Patents by Inventor Toru Kabe

Toru Kabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing an electronic circuit device and electronic circuit device
    Patent number: 7179666
    Abstract: A circuit element having electrodes on one main surface thereof and a substrate having connection bump electrodes and recognition bump electrodes provided on one main surface thereof are prepared. Connection bumps and recognition bumps are formed on the connection bump electrodes and the recognition bump electrodes by using a wire bonding method. Based on the images of the recognition bumps picked up by an optical device, the location of the recognition bumps is detected and, based on the detected location, the circuit element is connected to the substrate through the connection bumps. Since the upper portions of the recognition bumps are in a convex shape, a contrast with respect to the recognition bump electrodes is easily obtained and the location of the recognition bumps can be correctly detected.
    Type: Grant
    Filed: July 29, 2004
    Date of Patent: February 20, 2007
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yuji Kimura, Takenobu Maeda, Toru Kabe