Abstract: A scanning probe microscope is provided for scanning a sample surface with a probe formed on a cantilever and detecting an interaction acting between the probe and the sample surface to measure a physical property including a surface shape of the sample. The microscope includes an arrangement for detecting torsion of the cantilever and for correcting a profile error caused by deflection of the probe and torsion of the cantilever based on the amount of torsion which is detected.

Abstract: In the case of measuring a pattern having a steep side wall, a probe adheres to the side wall by the van der Waals forces acting between the probe and the side wall when approaching the pattern side wall, and an error occurs in a measured profile of the side wall portion. When a pattern having a groove width almost equal to a probe diameter is measured, the probe adheres to both side walls, the probe cannot reach the groove bottom, and the groove depth cannot be measured. When the probe adheres to a pattern side wall in measurements of a microscopic high-aspect ratio pattern using an elongated probe, the probe is caused to reach the side wall bottom by detecting the adhesion of the probe to the pattern side wall, and temporarily increasing a contact force between the probe and the sample. Also, by obtaining the data of the amount of torsion of a cantilever with the shape data of the pattern, a profile error of the side wall portion by the adhesion is corrected by the obtained data of the amount of torsion.

Abstract: In the case of measuring a pattern having a steep side wall, a probe adheres to the side wall by the van der Waals forces acting between the probe and the side wall when approaching the pattern side wall, and an error occurs in a measured profile of the side wall portion. When a pattern having a groove width almost equal to a probe diameter is measured, the probe adheres to both side walls, the probe cannot reach the groove bottom, and the groove depth cannot be measured. When the probe adheres to a pattern side wall in measurements of a microscopic high-aspect ratio pattern using an elongated probe, the probe is caused to reach the side wall bottom by detecting the adhesion of the probe to the pattern side wall, and temporarily increasing a contact force between the probe and the sample. Also, by obtaining the data of the amount of torsion of a cantilever with the shape data of the pattern, a profile error of the side wall portion by the adhesion is corrected by the obtained data of the amount of torsion.

Abstract: In the case of measuring a pattern having a steep side wall, a probe adheres to the side wall by the van der Waals forces acting between the probe and the side wall when approaching the pattern side wall, and an error occurs in a measured profile of the side wall portion. When a pattern having a groove width almost equal to a probe diameter is measured, the probe adheres to both side walls, the probe cannot reach the groove bottom, and the groove depth cannot be measured. When the probe adheres to a pattern side wall in measurements of a microscopic high-aspect ratio pattern using an elongated probe, the probe is caused to reach the side wall bottom by detecting the adhesion of the probe to the pattern side wall, and temporarily increasing a contact force between the probe and the sample. Also, by obtaining the data of the amount of torsion of a cantilever with the shape data of the pattern, a profile error of the side wall portion by the adhesion is corrected by the obtained data of the amount of torsion.

Abstract: A scanning probe microscope, capable of performing shape measurement not affected by electrostatic charge distribution of a sample, which: monitors an electrostatic charge state by detecting a change in a flexure or vibrating state of a cantilever due to electrostatic charges in synchronization with scanning during measurement with relative scanning between the probe and the sample, and makes potential adjustment so as to cancel an influence of electrostatic charge distribution, thus preventing damage of the probe or the sample due to discharge and achieving reduction in measurement errors due to electrostatic charge distribution.

Abstract: With a scanning probe microscope, if a plurality of sample properties are measured using a scanning scheme of allowing a probe to approach and withdraw from a sample, the sample properties need to be accurately and reliably detected in the minimum required measurement time. Further, the acting force between the probe and the sample varies depending on the type of the probe and the wear condition of a probe tip. Thus, disadvantageously, property values acquired using different probes cannot be compared with one another unless the artifactual effect of the measuring probes are eliminated. In accordance with the present invention, with a scanning probe microscope, the probe is brought into intermittent contact with the sample, while driving means repeatedly allows the probe to approach and withdraw from the sample with a variable amplitude. The sample property is thus acquired at a high speed.

Abstract: In the case of measuring a pattern having a steep side wall, a probe adheres to the side wall by the van der Waals forces acting between the probe and the side wall when approaching the pattern side wall, and an error occurs in a measured profile of the side wall portion. When a pattern having a groove width almost equal to a probe diameter is measured, the probe adheres to both side walls, the probe cannot reach the groove bottom, and the groove depth cannot be measured. When the probe adheres to a pattern side wall in measurements of a microscopic high-aspect ratio pattern using an elongated probe, the probe is caused to reach the side wall bottom by detecting the adhesion of the probe to the pattern side wall, and temporarily increasing a contact force between the probe and the sample. Also, by obtaining the data of the amount of torsion of a cantilever with the shape data of the pattern, a profile error of the side wall portion by the adhesion is corrected by the obtained data of the amount of torsion.

Abstract: A scanning probe microscope for measuring a surface profile of a sample by bringing a probe into close proximity to or contact with the surface of the sample and scanning the sample surface includes: a sample stage movable in at least one axis direction; the probe which is brought into close proximity to or contact with the surface of the sample mounted on the sample stage and scans the sample surface; a probe-driving unit for moving the probe three-dimensionally; a probe deflection detector for detecting a deflection of the probe; and an observation optical system which has an objective lens and observes the probe disposed on substantially the optical axis of the objective lens, and the sample. The probe-driving unit is disposed with three sets of paired drive sources arranged essentially with symmetry with respect to the optical axis of the objective lens.

