Patents by Inventor Toru Okamura

Toru Okamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11833887
    Abstract: A vehicular air conditioner includes a refrigeration cycle system, a high-temperature heat medium circuit, and a low-temperature heat medium circuit. The high-temperature heat medium circuit includes an air-heat medium heat exchanger, a heater core, a branching portion, a common passage, a flow rate adjuster, and an auxiliary heat source. The air-heat medium heat exchanger exchanges heat between the heat medium and an outside air. The heater core is arranged parallel to the air-heat medium heat exchanger and causes the heat medium to transfer heat to a ventilation air. The branching portion divides a flow of the heat medium into a flow toward the air-heat medium heat exchanger and a flow toward the heater core. The auxiliary heat source is arranged in the common passage at a position upstream of the branching portion.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: December 5, 2023
    Assignee: DENSO CORPORATION
    Inventors: Hiroaki Kawano, Yoshiki Kato, Masamichi Makihara, Takahiro Maeda, Kuniyoshi Tanioka, Toru Okamura, Naoya Makimoto
  • Publication number: 20230219398
    Abstract: A refrigeration cycle device includes a flow path switching unit configured to determine whether an outside-air heat absorption unit is required to be defrosted. The flow path switching unit is further configured to: cause a heat medium to circulate separately between a first circulation circuit configured to cause the heat medium to circulate through a heat source and a second circulation circuit configured to cause the heat medium to circulate between an evaporation unit and the outside-air heat absorption unit, when it is determined that the outside-air heat absorption unit is not required to be defrosted; and switch a flow path of the heat medium to cause the heat medium in the first circulation circuit to circulate through the outside-air heat absorption unit, when it is determined that the outside-air heat absorption unit is required to be defrosted.
    Type: Application
    Filed: March 16, 2023
    Publication date: July 13, 2023
    Inventors: Toru OKAMURA, Atsushi YAMADA, Yoshiki KATOH, Hiroaki KAWANO
  • Publication number: 20220178624
    Abstract: A heat storage device includes a heat storage, a first flow passage, a second flow passage and a flow rate regulator. The heat storage stores heat released from coolant. The first flow passage is placed in a circulation path that conducts the coolant. The heat storage is installed in the first flow passage. The second flow passage conducts the coolant and bypasses the heat storage. The flow rate regulator adjusts a flow rate ratio that is a ratio of a second flow rate of the coolant, which flows in the second flow passage, relative to a first flow rate of the coolant, which flows in the first flow passage. The flow rate regulator reduces the first flow rate when a temperature of the coolant is decreased.
    Type: Application
    Filed: February 25, 2022
    Publication date: June 9, 2022
    Inventors: Takuya FUSE, Toru OKAMURA, Kuniyoshi TANIOKA
  • Publication number: 20220011006
    Abstract: An air conditioner includes a heat pump cycle, a heating unit, a low-temperature side heat medium circuit, and a heat dissipation amount adjustment control unit. The heat pump cycle has a compressor, a condenser, a decompression unit, and an evaporator. The heating unit has a heating heat exchanger, an outside air radiator, and a heat dissipation amount adjustment unit. The low-temperature side heat medium circuit has a heat generation device. The heat dissipation amount adjustment control unit controls the heat dissipation amount adjustment unit to adjust a heat dissipation amount in the outside air radiator such that a blown air temperature of the blown air heated by the heating heat exchanger approaches a predetermined target temperature.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Inventors: Koji MIURA, Hiroaki KAWANO, Motohiro YAMAGUCHI, Kazuya TANIGUCHI, Yoshiki KATO, Masamichi MAKIHARA, Takahiro MAEDA, Kuniyoshi TANIOKA, Toru OKAMURA, Naoya MAKIMOTO, Atsushi YAMADA, Kenta KAYANO
  • Publication number: 20220009309
    Abstract: A refrigeration cycle device includes a heat pump cycle, a high-temperature heat medium circuit, and a low-temperature heat medium circuit. The low-temperature heat medium circuit includes a plurality of heat absorption devices configured to have a heat absorption amount to be absorbed by the low-temperature heat medium flowing out of a low-temperature heat medium-refrigerant heat exchanger, and a heat absorption adjusting unit configured to change the heat absorption amount of the low-temperature heat medium in the respective heat absorption devices.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Inventors: Koji MIURA, Hiroaki KAWANO, Motohiro YAMAGUCHI, Kazuya TANIGUCHI, Yoshiki KATO, Masamichi MAKIHARA, Takahiro MAEDA, Kuniyoshi TANIOKA, Toru OKAMURA, Naoya MAKIMOTO
  • Publication number: 20210316597
    Abstract: A temperature adjusting device includes a heat radiation portion and a refrigeration cycle device. The heat radiation portion radiates heat of a target object to outside air. The refrigeration cycle device has a condenser and an evaporator. The condenser condenses a high-pressure refrigerant discharged from a compressor that compresses and discharges a refrigerant. The evaporator evaporates a low-pressure refrigerant pressure-reduced in a pressure reducing portion that reduces a pressure of the high-pressure refrigerant. The condenser radiates heat of the high-pressure refrigerant to at least part of the outside air that has passed through the heat radiation portion. The heat radiation portion radiates the heat of the target object to the outside air before heat of the outside air is absorbed in the condenser.
