Patents by Inventor Toru Kuraishi

Toru Kuraishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Buildup board, and electronic component and apparatus having the buildup board
    Patent number: 8304662
    Abstract: A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and a conductor arranged around the insulating part on the same layer as the pad. The multilayer structure has at least two different keepouts where the keepout is defined as a minimum interval between an outline of the pad and the conductor closest to the pad on the same layer.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: November 6, 2012
    Assignee: Fujitsu Limited
    Inventors: Akiyoshi Saitou, Takeshi Midorikawa, Toru Kuraishi, Chikayuki Kumagai, Masashi Fujimoto, Kenichiro Abe
  • Buildup board, and electronic component and apparatus having the buildup board
    Publication number: 20070295533
    Abstract: A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and a conductor arranged around the insulating part on the same layer as the pad. The multilayer structure has at least two different keepouts where the keepout is defined as a minimum interval between an outline of the pad and the conductor closest to the pad on the same layer.
    Type: Application
    Filed: June 1, 2007
    Publication date: December 27, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Akiyoshi Saitou, Takeshi Midorikawa, Toru Kuraishi, Chikayuki Kumagai, Masashi Fujimoto, Kenichiro Abe
  • Circuit board
    Publication number: 20070144773
    Abstract: The present invention relates to a circuit board in which signal lines transmitting a signal are wired, and which is capable of increasing the speed of signal transmission. There is provided a circuit board in which signal lines are wired, including: a signal pad which is formed at the tip of the signal line and has a signal via in the center thereof; and plural ground vias which are formed in positions to surround the signal pad and transmit a ground potential over plural wiring layers.
    Type: Application
    Filed: March 27, 2006
    Publication date: June 28, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Akiyoshi Saitou, Toru Kuraishi, Takeshi Midorikawa, Chikayuki Kumagai, Masashi Fujimoto