Abstract: To increase the manufacturing yield of semiconductor devices by improving a joint failure of a bump electrode. In a semiconductor device in which a plurality of boding pads 4 formed on a front surface of a semiconductor chip 3 and a plurality of leads 2 are connected via a plurality of bump electrodes 5, respectively, the upper surface of the leads 2 is formed into a semi-glossy surface having a roughness a maximum height (Ry) of which is in a range greater than 0 ?m and not greater than 20 ?m (0 ?m<maximum height (Ry)?20 ?m), not into a planar surface (maximum height (Ry) =0).

Abstract: To increase the manufacturing yield of semiconductor devices by improving a joint failure of a bump electrode. In a semiconductor device in which a plurality of boding pads 4 formed on a front surface of a semiconductor chip 3 and a plurality of leads 2 are connected via a plurality of bump electrodes 5, respectively, the upper surface of the leads 2 is formed into a semi-glossy surface having a roughness a maximum height (Ry) of which is in a range greater than 0 ?m and not greater than 20 ?m (0 ?m<maximum height (Ry)?20 ?m), not into a planar surface (maximum height (Ry)=0).

Abstract: Plural inlets 1 are formed by a separation into individual pieces, and these plural inlets are arranged to a tape-like carrier such that the long side of each of the plural inlets is along the longitudinal direction of the tape-like carrier, whereby cost can be reduced by rearranging the inlets to the cheap tape-like carrier. Further, the plural inlets formed by separating into individual pieces are rearranged onto the tape-like carrier, whereby the change of the arrangement pitch of the inlets so as to correspond to the size of a final product at a customer side can be facilitated, and days taken for the development for newly supplying the inlets can be shortened.

Abstract: Plural inlets 1 are formed by a separation into individual pieces, and these plural inlets are arranged to a tape-like carrier such that the long side of each of the plural inlets is along the longitudinal direction of the tape-like carrier, whereby cost can be reduced by rearranging the inlets to the cheap tape-like carrier. Further, the plural inlets formed by separating into individual pieces are rearranged onto the tape-like carrier, whereby the change of the arrangement pitch of the inlets so as to correspond to the size of a final product at a customer side can be facilitated, and days taken for the development for newly supplying the inlets can be shortened.