Abstract: An evaluation method of an image stabilization effect of an imaging device includes calculating an evaluation value of the image stabilization effect on the basis of shutter speed values in case of which each of a reference shake amount theoretically calculated on the basis of a shake waveform applied to the imaging device and a measured shake amount calculated using an image captured in a state in which the imaging device is vibrated becomes a specified shake amount, and setting the specified shake amount. The setting includes calculating an image deterioration amount of the imaging device caused by something other than a shake from the outside, and selecting a determination level that defines the specified shake amount from a plurality of determination levels having different shake amounts on the basis of the image deterioration amount.

Abstract: A fan includes: a casing including a substantially cup-shaped base portion connected to an outer frame through a rib, the base portion having a top surface located on a upper side of an axial direction and a lower opening located on a lower side of the axial direction; a bearing housing hanging down from a center of the top surface of the base portion toward the lower opening; a stator housing portion formed by the base portion and the bearing housing; a stator having a circuit board disposed in the stator housing portion by being fitted to an outer peripheral surface of the bearing housing; bearings fitted to an inner peripheral surface of the bearing housing; an impeller rotating around a shaft as a central axis, shaft being rotatably supported by the bearings; and an insulating material filling the stator housing portion to cover the stator and the circuit board.

Abstract: There is reduced the difference in inductance between bonding wires to be coupled to two semiconductor chips stacked one over another. A semiconductor device includes external terminals, lower and upper semiconductor chips, and first and second bonding wires. The lower semiconductor chip has first bonding pads, and the upper semiconductor chip has second bonding pads. The first bonding wire couples the first bonding pad of the lower semiconductor chip and the external terminal, and the second bonding wire couples the second bonding pad of the upper semiconductor chip and the external terminal. The diameter of the second bonding wire is larger than the diameter of the first bonding wire.

Abstract: A fan includes: a casing including a substantially cup-shaped base portion connected to an outer frame through a rib, the base portion having a top surface located on a upper side of an axial direction and a lower opening located on a lower side of the axial direction; a bearing housing hanging down from a center of the top surface of the base portion toward the lower opening; a stator housing portion formed by the base portion and the bearing housing; a stator having a circuit board disposed in the stator housing portion by being fitted to an outer peripheral surface of the bearing housing; bearings fitted to an inner peripheral surface of the bearing housing; an impeller rotating around a shaft as a central axis, shaft being rotatably supported by the bearings; and an insulating material filling the stator housing portion to cover the stator and the circuit board.

Abstract: A rotary cutting tool is provided with a tool body having a shank portion and a neck portion, an insert attachment seat formed at the tip of the neck portion, and a cutting insert detachably mounted on the insert attachment seat so as to be coaxial with the axis line of the shank portion. The insert attachment seat is provided with a bottom surface on which a side surface which serves as a seating surface of a cutting insert is seated and a wall surface in contact with a peripheral surface of the cutting insert. On the bottom surface, a plurality of recessed grooves which are recessed from the bottom surface to extend in the circumferential direction of the neck portion, with the both ends being opened on an outer peripheral surface of the neck portion.

Abstract: There is reduced the difference in inductance between bonding wires to be coupled to two semiconductor chips stacked one over another. A semiconductor device includes external terminals, lower and upper semiconductor chips, and first and second bonding wires. The lower semiconductor chip has first bonding pads, and the upper semiconductor chip has second bonding pads. The first bonding wire couples the first bonding pad of the lower semiconductor chip and the external terminal, and the second bonding wire couples the second bonding pad of the upper semiconductor chip and the external terminal. The diameter of the second bonding wire is larger than the diameter of the first bonding wire.

Abstract: The rotary cutting tool is provided with a tool body (11) having a shank portion (11A) and a neck portion (11B), an insert attachment seat (12) formed at the tip of the neck portion (11 B), and a cutting insert detachably mounted on the insert attachment seat (12) so as to be coaxial with the axis line of the shank portion (11A). The insert attachment seat (12) is provided with a bottom surface (12A) on which a side surface which serves as a seating surface of a cutting insert is seated and a wall surface (12B) in contact with a peripheral surface of the cutting insert. On the bottom surface (12A), a plurality of recessed grooves (20) which are recessed from the bottom surface to extend in the circumferential direction of the neck portion (11 B), with the both ends being opened on an outer peripheral surface of the neck portion (11B), are formed so as to travel around the insert attachment seat (12) around the axis line (O).

Abstract: A method for manufacturing a throwaway tip is presented in which a green compact Q obtained by press-forming raw material powder for the throwaway tip is placed and sintered on a sintering plate 8. The green compact Q is press-formed so that the density of the raw material powder is gradually decreased toward a predetermined direction R, and the direction R is oriented substantially toward the outer circumference of the sintering plate 8 in plan view. Thus, it is possible to obtain a throwaway tip having sintering accuracy.

Abstract: A method for manufacturing a throwaway tip is presented in which a green compact Q obtained by press-forming raw material powder for the throwaway tip is placed and sintered on a sintering plate 8. The green compact Q is press-formed so that the density of the raw material powder is gradually decreased toward a predetermined direction R, and the direction R is oriented substantially toward the outer circumference of the sintering plate 8 in plan view. Thus, it is possible to obtain a throwaway tip having sintering accuracy.

Abstract: There is disclosed an insert cutter which includes a tool body having a plurality of mounting recesses formed in an outer peripheral surface thereof and a plurality of cutter inserts each releasably secured to a respective one of the mounting recesses and a plurality of pressing members each received in a respective one of the holes. Each of the mounting recesses defines an abutment face facing axially forwardly of the tool body. The tool body has a plurality of holes formed in the outer peripheral surface thereof and extending radially inwardly thereof. Each of the holes has an inner wall and is displaced rearwardly of the tool body from a respective one of the mounting recesses. Each of the cutter inserts has a face held in contact with the abutment face of a respective one of the mounting recesses. Each pressing member is pressed against the inner wall of the hole, whereby that portion of the tool body between the hole and the mounting recess is elastically deformed.