon the insulating film, and an insulating layer comprised of liquid crystal polymer formed upon the wiring layer. The flexible circuit board has a bent section with a radius of curvature of R (mm) formed on at least one location thereof, and is made to be deformable in a state with the radius of curvature of the bent section maintained at R (mm).
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: May 5, 2015
    Assignee: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara, Toru Itani
  • Publication number: 20140102771
    Abstract: A flexible circuit board with high connection reliability and a manufacturing method thereof, wherein the flexible circuit board has a bent section formed thereon, can be deformed flexibly, and wherein a wiring layer will not be peeled off or ruptured even when deformation is repeated onto the flexible circuit board, heat is radiated from electronic parts, or minute wiring is formed on the flexible circuit board. The flexible circuit board is provided with an insulating film comprised of liquid crystal polymer, a wiring layer formed upon the insulating film, and an insulating layer comprised of liquid crystal polymer formed upon the wiring layer. The flexible circuit board has a bent section with a radius of curvature of R (mm) formed on at least one location thereof, and is made to be deformable in a state with the radius of curvature of the bent section maintained at R (mm).
    Type: Application
    Filed: July 16, 2010
    Publication date: April 17, 2014
    Applicant: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara, Toru Itani
  • Patent number: 8562177
    Abstract: A lighting device which can illuminate a large range with a simple configuration, and in which the LEDs or the mounting portions thereof are not likely to be damaged even when vibrations occur as a light source device which uses an LED as a light source, and a manufacturing method thereof are provided. The present invention includes a deformable flexible circuit board having an insulating film made of thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer and made of thermoplastic resin, and in which a bent portion with a curvature radius “R” (mm) is formed at at least one position, and a plurality of LEDs mounted on the flexible circuit board.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: October 22, 2013
    Assignee: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara, Toru Itani
  • Publication number: 20120281411
    Abstract: A lighting device which can illuminate a large range with a simple configuration, and in which the LEDs or the mounting portions thereof are not likely to be damaged even when vibrations occur as a light source device which uses an LED as a light source, and a manufacturing method thereof are provided. The present invention includes a deformable flexible circuit board having an insulating film made of thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer and made of thermoplastic resin, and in which a bent portion with a curvature radius “R” (mm) is formed at at least one position, and a plurality of LEDs mounted on the flexible circuit board.
    Type: Application
    Filed: July 23, 2010
    Publication date: November 8, 2012
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara, Toru Itani