Abstract: A functional member having a molecular layer on its surface, wherein the molecular layer is formed through a coordinate bond, and the coordinate bond is a multidentate bond in which at least one molecule is bonded to one metallic atom of the member and two or more ligands of the molecule are coordinated.

Abstract: A cleaning agent for removing a residue of soldering flux, which essentially consists of mono-, di-, or tri-alkylene glycol mono branched C.sub.3 -C.sub.5 alkyl ether, which can remove with high safety both ionic residues and resinous materials contained in a soldering flux, which remain on the surface of a soldered electronic substrate. The cleaning agent of the present invention does not adversely affect the insulation and materials used in an electronic device.

Abstract: A flux for soft soldering is disclosed. It comprises a chelating agent as an activator for facilitating a connection of a conductor metal to a soft solder by removing an oxide film naturally formed on the surface of the conductor metal, and for securing insulating reliability after soft soldering by forming complexes with copper and tin which are insulating substance, and a solvent capable of dissolving the chelating agent and further preferably evaporating at soldering process.

Abstract: A solvent for polystyrene, having an excellent dissolving ability and chemical stability with no influence on the operating environment, is disclosed. A relatively simple recycling or reutilizing process of both the polystyrene foam and the solvent is also disclosed. The solvent comprises at least one member selected from the group consisting of such a glycol ether compound as diethylene glycol dimethyl ether, diethylene glycol diethyl ether or dipropylene glycol dimethyl ether, and such a fatty acid dialkyl ester compound as dimethyl succinate, dimethyl glutarate or dimethyl adipate. These compounds have a flash point of 100.degree. C. or higher, and can be made nonflammable by addition of water.