Patents by Inventor Toru Numada

Toru Numada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5406119
    Abstract: A lead frame includes outer leads each having a thinner portion made by coining, for example, so that a prefabricated tip is formed thereat before the soldering process by cutting the thinner portion. The prefabricated tip is coated with the solder at the soldering stage. Therefore, it is easy to provide stable and reliable connections of leads thus formed to pads of a printed circuit board to mount a semiconductor device having the leads on the printed circuit board.
    Type: Grant
    Filed: March 30, 1992
    Date of Patent: April 11, 1995
    Assignee: NEC Corporation
    Inventor: Toru Numada