Abstract: A manufacturing method of a semiconductor element includes forming a plurality of islands, each including a semiconductor layer containing a nitride semiconductor and a support formed on the semiconductor layer, on a sapphire substrate, joining the support to a retention substrate via an adhesive member, peeling off the semiconductor layer from the sapphire substrate by irradiating the semiconductor layer with laser light, and polishing a surface of the semiconductor layers peeled off from the sapphire substrate.

Abstract: A manufacturing method of a semiconductor element includes forming a plurality of semiconductor layers on a sapphire substrate, each of the semiconductor layers having a first surface on the sapphire substrate side and a second surface on the opposite side, joining the second surfaces of the plurality of semiconductor layers to a retention member via an adhesive member, peeling off the plurality of semiconductor layers from the sapphire substrate by irradiating the first surfaces of the plurality of semiconductor layers with laser light, and polishing the first surfaces of the plurality of semiconductor layers. At least one semiconductor layer among the plurality of semiconductor layers includes a polishing indication part extending from the second surface toward the first surface. The polishing is executed until the polishing indication part is exposed to the polished surface.

Abstract: A semiconductor device includes: a planarized layer having insulating properties, the planarized layer having a first surface and a second surface opposite the first surface; a plurality of semiconductor elements formed on the first surface of the planarized layer; and a groove provided in the second surface of the planarized layer. The groove is formed in a region outside the plurality of semiconductor elements as viewed in a direction perpendicular to the first surface.

Abstract: A piezoelectric-body film joint substrate includes a substrate, a first electrode provided on the substrate, a first piezoelectric-body film stuck on the first electrode and including a first piezoelectric film and a first upper electrode film formed on the first piezoelectric film, a second electrode provided on the substrate, and a second piezoelectric-body film stuck on the second electrode and including a second piezoelectric film different from the first piezoelectric film and a second upper electrode film formed on the second piezoelectric film, wherein a height from an upper surface of the substrate, on which the first electrode and the second electrode are formed, to a top of the first upper electrode film and a height from the upper surface of the substrate to a top of the second upper electrode film differ from each other.

Abstract: A piezoelectric film integrated device includes a substrate; an electrode provided on the substrate; a first piezoelectric element that is provided on the electrode and includes a first monocrystalline piezoelectric film and a first electrode film superimposed on the first monocrystalline piezoelectric film; and a second piezoelectric element that is provided on the first piezoelectric element and includes a second monocrystalline piezoelectric film and a second electrode film superimposed on the second monocrystalline piezoelectric film.

Abstract: A piezoelectric film integrated device include a substrate; a first electrode provided on the substrate; a second electrode provided on the substrate; a first monocrystalline piezoelectric film provided on the first electrode; a second monocrystalline piezoelectric film provided on the second electrode and having a crystal structure different from a crystal structure of the first monocrystalline piezoelectric film; a third electrode provided on the first monocrystalline piezoelectric film; and a fourth electrode provided on the second monocrystalline piezoelectric film.

Abstract: A piezoelectric-body film joint substrate includes a substrate, a substrate electrode provided on the substrate, a first piezoelectric-body film stuck on the substrate electrode and including a first piezoelectric film and a first upper electrode film formed on the first piezoelectric film, and a second piezoelectric-body film stuck on the first upper electrode film and including a second piezoelectric film different from the first piezoelectric film and a second upper electrode film formed on the second piezoelectric film.

Abstract: An electronic structure includes: a substrate having a first surface; a functional element unit including a functional element having an electronic function, and a protector covering the functional element, the functional element unit having a second surface facing the first surface; a support disposed between the first surface and the second surface, the support supporting the second surface; and a projection disposed on a first surface side of the substrate, the projection projecting toward the functional element unit. The support has a third surface in contact with the second surface of the functional element unit, the third surface having an area smaller than an area of the second surface. The projection has a fourth surface in contact with or close to the functional element unit, the fourth surface having an area smaller than the area of the second surface, the projection being formed by a different material from the support.

Abstract: A humidity detection device includes a humidity sensor, a resistor connected to one-side of the humidity sensor, a first switching part connected to the resistor; a diode connected to the first switching part; a second switching part connected to the other-side of the humidity sensor, a potential difference generating part connected to the second switching part, a power supply supplying a voltage, and a control part applying the voltage as an alternating voltage to the humidity sensor by controlling the first switching part and the second switching part. The control part applies a current to the diode, the resistor and the humidity sensor in a first direction by connecting the second switching part to the ground, and applies the current to the resistor and the humidity sensor in a second direction, which is an opposite direction from the first direction, by connecting the first switching part to the ground.

Abstract: A light emitting device includes: a first layer in which a first light emitting element is disposed; a second layer stacked on the first layer and including a second light emitting element that at least partially overlaps the first light emitting element as viewed in a light emitting direction perpendicular to a light emitting surface of the first light emitting element; and a control substrate on which the first layer is stacked and that controls light emission of the first light emitting element and the second light emitting element. The first layer includes a first surface facing the second layer in the light emitting direction, a second surface facing the control substrate in the light emitting direction, and a first opening formed from the first surface to the second surface. The second light emitting element and the control substrate are electrically connected together through the first opening.

