Patents by Inventor Toru Okamoto
Toru Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8490334Abstract: A glass run includes an upper side portion, a front vertical portion, a rear vertical portion, a front corner portion, a rear corner portion and an ornamental molding portion. An upper end of the molding portion is integrally jointed to the rear corner portion, and a lower end of the ornamental molding portion extends obliquely so as to be positioned frontwardly of the rear corner portion. The ornamental molding portion includes a base part and an ornamental lip part. The base part and the ornamental lip part hold a tip end of an outer panel of the door frame. The ornamental lip part is formed such that an upper end thereof is formed continuously with an outer cover lip of the rear corner portion, and a lower end thereof contacts an outer weather strip.Type: GrantFiled: December 9, 2011Date of Patent: July 23, 2013Assignee: Toyoda Gosei Co., Ltd.Inventors: Yoshihiro Miura, Yuki Ichinoo, Toru Okamoto
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Patent number: 8325005Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.Type: GrantFiled: June 20, 2011Date of Patent: December 4, 2012Assignee: Vishay International, Ltd.Inventors: Joseph Szwarc, Dany Mazliah, Makio Sato, Toru Okamoto
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Publication number: 20120151842Abstract: A glass run includes an upper side portion, a front vertical portion, a rear vertical portion, a front corner portion, a rear corner portion and an ornamental molding portion. An upper end of the molding portion is integrally jointed to the rear corner portion, and a lower end of the ornamental molding portion extends obliquely so as to be positioned frontwardly of the rear corner portion. The ornamental molding portion includes a base part and an ornamental lip part. The base part and the ornamental lip part hold a tip end of an outer panel of the door frame. The ornamental lip part is formed such that an upper end thereof is formed continuously with an outer cover lip of the rear corner portion, and a lower end thereof contacts an outer weather strip.Type: ApplicationFiled: December 9, 2011Publication date: June 21, 2012Applicant: Toyoda Gosei Co., Ltd.Inventors: Yoshihiro MIURA, Yuki Ichinoo, Toru Okamoto
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Patent number: 8163334Abstract: A method for applying an electrode mixture paste includes unwinding a core material wound in a coil shape; applying an electrode mixture paste to both sides of the core material; adjusting an application amount of the electrode mixture paste; drying a paste-coated sheet with the electrode mixture paste applied to the both sides thereof; and winding the paste-coated sheet in a coil shape. The electrode mixture paste is circulated and supplied by a circulation means having a storage function and a stirring function. The application method can achieve stable application accuracy even when a paste-coated sheet is continuously produced using a plurality of lots of electrode mixture pastes containing different types of powders having a large difference in the specific gravity.Type: GrantFiled: April 26, 2006Date of Patent: April 24, 2012Assignee: Panasonic CorporationInventors: Toru Okamoto, Hiroyuki Usui, Shinichi Nishida
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Patent number: 8142837Abstract: An electrode mixture paste application method includes: a first step of unwinding a core material (2) wound in a coil shape; a second step of applying an electrode mixture paste (5) to both sides of the core material; a third step of adjusting an application amount of the electrode mixture paste; a fourth step of drying a paste-coated sheet with the electrode mixture paste applied to the both sides thereof; and a fifth step of winding the paste-coated sheet (6) in a coil shape, wherein, in the fifth step, the paste-coated sheet is wound such that each of widthwise edge portions of a mixture-formed portion (9) is prevented from sequentially overlapping itself. This can achieve a stable method for applying an electrode mixture paste in which the deformation of an electrode caused by a dog-bone shape generated at both edge portions of a mixture-formed portion can be avoided.Type: GrantFiled: April 26, 2006Date of Patent: March 27, 2012Assignee: Panasonic CorporationInventors: Takashi Okawa, Toru Okamoto, Tomoki Ikeda, Masao Fukuda
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Patent number: 8119190Abstract: A method for applying an electrode mixture paste includes: a first step of unwinding a core material (2) wound in a coil shape; a second step of applying an electrode mixture paste (5) onto the core material; a third step of adjusting an application amount of the electrode mixture paste; a fourth step of drying a paste-coated sheet (6) with the electrode mixture paste applied to the both sides thereof; and a fifth step of winding the paste-coated sheet in a coil shape. In this method, in one of the second and third steps, a core material-exposed portion (9) to which the electrode mixture paste is not applied is provided in both edge portions in a width direction of the core material, and, in the fourth step, a holding unit is provided in at least one position, the holding unit continuously holding the core material-exposed portion between a wheel type roller (10) and a contact belt (11) and changing a traveling direction of the paste-coated sheet.Type: GrantFiled: March 6, 2006Date of Patent: February 21, 2012Assignee: Panasonic CorporationInventors: Hiroyuki Usui, Masahiko Kato, Toru Okamoto, Tadakazu Seto
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Publication number: 20110241819Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.Type: ApplicationFiled: June 20, 2011Publication date: October 6, 2011Applicant: VISHAY INTERNATIONAL, LTD.Inventors: Joseph Szwarc, Dany Mazliah, Makio Sato, Toru Okamoto
