Abstract: An evaluation method of an image stabilization effect of an imaging device includes calculating an evaluation value of the image stabilization effect on the basis of shutter speed values in case of which each of a reference shake amount theoretically calculated on the basis of a shake waveform applied to the imaging device and a measured shake amount calculated using an image captured in a state in which the imaging device is vibrated becomes a specified shake amount, and setting the specified shake amount. The setting includes calculating an image deterioration amount of the imaging device caused by something other than a shake from the outside, and selecting a determination level that defines the specified shake amount from a plurality of determination levels having different shake amounts on the basis of the image deterioration amount.

Abstract: An optical device includes a translucent member, and a light shielding member formed on the translucent member and having a first opening. A portion of the light shielding member corresponding to a side surface of the first opening is formed into an inclined surface. A method of manufacturing the optical device includes: forming a mask having a second opening on the translucent member such that the second opening corresponds to a shape and a forming area of the light shielding member; filling a Cr-containing resin, in which particles containing Cr are contained in a resin, into the second opening by a printing method; curing the Cr-containing resin filled in the opening to form the light shielding member made of the cured Cr-containing resin; and removing the mask.

Abstract: Disclosed is a nickel electroplating bath or a nickel alloy electroplating bath used for electroplating a conductor partially masked with an organic high-molecular resist layer, wherein the nickel electroplating bath contains a water-soluble nickel salt, and the nickel alloy electroplating bath contains both a water-soluble nickel salt and a water-soluble salt of a metal capable of being alloyed with nickel. The above electroplating bath is incorporated with an electrical conductive salt containing at least one cation selected from the group consisting of an ammonium ion, magnesium ion, calcium ion, aluminum ion, and barium ion. Further, the electrical conductive salt substantially does not contain a sodium ion and a potassium ion as cations. Such an electroplating bath is capable of electroplating a conductor partially masked with an organic high-molecular resist layer without floating of the resist layer.