Abstract: A semiconductor element unit includes a semiconductor element; and a first electrode having a flat first electrode mounting surface whose surface roughness is less than or equal to 10 [nm] and forming eutectic bonding with the semiconductor element in a part different from the first electrode mounting surface. A semiconductor element unit supply substrate includes one or more semiconductor element units. A semiconductor packaging circuit includes the semiconductor element unit.

Abstract: A composite integrated film includes a base member thin film having a base member first surface and a base member second surface facing each other, one or more penetration parts penetrating the base member first surface and the base member second surface of the base member thin film, one or more electrodes each including an electrical path part formed between the base member first surface and the base member second surface via the penetration part and an electrode surface in a planar shape formed on the base member second surface's side, and one or more elements provided on the base member first surface of the base member thin film and electrically connected to the electrodes, wherein the electrode surface and the base member second surface form a same flat surface.

Abstract: A humidity detection device includes a humidity sensor, a resistor connected to one-side of the humidity sensor, a first switching part connected to the resistor; a diode connected to the first switching part; a second switching part connected to the other-side of the humidity sensor, a potential difference generating part connected to the second switching part, a power supply supplying a voltage, and a control part applying the voltage as an alternating voltage to the humidity sensor by controlling the first switching part and the second switching part. The control part applies a current to the diode, the resistor and the humidity sensor in a first direction by connecting the second switching part to the ground, and applies the current to the resistor and the humidity sensor in a second direction, which is an opposite direction from the first direction, by connecting the first switching part to the ground.

Abstract: An image forming apparatus includes a power supply voltage detector, a power supply cycle detector, a voltage converter, and a controller. The power supply voltage detector detects a power supply voltage value of a commercial alternating-current voltage. The power supply cycle detector detects a power supply cycle of the commercial alternating-current voltage. The voltage converter performs switching of the commercial alternating-current voltage, and thereby converts the commercial alternating-current voltage into a heater alternating-current voltage to be applied to a heater. The controller controls the voltage converter and thereby generates the heater alternating-current voltage, on a basis of the power supply voltage value detected by the power supply voltage detector and the power supply cycle detected by the power supply cycle detector.

Abstract: An image formation apparatus includes: one or more image formation units; one or more heaters; a first voltage converter which generates a direct first voltage based on an alternating external input voltage inputted from outside of the first voltage converter; a second voltage converter which generates an alternating second voltage based on the first voltage, the second voltage supplying alternating-current power to the one more heaters; a third voltage converter which generates a third voltage based on the first voltage, the third voltage being used to drive at least the one or more heaters; a controller which performs an operation control of reducing power consumption in at least the one or more heaters when the external input voltage decreases to a range of a first threshold or lower and higher than a second threshold and/or when a load change of the first voltage converter is lower than a third threshold.

Abstract: Provided is a power supply unit that includes a power factor correction circuit, a synchronizing signal generator, an alternating-current signal generator. The power factor correction circuit is configured to generate, based on a first alternating-current signal, a direct-current signal. The synchronizing signal generator is configured to generate, based on the first alternating-current signal, a synchronizing signal that is in synchronization with the first alternating-current signal. The alternating-current signal generator includes a switching section, and is configured to generate, based on the direct-current signal, a second alternating-current signal. The switching section is configured to perform, based on the synchronizing signal, a switching operation. The second alternating-current signal has a variable effective voltage value.

Abstract: Provided is a power supply unit that includes a switching section and a controller. The switching section is configured to perform a switching operation and thereby generate, based on an input signal, a first alternating-current signal. The controller is configured to control the switching operation and thereby perform an amplitude control that involves increasing, based on an input current in the switching section, a signal amplitude of the first alternating-current signal.

Abstract: An image formation apparatus includes: one or more image formation units; one or more heaters; a first voltage converter which generates a direct first voltage based on an alternating external input voltage inputted from outside of the first voltage converter; a second voltage converter which generates an alternating second voltage based on the first voltage, the second voltage supplying alternating-current power to the one more heaters; a third voltage converter which generates a third voltage based on the first voltage, the third voltage being used to drive at least the one or more heaters; a controller which performs an operation control of reducing power consumption in at least the one or more heaters when the external input voltage decreases to a range of a first threshold or lower and higher than a second threshold and/or when a load change of the first voltage converter is lower than a third threshold.

Abstract: A heater control device includes a power factor correction circuit configured to convert an alternate current voltage from a commercial power source to a direct current voltage; an inverter configured to generate a specific alternate current voltage from the direct current voltage converted with the power factor correction circuit; a heater configured to receive the specific alternate current voltage generated with the inverter; and an excessive temperature rise preventing portion configured to interrupt the specific alternate current voltage generated with the inverter from being supplied to the heater.

Abstract: An image forming apparatus includes a power supply voltage detector, a power supply cycle detector, a voltage converter, and a controller. The power supply voltage detector detects a power supply voltage value of a commercial alternating-current voltage. The power supply cycle detector detects a power supply cycle of the commercial alternating-current voltage. The voltage converter performs switching of the commercial alternating-current voltage, and thereby converts the commercial alternating-current voltage into a heater alternating-current voltage to be applied to a heater. The controller controls the voltage converter and thereby generates the heater alternating-current voltage, on a basis of the power supply voltage value detected by the power supply voltage detector and the power supply cycle detected by the power supply cycle detector.