    Type: Application
    Filed: June 22, 2021
    Publication date: October 14, 2021
    Inventor: Toru OKAMURA
  • Publication number: 20210316594
    Abstract: A vehicular air conditioner includes a refrigeration cycle system, a high-temperature heat medium circuit, and a low-temperature heat medium circuit. The high-temperature heat medium circuit includes an air-heat medium heat exchanger, a heater core, a branching portion, a common passage, a flow rate adjuster, and an auxiliary heat source. The air-heat medium heat exchanger exchanges heat between the heat medium and an outside air. The heater core is arranged parallel to the air-heat medium heat exchanger and causes the heat medium to transfer heat to a ventilation air. The branching portion divides a flow of the heat medium into a flow toward the air-heat medium heat exchanger and a flow toward the heater core. The auxiliary heat source is arranged in the common passage at a position upstream of the branching portion.
    Type: Application
    Filed: June 22, 2021
    Publication date: October 14, 2021
    Inventors: Hiroaki KAWANO, Yoshiki KATO, Masamichi MAKIHARA, Takahiro MAEDA, Kuniyoshi TANIOKA, Toru OKAMURA, Naoya MAKIMOTO
  • Publication number: 20200340758
    Abstract: A heat storage device includes a heat storage, a first flow passage, a second flow passage and a flow rate regulator. The heat storage stores heat released from coolant. The first flow passage is placed in a circulation path that conducts the coolant. The heat storage is installed in the first flow passage. The second flow passage conducts the coolant and bypasses the heat storage. The flow rate regulator adjusts a flow rate ratio that is a ratio of a second flow rate of the coolant, which flows in the second flow passage, relative to a first flow rate of the coolant, which flows in the first flow passage. The flow rate regulator reduces the first flow rate when a temperature of the coolant is decreased.
