Abstract: An apparatus for aligning electronic component chips, which is made of a resin material as a whole, comprises a chamber for storing a plurality of electronic component chips in random orientation, and an aligning passage for guiding the electronic component chips, which were stored in the chamber, to move while aligned along a prescribed direction. A wall surface defining the chamber and one defining the aligning passage are provided with conductivity, by formation of a metal-plated film or by other methods. Thus, static electricity, which may be caused by movement of the electronic component chips, is prevented, in order to attain smooth movement of the electronic component chips.

Abstract: An apparatus for aligning electronic component chips includes an aligning passage for guiding a plurality of electronic component chips which are in an aligned state along a prescribed direction, and a chamber communicated with the aligning passage for storing the plurality of electronic component chips. A blowing passage is provided near an inlet of the aligning passage for introducing compressed air from the outside. An upper wall surface defining the space is provided by a displaceable movable block, the displacement of the movable block upward is driven by the compressed air introduced from the blowing passage, and displacement downward is driven by natural gravity. Therefore, by the intermittent introduction of the compressed air, the movable block reciprocates up and down so that a space between the upper and lower wall surfaces of the space is widened and narrowed.

Abstract: An apparatus for aligning/supplying electronic component chips comprises an aligning passage for guiding and moving a plurality of electronic component chips in a state aligned with each other along a prescribed direction, and a chamber which communicates with the aligning passage for storing a plurality of electronic component chips. The chamber at least comprises a small chamber which is formed in the vicinity of an inlet of the aligning passage and a large chamber which communicates with the small chamber. A gradient plane or a rounded face is formed in at least a part of the wall surfaces defining the small chamber when viewed in cross-section according to a plane which is parallel to a direction across the aligning passage, thereby preventing inadvertent retention of electronic component chips between the wall surface within the small chamber and facilitating their movement from the small chamber to the aligning passage.

Abstract: A film comprised of at least one monomolecular layer composed essentially of a polyimide having repeating units of the formula: ##STR1## wherein R.sup.1 is a tetravalent organic group and R.sup.2 is a bivalent organic group.