Abstract: A heater element includes: a honeycomb structure including an outer peripheral wall and partition walls disposed on an inner side of the outer peripheral wall, the partition walls defining a plurality of cells, each of the cells extending from a first end face to a second end face to form a flow path; a pair of electrode layers provided on the outer peripheral wall and the partition walls on the first end face and the second end face; and terminals capable of electrically connecting the electrode layers to a conducting wire. At least a part of each of the electrode layers has an extending portion extending outwardly from an outer edge of each of the first end face and the second end face. Each of the terminals is connected to the extending portion and disposed to face a side surface of the honeycomb structure.

Abstract: A power supply unit for an aerosol generating device, includes a power supply, a heater connector connected to a heater configured to heat an aerosol source by consuming power supplied from the power supply, a case which constitutes a surface of the power supply unit, and a sensor which is disposed in the vicinity of the case and is configured to output a value related to a temperature of the case. Protection control for prohibiting one or both of charging of the power supply and discharging from the power supply to the heater is executed based on an output value of the sensor.

Abstract: The provided power semiconductor module is configured to reduce the wiring inductance and save space on the substrate by establishing a multi-parallel connection between multiple power semiconductor chips. It consists of a first and second insulated substrates with a plurality of semiconductor switching elements positioned on one and facing the other. There are also first and second spacer conductors positioned between the plurality of semiconductor switching elements and the second insulated substrate. Inter-spacer-conductor wiring parts are connected with the plurality of second spacer conductors.

Abstract: To provide a semiconductor device signal transmission circuit for drive-control, a method of controlling a semiconductor device signal transmission circuit for drive-control, a semiconductor device, a power conversion device, and an electric system for a railway vehicle capable of preventing malfunction due to noise while speeding up or reducing loss of a switching operation. The semiconductor device signal transmission circuit for drive-control that is connected between a semiconductor device constituting an arm in a power conversion device and a drive circuit configured to drive the semiconductor device, including: an inductor; and an impedance circuit including a switch and connected in parallel with the inductor.

Abstract: The invention provides a gate drive device, a gate drive method, a power semiconductor module, and an electric power conversion device capable of reducing a negative gate surge voltage. The gate drive device drives a semiconductor device constituting an arm in an electric power conversion device. Before a turn-off start of a drive arm, in a counter arm, a voltage between one main terminal of the semiconductor device and a gate terminal of the semiconductor device is charged to a voltage value that is larger, in a positive direction, than a negative voltage of a negative gate power supply and smaller than a gate threshold voltage of the semiconductor device.

Abstract: There is provided a power semiconductor module with multiple semiconductor chips arranged in parallel on an insulated substrate, allowing for high density mounting of semiconductor chips and highly reliable with less difference in operating characteristics from one semiconductor chip to another. The above module includes an insulated substrate; a first conductive pattern laid out on the insulated substrate; multiple power semiconductor chips arranged on the first conductive pattern; a first wiring formed to bridge and directly connecting respective gate electrodes of the power semiconductor chips; and a second wiring formed to bridge and directly connecting respective source electrodes of the power semiconductor chips, wherein the first wiring is placed alongside of the second wiring and may be angled within 30 degrees with respect to the second wiring.

Abstract: The invention provides a gate drive device, a gate drive method, a power semiconductor module, and an electric power conversion device capable of reducing a negative gate surge voltage. The gate drive device drives a semiconductor device constituting an arm in an electric power conversion device. Before a turn-off start of a drive arm, in a counter arm, a voltage between one main terminal of the semiconductor device and a gate terminal of the semiconductor device is charged to a voltage value that is larger, in a positive direction, than a negative voltage of a negative gate power supply and smaller than a gate threshold voltage of the semiconductor device.

Abstract: To provide a semiconductor device signal transmission circuit for drive-control, a method of controlling a semiconductor device signal transmission circuit for drive-control, a semiconductor device, a power conversion device, and an electric system for a railway vehicle capable of preventing malfunction due to noise while speeding up or reducing loss of a switching operation. The semiconductor device signal transmission circuit for drive-control that is connected between a semiconductor device constituting an arm in a power conversion device and a drive circuit configured to drive the semiconductor device, including: an inductor; and an impedance circuit including a switch and connected in parallel with the inductor.

Abstract: When a distance between an end portion of a brazing material and a downward extended line of a side surface of an insulating substrate is taken as “a”, and a distance between an end portion of a solder resist on the side of a solder and the downward extended line of the side surface of the insulating substrate is taken as “b”, the positional relationship a<b is satisfied. The position of the end portion of the solder is regulated by the solder resist, and the position of the end portion of the brazing material on the side of the side surface of the insulating substrate is closer to the side of the side surface of the insulating substrate than to the position of the end portion of the solder on the side of the side surface of the insulating substrate.

Abstract: An acoustic emission wave detection system and an acoustic emission wave detector are provided. The acoustic emission wave detection system includes an acoustic emission wave detector, a photoelectric converter, and a determination processor. The acoustic emission wave detector includes a housing, an optical fiber that guides light from a wideband light source into the housing, and an FBG housed in the housing and having a diffractive grating that reflects light guided into the housing. The FBG is fixed on a side of the other end in the housing such that the light guided into the housing is received by one end thereof. An acoustic emission wave from a high-voltage apparatus is received by the other end thereof. Due to the insulation resistance of the FBG, the acoustic wave detector can be installed close to or in contact with the high-voltage apparatus without introducing discharges or noise from the high-voltage apparatus.