    Type: Application
    Filed: July 10, 2020
    Publication date: October 29, 2020
    Inventors: Takuya FUSE, Toru OKAMURA, Kuniyoshi TANIOKA
  • Patent number: 10494985
    Abstract: A warm-up device is provided in a cooling-water circuit, through which cooling water is circulated so as to pass through an engine. The warm-up device has a heat accumulating passage, in which a heat accumulating device is provided, and an accumulating-device bypassing passage bypassing the heat accumulating device. A waste-heat collecting device is provided in the cooling-water circuit so that heat is collected from exhaust gas from the engine and such collected heat is accumulated in the heat accumulating device. The cooling water is circulated through the heat accumulating device during a start-up operation of the engine in order to heat the cooling water flowing into the engine so as to quickly warm up the engine.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: December 3, 2019
    Assignee: DENSO CORPORATION
    Inventors: Toru Okamura, Kenichi Nara, Kuniyoshi Tanioka
  • Patent number: 10378424
    Abstract: The exhaust gas recirculation system comprises an exhaust recirculation pipe configured to recirculate an exhaust gas from an engine into an intake pipe of the engine, an exhaust gas heat exchanger connected to the exhaust recirculation pipe and configured to perform an heat exchange between the exhaust gas and an engine cooling water used for cooling the engine, a cooling water pipe configured to circulate the engine cooling water to the exhaust gas heat exchanger, and a heat insulating member forming a heat insulating layer on a heat transfer path from the exhaust gas heat exchanger to the outside.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: August 13, 2019
    Assignee: DENSO CORPORATION
    Inventors: Toru Okamura, Kenichi Nara
  • Publication number: 20180252145
    Abstract: The exhaust gas recirculation system comprises an exhaust recirculation pipe configured to recirculate an exhaust gas from an engine into an intake pipe of the engine, an exhaust gas heat exchanger connected to the exhaust recirculation pipe and configured to perform an heat exchange between the exhaust gas and an engine cooling water used for cooling the engine, a cooling water pipe configured to circulate the engine cooling water to the exhaust gas heat exchanger, and a heat insulating member forming a heat insulating layer on a heat transfer path from the exhaust gas heat exchanger to the outside.
    Type: Application
    Filed: February 27, 2018
    Publication date: September 6, 2018
    Inventors: Toru OKAMURA, Kenichi NARA
  • Publication number: 20180120036
    Abstract: A latent heat storage material includes a latent heat storage member formed of an organic compound, and a metallic seamless capsule encapsulating the latent heat storage member. A method for manufacturing the latent heat storage material includes preparing a grain of the latent heat storage member, supporting a powder on the latent heat storage member, conducting an electroless plating to form a first plating layer of the metallic seamless capsule on a surface of the latent heat storage member, and conducting an electrolytic plating to form a second plating layer of the metallic seamless capsule on a surface of the first plating layer.
    Type: Application
    Filed: November 1, 2017
    Publication date: May 3, 2018
    Inventors: Toru OKAMURA, Kenichi NARA, Hirokazu SHIKATA, Hiroshi IHARA, Satoshi OYA, Yukari FUCHIGAMI, Toshiyuki YOSHIKATA
  • Publication number: 20180023453
    Abstract: A warm-up device is provided in a cooling-water circuit, through which cooling water is circulated so as to pass through an engine. The warm-up device has a heat accumulating passage, in which a heat accumulating device is provided, and an accumulating-device bypassing passage bypassing the heat accumulating device. A waste-heat collecting device is provided in the cooling-water circuit so that heat is collected from exhaust gas from the engine and such collected heat is accumulated in the heat accumulating device. The cooling water is circulated through the heat accumulating device during a start-up operation of the engine in order to heat the cooling water flowing into the engine so as to quickly warm up the engine.
    Type: Application
    Filed: July 17, 2017
    Publication date: January 25, 2018
    Inventors: Toru OKAMURA, Kenichi NARA, Kuniyoshi TANIOKA
  • Patent number: 8763575
    Abstract: A valve train mechanism of an internal combustion engine including a cylinder head formed with an intake port and an exhaust port, and a camshaft including a valve for opening or closing the intake port and the exhaust port formed in the cylinder head of the engine, a cam mounted to the camshaft so as to be rotated together, and a rocker arm supported on a rocker shaft to be swingable, in which the valve is opened or closed by swinging the rocker arm by rotation of the cam. The rocker shaft is formed with an oil passage, inside the rocker shaft, extending in an axial direction and with an oil outlet communicating with the oil passage and extending in a radial direction of the rocker shaft.
    Type: Grant
    Filed: January 10, 2013
    Date of Patent: July 1, 2014
    Assignee: Suzuki Motor Corporation
    Inventors: Kunio Arase, Shuichi Yokota, Toru Okamura, Daisuke Yoshimoto
  • Publication number: 20130180488
    Abstract: A valve train mechanism of an internal combustion engine including a cylinder head formed with an intake port and an exhaust port, and a camshaft including a valve for opening or closing the intake port and the exhaust port formed in the cylinder head of the engine, a cam mounted to the camshaft so as to be rotated together, and a rocker arm supported on a rocker shaft to be swingable, in which the valve is opened or closed by swinging the rocker arm by rotation of the cam. The rocker shaft is formed with an oil passage, inside the rocker shaft, extending in an axial direction and with an oil outlet communicating with the oil passage and extending in a radial direction of the rocker shaft.