Abstract: A measurement method of a scanning probe microscope including a first approach operation adjusting an operation position of a fine positioning unit to near a maximum extension amount and ending the approach by coarse positioning, a first measurement operation making the probe scan the surface for measurement in a close probe state based on the first approach operation to obtain relief information of the sample surface, a positioning operation positioning the probe at a recessed part based on the relief information obtained by the first measurement operation, a second approach operation making the probe again approach the surface at a position determined by the positioning operation, adjusting an operation position of the Z-axis fine positioning device to close to a maximum extension amount, and ending the repeated approach, and a second measurement operation making the probe scan the surface for measurement in a close probe state based on the second approach operation to obtain relief information of the sampl

Abstract: A scanning probe microscope, capable of performing shape measurement not affected by electrostatic charge distribution of a sample, which: monitors an electrostatic charge state by detecting a change in a flexure or vibrating state of a cantilever due to electrostatic charges in synchronization with scanning during measurement with relative scanning between the probe and the sample, and makes potential adjustment so as to cancel an influence of electrostatic charge distribution, thus preventing damage of the probe or the sample due to discharge and achieving reduction in measurement errors due to electrostatic charge distribution.

Abstract: This probe control method is applied to the scanning probe microscope having a probe section with a probe pointed at a sample, a detection section for detecting physical quantity between the sample and the probe, a measurement section for measuring the surface of the sample to obtain the surface information on the basis of the physical quantity when scanning the sample surface by the probe, and a movement mechanism with at least two degree of freedom. The probe control method has steps of moving the probe in a scanning direction different from the contact direction while making the probe come into contact with the sample surface, detecting the torsional state of the probe during the movement of the probe, and adjusting either or both of the rate in the scanning direction and the force in the contact direction on the basis of the detected value obtained by the detection step.

Abstract: With a scanning probe microscope, if a plurality of sample properties are measured using a scanning scheme of allowing a probe to approach and withdraw from a sample, the sample properties need to be accurately and reliably detected in the minimum required measurement time. Further, the acting force between the probe and the sample varies depending on the type of the probe and the wear condition of a probe tip. Thus, disadvantageously, property values acquired using different probes cannot be compared with one another unless the artifactual effect of the measuring probes are eliminated. In accordance with the present invention, with a scanning probe microscope, the probe is brought into intermittent contact with the sample, while driving means repeatedly allows the probe to approach and withdraw from the sample with a variable amplitude. The sample property is thus acquired at a high speed.

Abstract: A scanning probe microscope for measuring a surface profile of a sample by bringing a probe into close proximity to or contact with the surface of the sample and scanning the sample surface includes: a sample stage movable in at least one axis direction; the probe which is brought into close proximity to or contact with the surface of the sample mounted on the sample stage and scans the sample surface; a probe-driving unit for moving the probe three-dimensionally; a probe deflection detector for detecting a deflection of the probe; and an observation optical system which has an objective lens and observes the probe disposed on substantially the optical axis of the objective lens, and the sample. The probe-driving unit is disposed with three sets of paired drive sources arranged essentially with symmetry with respect to the optical axis of the objective lens.

Abstract: An automatically operated shovel, which includes a power shovel and an automatic operation controller 50 for making the power shovel reproduce a series of taught operations ranging from digging to dumping, is characterized in that the automatic operation controller is provided with a positioning determinator for determining whether or not the power shovel has reached within a taught position range predetermined based on corresponding one of positioning accuracies set for individual taught positions of said power shovel, and, when the power shovel is determined to have reached within the predetermined taught position range, the automatic operation controller outputs a next taught position as a target position.

Abstract: An automatically operated shovel, which includes a power shovel and an automatic operation controller 50 for making the power shovel reproduce a series of taught operations ranging from digging to dumping, is characterized in that the automatic operation controller is provided with a positioning determination means 511 for determining whether or not the power shovel has reached within a taught position range predetermined based on corresponding one of positioning accuracies set for individual taught positions of said power shovel, and, when the power shovel is determined to have reached within the predetermined taught position range, the automatic operation controller outputs a next taught position as a target position.

Abstract: An automatically operated shovel, which includes a power shovel and an automatic operation controller 50 for making the power shovel reproduce a series of taught operations ranging from digging to dumping, is characterized in that the automatic operation controller is provided with a positioning determination means 511 for determining whether or not the power shovel has reached within a taught position range predetermined based on corresponding one of positioning accuracies set for individual taught positions of said power shovel, and, when the power shovel is determined to have reached within the predetermined taught position range, the automatic operation controller outputs a next taught position as a target position.

Abstract: A system for controlling an industrial robot, which is simplified in operation and capable of direct-teaching safely all the time. The system is provided with means (131 and 132) for monitoring a magnitude of an external force applied to the forward end of a hand during direct teaching, so that the motion of the robot can be forcibly restricted when the external force reaches a predetermined value of thereabove. Furthermore, when the system is operated to be set in a direct teach mode, a process (136) of correcting the offset of a force sensor is performed automatically.

Abstract: The position/force of a machine tool or robot end effecter having at least two degrees of freedom of movement is controlled. A first setting device sets the position command and/or posture command of the working tool on a machine. The instant position and/or posture of the working tool is detected. The force command and/or moment command for commanding the force and/or moment to be applied to the working tool is set, and the instant force and/or moment acting on the working tool is detected. A computing device determines from the position command and/or posture command and the instant position and/or posture, the position and/or posture offset in terms of the coordinate values of an operation coordinate system. A second computing device determines from the force command and/or moment command and the instant force and/or instant moment, force and/or moment offset in terms of the coordinate values of the operation coordinate system.