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Patent number: 7982579Abstract: The metal foil resistor having a metal foil resistive element 20 composed of a metal foil whereupon a resistance circuit pattern is formed. The metal foil resistor comprises: a package 10 which contains the metal foil resistive element 20 in an electrically insulated state so that the resistive element can be expandable and contractible in a spreading direction of the metal foil; and a relay terminal 26 which is held in the package 10 in the electrically insulated state and is connected to an electrode 20a of the metal foil resistive element 20. A temperature coefficient of resistance can be reduced and stabilized. Control factors can be reduced to increase degrees in freedom in designing. Further, an external stress applied to a package is prevented from transmitting to the metal foil resistive element, and therefore the package can be easily attached to a discretionary heat sink.Type: GrantFiled: October 2, 2006Date of Patent: July 19, 2011Assignee: Alpha Electronics CorporationInventors: Matsuo Zama, Toru Okamoto
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Patent number: 7965169Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.Type: GrantFiled: February 22, 2008Date of Patent: June 21, 2011Inventors: Joseph Szwarc, Dany Mazliah, Makio Sato, Toru Okamoto
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Patent number: 7751381Abstract: To provide a wireless base station comprising an array antenna which transmits packets to terminals, a packet scheduler which determines transmission sequence of the packets, a modulator which generates modulated signals based on the packets, and a beam former for transmission signal which multiplies the packets with array weights for transmission signal and outputs the transmission signal to the array antenna the beam former for transmission signal comprises a memory which stores the array weights for transmission signal associated with the terminals' IDs. The beam former for transmission signal receives the IDs of selected terminals from the packet scheduler, refers to the memory, and selects the array weights for transmission signal by the IDs of the terminals.Type: GrantFiled: February 25, 2005Date of Patent: July 6, 2010Assignees: Hitachi, Ltd., Hitachi Communication Technologies, Ltd., Hitachi Advanced Systems CorporationInventors: Mikio Kuwahara, Kenzaburo Fujishima, Masanori Taira, Koji Meguro, Toru Okamoto
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Publication number: 20090267726Abstract: The metal foil resistor having a metal foil resistive element 20 composed of a metal foil whereupon a resistance circuit pattern is formed. The metal foil resistor comprises: a package 10 which contains the metal foil resistive element 20 in an electrically insulated state so that the resistive element can be expandable and contractible in a spreading direction of the metal foil; and a relay terminal 26 which is held in the package 10 in the electrically insulated state and is connected to an electrode 20a of the metal foil resistive element 20. A temperature coefficient of resistance can be reduced and stabilized. Control factors can be reduced to increase degrees in freedom in designing. Further, an external stress applied to a package is prevented from transmitting to the metal foil resistive element, and therefore the package can be easily attached to a discretionary heat sink.Type: ApplicationFiled: October 2, 2006Publication date: October 29, 2009Applicant: Alpha Electronics CorporationInventors: Matsuo Zama, Toru Okamoto
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Publication number: 20090212900Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.Type: ApplicationFiled: February 22, 2008Publication date: August 27, 2009Applicant: VISHAY INTERTECHNOLOGY, LTD.Inventors: JOSEPH SZWARC, DANY MAZLIAH, MAKIO SATO, TORU OKAMOTO
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Publication number: 20090104344Abstract: A method for applying an electrode mixture paste includes: a first step of unwinding a core material (2) wound in a coil shape; a second step of applying an electrode mixture paste (5) to both sides of the core material; a third step of adjusting an application amount of the electrode mixture paste; a fourth step of drying a paste-coated sheet (6) with the electrode mixture paste applied to the both sides thereof; and a fifth step of winding the paste-coated sheet in a coil shape. In this method, in the second step, the electrode mixture paste is circulated and supplied by circulation means (9, 10), and the circulation means has a storage function (9) and a stirring function (11). The application method can achieve stable application accuracy even when a paste-coated sheet is continuously produced using a plurality of lots of electrode mixture pastes containing different types of powders having a large difference in the specific gravity.Type: ApplicationFiled: April 26, 2006Publication date: April 23, 2009Applicant: PANASONIC CORPORATIONInventors: Toru Okamoto, Hiroyuki Usui, Shinichi Nishida
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Publication number: 20090098277Abstract: An electrode mixture paste application method includes: a first step of unwinding a core material (2) wound in a coil shape; a second step of applying an electrode mixture paste (5) to both sides of the core material; a third step of adjusting an application amount of the electrode mixture paste; a fourth step of drying a paste-coated sheet with the electrode mixture paste applied to the both sides thereof; and a fifth step of winding the paste-coated sheet (6) in a coil shape, wherein, in the fifth step, the paste-coated sheet is wound such that each of widthwise edge portions of a mixture-formed portion (9) is prevented from sequentially overlapping itself. This can achieve a stable method for applying an electrode mixture paste in which the deformation of an electrode caused by a dog-bone shape generated at both edge portions of a mixture-formed portion can be avoided.Type: ApplicationFiled: April 26, 2006Publication date: April 16, 2009Inventors: Takashi Okawa, Toru Okamoto, Tomoki Ikeda, Masao Fukuda
