Patents by Inventor Toru Kuki

Toru Kuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090133911
    Abstract: To provide a release film which is used to avoid adherence between a press hot plate and a printed circuit board or a cover lay film at the time of press work effected to printed circuit boards such as printed wiring boards, flexible printed circuit boards and multilayered printed circuit boards and which has a heat resistance, a releasing property, a non-contamination property, a follow up capability relative to the circuit pattern, an excellent workability during processing and a small environmental impact at the time of disposal, the release film has a shear modulus of 5×105˜107 Pa at a hot press lamination temperature and is formed by overlapping at least one thermoplastic resin layer and at least one metallic layer one above the other.
    Type: Application
    Filed: January 22, 2009
    Publication date: May 28, 2009
    Applicant: KURARAY CO., LTD.
    Inventors: Toru Kuki, Minoru Onodera, Makoto Asano
  • Patent number: 7009029
    Abstract: Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol % of terephthalic acid units, and diamine units containing 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 5 to 100 parts by weight of (B) a titanium oxide with an average particle size of 0.1 to 0.5 ?m. The polyamide composition shows excellent heat resistance enough to withstand the SMT process, and gives a molded article with excellent whiteness and surface-reflectance.
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: March 7, 2006
    Assignee: Kuraray Co., Ltd.
    Inventors: Hideaki Oka, Hideharu Matsuoka, Toru Kuki
  • Publication number: 20040034152
    Abstract: Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol % of terephthalic acid units, and diamine units containing 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 5 to 100 parts by weight of (B) a titanium oxide with an average particle size of 0.1 to 0.5 &mgr;m. The polyamide composition shows excellent heat resistance enough to withstand the SMT process, and gives a molded article with excellent whiteness and surface-reflectance.
    Type: Application
    Filed: June 19, 2003
    Publication date: February 19, 2004
    Applicant: Kuraray Co., Ltd.
    Inventors: Hideaki Oka, Hideharu Matsuoka, Toru Kuki
  • Patent number: 6258927
    Abstract: A polyamide composition, comprising: (A) 100 parts by weight of a polyamide, (B) from 10 to 200 parts by weight of an aromatic ring-containing bromine compound, and (C) from 0.1 to 100 parts by weight of at least one flame-retardant synergist selected from metal salts of stannic acid and alkaline earth metal salts of boric acid. The polyamide composition has good flame retardancy and heat resistance, and exhibits good thermal stability and continuous moldability when molded in melt, and it can be molded into good moldings having excellent appearances, especially fine color tone, without giving much gas.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: July 10, 2001
    Assignee: Kuraray Co., Ltd.
    Inventors: Hideaki Oka, Toru Kuki, Kozo Tamura
  • Patent number: 6140418
    Abstract: Described are a thermoplastic polymer composition comprising (A) a block copolymer formed of a polymer block composed mainly of an aromatic vinyl compound and another polymer block composed mainly of isobutylene; and (B) a crosslinked rubber of at least one rubber selected from natural rubber, diene polymer rubber, olefin polymer rubber, acrylic rubber and fluorine rubber at a weight ratio of 90:10 to 10:90; and molded or formed products and hermetically sealing materials produced using the composition. The above thermoplastic polymer composition is excellent in moldability or formability, gas barrier properties, compression set resistance, hermetically sealing properties, sealing properties, flexibility, mechanical properties, oil resistance, safety, hygienic properties and the like.
    Type: Grant
    Filed: May 21, 1998
    Date of Patent: October 31, 2000
    Assignee: Kuraray Co., Ltd.
    Inventors: Takashi Yamashita, Toru Kuki, Kenji Shachi
  • Patent number: 6106952
    Abstract: There is provided a thermoplastic polymer composition containing (i) 100 parts of a block copolymer comprising an aromatic vinyl block and a conjugated diene block, (ii) 5 to 200 parts of a polyurethane block copolymer having a thermoplastic polyurethane block, (iii) 10 to 300 parts of a thermoplastic polyurethane and (iv) 10 to 300 parts of a paraffin oil.
    Type: Grant
    Filed: March 3, 1999
    Date of Patent: August 22, 2000
    Assignee: Kuraray Co., Ltd.
    Inventors: Takashi Yamashita, Katsunori Takamoto, Shigeru Kawahara, Haruhisa Masuda, Toru Kuki