    Type: Application
    Filed: January 10, 2013
    Publication date: July 18, 2013
    Applicants: SUZUKI MOTOR CORPORATION
    Inventors: SUZUKI MOTOR CORPORATION, Kunio Arase, Shuichi Yokota, Toru Okamura, Daisuke Yoshimoto
  • Patent number: 7873177
    Abstract: An ear-hanger headphone apparatus includes ear hangers each having a predetermined shape, housings integrally attached to the ear hangers, respectively, and driver units attached to the housings swingably relative thereto so as to closely overlap with ear conches without clearance, respectively, when the headphone apparatus is worn.
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: January 18, 2011
    Assignee: Sony Corporation
    Inventors: Toru Okamura, Naoki Watanabe, Naotaka Tsunoda
  • Publication number: 20060215868
    Abstract: An ear-hanger headphone apparatus includes ear hangers each having a predetermined shape, housings integrally attached to the ear hangers, respectively, and driver units attached to the housings swingably relative thereto so as to closely overlap with ear conches without clearance, respectively, when the headphone apparatus is worn.
    Type: Application
    Filed: March 27, 2006
    Publication date: September 28, 2006
    Applicant: Sony Corporation
    Inventors: Toru Okamura, Naoki Watanabe, Naotaka Tsunoda
  • Publication number: 20040164391
    Abstract: A stacked semiconductor device has a plurality of semiconductor elements mounted on the device in a stacked form. Each semiconductor element has a rectangular upper surface. A plurality of electrode pads is provided on the rectangular upper surface of the semiconductor element. In each semiconductor element, the electrode pads are arranged near two adjacent sides of the rectangular upper surface. A space for performing wire connection is made between two adjacent semiconductor elements. The adjacent semiconductor elements are joined to each other only by a die-bonding material without using any dummy element. The stacked semiconductor device can have increased number of electrode pads and increased functions compared to a conventional stacked semiconductor device.
    Type: Application
    Filed: July 25, 2003
    Publication date: August 26, 2004
    Inventor: Toru Okamura
  • Patent number: 6575232
    Abstract: A flat or a flared tubular end portion devoid of dimples is provided at the end of a tube 11 which is to be inserted into a header with the length, of the flat tubular portion being 1.5 mm or less along the direction of the length of the tube to prevent rapid reduction and enlargement of the cross-sectional area of the refrigerant path in the vicinity of the joint of the tube and the header, so as to reduce the pressure loss of the refrigerant which flows in and out from the header to the tube. A tube insertion stop is also provided consisting either, of a cut formed in the longitudinal edge of the flat end portion or a guard member which is formed aft of the flared, end portion so as to abut the header and seal off the tube insertion aperture of the header.
    Type: Grant
    Filed: June 7, 2000
    Date of Patent: June 10, 2003
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Koji Nakado, Toru Okamura
  • Publication number: 20010018970
    Abstract: A heat exchanger comprises: a pair of headers (10, 10) which are provided in parallel facing each other through a predetermined distance and a pathway of the fluid is respectively provided therein; and a plurality of flat heat-exchange tubes (20, 20 . . . ) which are provided between the headers in parallel, both ends thereof are fastened to the headers, and a pathway of the refrigerant for connecting the pathways of both headers is respectively provided therein. In this heat exchanger, the heat-exchange tubes and the headers are air-tightly and liquid-tightly fastened by inserting end portions (21, 21 . . . ) of the heat-exchange tubes into insertion holes (11, 11 . . . ) which are bored on the headers. Furthermore, in the vicinity of opening ends (29) of both end portions of the flat heat-exchange tubes, shape-holding portions (41) for preventing deformation of the opening ends are provided.
    Type: Application
    Filed: March 6, 2001
    Publication date: September 6, 2001
    Inventors: Koji Nakado, Toru Okamura, Masashi Inoue, Kei Yoshitomi