Abstract: A polymetalloxane including structural units represented by formulae (1-1) and (1-2), and having a weight-average molecular weight of 30,000 or more and 2,000,000 or less; wherein, M1 and M2 independently represent different metal atoms; L1 and L2 are each independently a group selected from the group consisting of an allyloxy group, an aryloxy group, and a trialkylsiloxy group; L1 and L2 may be the same or different, and at least one thereof is an allyloxy group or an aryloxy group; R1 and R2 are each independently a hydrogen atom, a C1-12 alkyl group, or a group having a metalloxane bond; m is an integer that represents the valence of the metal atom M1, and a is an integer of 1 to (m?2); and n is an integer that represents the valence of the metal atom M2, and b is an integer of 1 to (n?2).

Abstract: A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 ?m or more and 100 ?m or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

Abstract: A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 ?m or more and 100 ?m or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

Abstract: The present invention provides a negative-type photosensitive white composition for a touch panel, the composition including: (A) a white pigment; (B) an alkali-soluble resin; (C) a polyfunctional monomer; and (D) a photopolymerization initiator.

Abstract: The purpose of the present invention is to provide a negative-type photosensitive coloring composition ideal for forming a white, light-blocking pattern and which not only has excellent chemical resistance, but also has extremely excellent heat resistance and does not yellow or crack even when undergoing high-temperature processing. This negative-type photosensitive coloring composition contains (A) a white pigment, (B) a polysiloxane obtained by co-hydrolyzate condensation of an alkoxysilane compound containing a compound of a specific structure, (C) polyfunctional acrylic monomers, (D) a photoradical polymerization initiator and (E) an organic solvent.

Abstract: The present invention provides a negative-type photosensitive white composition for a touch panel, the composition including: (A) a white pigment; (B) an alkali-soluble resin; (C) a polyfunctional monomer; and (D) a photopolymerization initiator.

Abstract: The purpose of the present invention is to provide a negative-type photosensitive coloring composition ideal for forming a white, light-blocking pattern and which not only has excellent chemical resistance, but also has extremely excellent heat resistance and does not yellow or crack even when undergoing high-temperature processing. This negative-type photosensitive coloring composition contains (A) a white pigment, (B) a polysiloxane obtained by co-hydrolyzate condensation of an alkoxysilane compound containing a compound of a specific structure, (C) polyfunctional acrylic monomers, (D) a photoradical polymerization initiator and (E) an organic solvent.

Abstract: The present invention provides a substrate comprising a region where thin films are laminated on a transparent ground substrate, which thin films are, in the order mentioned from the upper surface of the substrate, an ITO thin film (I); an organic thin film (II) having a film thickness of from 0.01 ?m to 0.4 ?m and a refractive index of from 1.58 to 1.85; and an organic thin film (III) having a film thickness of from 0.7 ?m to 20 ?m and a refractive index of from 1.46 to 1.56.

Abstract: A photosensitive resin composition which can impart insulating properties and light-shielding properties against light having a wavelength lying in an ultra-violet range, a visible range and a near-infrared range to a substrate more readily when applied onto the substrate, wherein the substrate has such properties that the permeability to light having a wavelength of 400 to 900 nm inclusive is less than 3.0% and the maximum value of the permeability to light having a wavelength of longer than 900 nm and not longer than 1300 nm is 3.0% or more. The photosensitive resin composition is characterized by comprising (a) an alkali soluble resin, (b) a specific tungsten oxide and/or a specific composite tungsten oxide, (c) a photopolymerizable compound having at least two polymerizable groups, (d) an oxime-type photopolymerization initiator, and (e) a solvent.

Abstract: Disclosed is a positive photosensitive resin composition which is characterized by containing (a) a polysiloxane that is synthesized by hydrolyzing and partially condensing a specific organosilane and an organosilane oligomer, (b) aluminum compound particles, tin compound particles, titanium compound particles, zirconium compound particles, composite particles of the aforementioned compounds or composite particles of any of the aforementioned compounds and a silicon compound, (c) a naphthoquinonediazide compound and (d) a solvent. The positive photosensitive resin composition is also characterized in that the organosilane oligomer contains a specific organosilane. The positive photosensitive resin composition has achieved excellent sensitivity and resolution without deteriorating high refractive index and high transparency.

Abstract: A photosensitive resin composition which can impart insulating properties and light-shielding properties against light having a wavelength lying in an ultra-violet range, a visible range and a near-infrared range to a substrate more readily when applied onto the substrate, wherein the substrate has such properties that the permeability to light having a wavelength of 400 to 900 nm inclusive is less than 3.0% and the maximum value of the permeability to light having a wavelength of longer than 900 nm and not longer than 1300 nm is 3.0% or more. The photosensitive resin composition is characterized by comprising (a) an alkali soluble resin, (b) a specific tungsten oxide and/or a specific composite tungsten oxide, (c) a photopolymerizable compound having at least two polymerizable groups, (d) an oxime-type photopolymerization initiator, and (e) a solvent.

Abstract: Disclosed is a positive photosensitive resin composition which is characterized by containing (a) a polysiloxane that is synthesized by hydrolyzing and partially condensing a specific organosilane and an organosilane oligomer, (b) aluminum compound particles, tin compound particles, titanium compound particles, zirconium compound particles, composite particles of the aforementioned compounds or composite particles of any of the aforementioned compounds and a silicon compound, (c) a naphthoquinonediazide compound and (d) a solvent. The positive photosensitive resin composition is also characterized in that the organosilane oligomer contains a specific organosilane. The positive photosensitive resin composition has achieved excellent sensitivity and resolution without deteriorating high refractive index and high transparency.