Abstract: When a distance between an end portion of a brazing material and a downward extended line of a side surface of an insulating substrate is taken as “a”, and a distance between an end portion of a solder resist on the side of a solder and the downward extended line of the side surface of the insulating substrate is taken as “b”, the positional relationship a<b is satisfied. The position of the end portion of the solder is regulated by the solder resist, and the position of the end portion of the brazing material on the side of the side surface of the insulating substrate is closer to the side of the side surface of the insulating substrate than to the position of the end portion of the solder on the side of the side surface of the insulating substrate.

Abstract: The object of the present invention is to compensate for a difference in threshold voltage between a plurality of switching devices incorporated in a power module. The present invention solves the subject described above by mounting a switching device having a high threshold voltage in comparison with a different switching device at a location at which the temperature of the power module during operation is higher than that at another location at which the different switching device is mounted. Eventually, a power conversion apparatus of a high performance and a vehicle drive apparatus of a high performance can be provided.

Abstract: A first conductive pattern includes: a first feeding point for supplying a potential to the first conductive pattern located at one end thereof; one or more diode elements located over the first conductive pattern; and a plurality of switching elements over the first conductive pattern on the opposite side to the first feeding point with the diode elements in between. A second conductive pattern includes a second feeding point that is provided in proximity to the first feeding point and supplies a potential different from that for the first conductive pattern to the second conductive pattern. The plurality of the switching elements is electrically connected with the second conductive pattern through a plurality of bonding wires. The second conductive pattern is provided with a slit pattern that defines an area of connection of the plurality of the bonding wires with the second conductive pattern over the second conductive pattern.

Abstract: The object of the present invention is to compensate for a difference in threshold voltage between a plurality of switching devices incorporated in a power module. The present invention solves the subject described above by mounting a switching device having a high threshold voltage in comparison with a different switching device at a location at which the temperature of the power module during operation is higher than that at another location at which the different switching device is mounted. Eventually, a power conversion apparatus of a high performance and a vehicle drive apparatus of a high performance can be provided.

Abstract: An acoustic emission wave detector includes a housing, an optical fiber that guides light from a wideband light source into the housing, and an FBG housed in the housing and having a diffractive grating that reflects light guided into the housing. The FBG is fixed on a side of the other end in the housing such that the light guided into the housing is received by one end thereof. An acoustic emission wave from a high-voltage apparatus is received by the other end thereof.

Abstract: A first conductive pattern includes: a first feeding point for supplying a potential to the first conductive pattern located at one end thereof; one or more diode elements located over the first conductive pattern; and a plurality of switching elements over the first conductive pattern on the opposite side to the first feeding point with the diode elements in between. A second conductive pattern includes a second feeding point that is provided in proximity to the first feeding point and supplies a potential different from that for the first conductive pattern to the second conductive pattern. The plurality of the switching elements is electrically connected with the second conductive pattern through a plurality of bonding wires. The second conductive pattern is provided with a slit pattern that defines an area of connection of the plurality of the bonding wires with the second conductive pattern over the second conductive pattern.

Abstract: There are provided a variable inductor with little degradation in quality factor, and an oscillator and a communication system using the variable inductor. An inductance controller comprising a reactance device with a variable device value, such as, for example, a variable capacitor, is connected to a secondary inductor, magnetically coupled to a primary inductor through mutual inductance. The inductance controller is provided with an inductance control terminal for receiving a control signal for controlling capacitance of the variable capacitor. Inductance of the primary inductor is varied by varying the capacitance by the control signal.

Abstract: There is disclosed a variable-gain amplifier circuit that operates on a low voltage, exhibits low distortion, provides a wide range of variation, and is suitable for use in a low-power-consumption wireless communication system. The variable-gain amplifier circuit is configured so that a variable-load circuit, which includes three reactance function elements and provides a wide range of impedance variation, is connected to a conductor circuit whose output terminal generates a positive-phase output current proportional to conductance with respect to an input voltage.

Abstract: The present invention provides a semiconductor integrated circuit including an active mixer circuit that is operated at low voltage, low noise, and low power consumption. It includes a transconductance amplifier, a transformer, and a multiplier, connects a transformer between the transconductance amplifier and the multiplier, and separates between the transconductance amplifier and the multiplier with respect to direct current inside the transformer. Further, each of the tranconductance amplifier and the multiplier is configured of transistors that are single-stacked between the supply voltage terminal and ground terminal.

Abstract: There are provided a variable inductor with little degradation in quality factor, and an oscillator and a communication system using the variable inductor. An inductance controller comprising a reactance device with a variable device value, such as, for example, a variable capacitor, is connected to a secondary inductor, magnetically coupled to a primary inductor through mutual inductance. The inductance controller is provided with an inductance control terminal for receiving a control signal for controlling capacitance of the variable capacitor. Inductance of the primary inductor is varied by varying the capacitance by the control signal.