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Publication number: 20090068346Abstract: A method for applying an electrode mixture paste includes: a first step of unwinding a core material (2) wound in a coil shape; a second step of applying an electrode mixture paste (5) onto the core material; a third step of adjusting an application amount of the electrode mixture paste; a fourth step of drying a paste-coated sheet (6) with the electrode mixture paste applied to the both sides thereof; and a fifth step of winding the paste-coated sheet in a coil shape. In this method, in one of the second and third steps, a core material-exposed portion (9) to which the electrode mixture paste is not applied is provided in both edge portions in a width direction of the core material, and, in the fourth step, a holding unit is provided in at least one position, the holding unit continuously holding the core material-exposed portion between a wheel type roller (10) and a contact belt (11) and changing a traveling direction of the paste-coated sheet.Type: ApplicationFiled: March 6, 2006Publication date: March 12, 2009Inventors: Hiroyuki Usui, Masahiko Kato, Toru Okamoto, Tadakazu Seto
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Patent number: 7359735Abstract: A radio communication apparatus enhances cell throughput by adaptive selection of spatially multiplexed channels in consideration of interferences in a local cell and reducing load for calculation of array weights by storing them in advance as fixed values and outputting fixed beams. To reduce the calculation load for the adaptive selection of spatially multiplexed channels that takes interferences within the local cell into consideration, the radio communication apparatus adopts a packet scheduling method that selects a combination of fixed beams and determines the number of spatially multiplexed channels, based on the fixed beams for mobile apparatuses with packets waiting to be transmitted and pre-calculated correlative quantities of inter-beam interferences between these fixed beams.Type: GrantFiled: February 4, 2005Date of Patent: April 15, 2008Assignees: Hitachi, Ltd., Hitachi Communication Technologies, Ltd., Hitachi Advanced Systems CorporationInventors: Kenzaburo Fujishima, Mikio Kuwahara, Masanori Taira, Koji Meguro, Toru Okamoto
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Patent number: 7139479Abstract: An optical transmission network allows transmission monitoring zones to be set up or changed in a flexible manner, and allows simultaneous monitoring of communication quality for each of these monitoring zones. Also, provided is an optical transmission zone service provider that varies user fees according to communication quality in the used zones.Type: GrantFiled: October 23, 2001Date of Patent: November 21, 2006Assignee: Hitachi, Ltd.Inventors: Masaki Ohira, Masahiro Takatori, Yuichi Yamaguchi, Toshiyuki Atsumi, Tomohiro Mori, Ryuji Ishii, Kentarou Watanabe, Toru Okamoto
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Publication number: 20060002287Abstract: To provide a wireless base station comprising an array antenna which transmits packets to terminals, a packet scheduler which determines transmission sequence of the packets, a modulator which generates modulated signals based on the packets, and a beam former for transmission signal which multiplies the packets with array weights for transmission signal and outputs the transmission signal to the array antenna the beam former for transmission signal comprises a memory which stores the array weights for transmission signal associated with the terminals' IDs. The beam former for transmission signal receives the IDs of selected terminals from the packet scheduler, refers to the memory, and selects the array weights for transmission signal by the IDs of the terminals.Type: ApplicationFiled: February 25, 2005Publication date: January 5, 2006Inventors: Mikio Kuwahara, Kenzaburo Fujishima, Masanori Taira, Koji Meguro, Toru Okamoto
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Publication number: 20050197162Abstract: A radio communication apparatus enhances cell throughput by adaptive selection of spatially multiplexed channels in consideration of interferences in a local cell and reducing load for calculation of array weights by storing them in advance as fixed values and outputting fixed beams. To reduce the calculation load for the adaptive selection of spatially multiplexed channels that takes interferences within the local cell into consideration, the radio communication apparatus adopts a packet scheduling method that selects a combination of fixed beams and determines the number of spatially multiplexed channels, based on the fixed beams for mobile apparatuses with packets waiting to be transmitted and pre-calculated correlative quantities of inter-beam interferences between these fixed beams.Type: ApplicationFiled: February 4, 2005Publication date: September 8, 2005Inventors: Kenzaburo Fujishima, Mikio Kuwahara, Masanori Taira, Koji Meguro, Toru Okamoto
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Publication number: 20020131101Abstract: An optical transmission network allows transmission monitoring zones to be set up or changed in a flexible manner, and allows simultaneous monitoring of communication quality for each of these monitoring zones. Also, provided is an optical transmission zone service provider that varies user fees according to communication quality in the used zones.Type: ApplicationFiled: October 23, 2001Publication date: September 19, 2002Applicant: HITACHI, LTD.Inventors: Masaki Ohira, Masahiro Takatori, Yuichi Yamaguchi, Toshiyuki Atsumi, Tomohiro Mori, Ryuji Ishii, Kentarou Watanabe, Toru Okamoto