Abstract: A manufacturing method for manufacturing ceramic electronic components, includes steps of forming a stack body by stacking ceramic green sheets and conductive layers on top of each other, punching a frame into the stack body and holding the frame in the stack body, locating a pressing force applying member inside the frame and, while the frame is held in the stack body, applying a pressing force to a portion of the stack body located inside the frame by causing the pressing force applying member located inside the frame to press against the portion of the stack body located inside the frame, to thereby form a high-density structure inside the frame while preventing the high-density structure from deforming outwardly beyond the frame. The stack body can be heated to reduce the required pressing force, and an elastic member may be provided to make the pressing force uniform.

Abstract: In the step of cladding by applying a pressing force to a ceramic stack body, while a frame being punched into a stack body and kept therein, the stack body is pressed by a pressing force applying member located inside of the frame. According to this method, no deformations are created in the direction parallel to the surface of the stack. Therefore, such a problem as the deformation of a conductive layer due to stress in not caused, resulting in a stack body with an excellent densified structure and, when resulting stack bodies are sintered, ceramic electronic components formed of them are free of defective connections, structural defects and electrical performance failures with an excellent yield rate. In addition, by heating a stack body at applying a pressing force thereto, the densified stack body is formed under a reduced pressure. Furthermore, by having an elastic body provided to the pressing force applying member, a stack body is pressed uniformly.