Patents by Inventor Toru Shuto
Toru Shuto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8921781Abstract: In the case of inspecting samples having different sizes by means of a semiconductor inspecting apparatus, a primary electron beam bends since distribution is disturbed on an equipotential surface at the vicinity of the sample at the time of inspecting vicinities of the sample, and what is called a positional shift is generated. A potential correcting electrode is arranged outside the sample and at a position lower than the sample lower surface, and a potential lower than that of the sample is applied. Furthermore, a voltage to be applied to the potential correcting electrode is controlled corresponding to a distance between the inspecting position and a sample outer end, sample thickness and irradiation conditions of the primary electron beam.Type: GrantFiled: August 20, 2013Date of Patent: December 30, 2014Assignee: Hitachi High-Technologies CorporationInventors: Go Miya, Seiichiro Kanno, Hiroyuki Kitsunai, Masaru Matsushima, Toru Shuto
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Patent number: 8680466Abstract: It is an object of the present invention to provide an electron microscope for properly applying a retarding voltage to a sample which is brought into electrical conduction.Type: GrantFiled: October 15, 2009Date of Patent: March 25, 2014Assignee: Hitachi High-Technologies CoporationInventors: Seiichiro Kanno, Hiroyuki Kitsunai, Masaru Matsushima, Toru Shuto, Kazuyuki Ikenaga
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Publication number: 20130327939Abstract: In the case of inspecting samples having different sizes by means of a semiconductor inspecting apparatus, a primary electron beam bends since distribution is disturbed on an equipotential surface at the vicinity of the sample at the time of inspecting vicinities of the sample, and what is called a positional shift is generated. A potential correcting electrode is arranged outside the sample and at a position lower than the sample lower surface, and a potential lower than that of the sample is applied. Furthermore, a voltage to be applied to the potential correcting electrode is controlled corresponding to a distance between the inspecting position and a sample outer end, sample thickness and irradiation conditions of the primary electron beam.Type: ApplicationFiled: August 20, 2013Publication date: December 12, 2013Applicant: HITACHI HIGH-TECHNOLOGIESInventors: Go MIYA, Seiichiro KANNO, Hiroyuki KITSUNAI, Masaru MATSUSHIMA, Toru SHUTO
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Patent number: 8519332Abstract: In the case of inspecting samples having different sizes by means of a semiconductor inspecting apparatus, a primary electron beam bends since distribution is disturbed on an equipotential surface at the vicinity of the sample at the time of inspecting vicinities of the sample, and what is called a positional shift is generated. A potential correcting electrode is arranged outside the sample and at a position lower than the sample lower surface, and a potential lower than that of the sample is applied. Furthermore, a voltage to be applied to the potential correcting electrode is controlled corresponding to a distance between the inspecting position and a sample outer end, sample thickness and irradiation conditions of the primary electron beam.Type: GrantFiled: June 29, 2012Date of Patent: August 27, 2013Assignee: Hitachi High-Technologies CorporationInventors: Go Miya, Seiichiro Kanno, Hiroyuki Kitsunai, Masaru Matsushima, Toru Shuto
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Publication number: 20120261589Abstract: In the case of inspecting samples having different sizes by means of a semiconductor inspecting apparatus, a primary electron beam bends since distribution is disturbed on an equipotential surface at the vicinity of the sample at the time of inspecting vicinities of the sample, and what is called a positional shift is generated. A potential correcting electrode is arranged outside the sample and at a position lower than the sample lower surface, and a potential lower than that of the sample is applied. Furthermore, a voltage to be applied to the potential correcting electrode is controlled corresponding to a distance between the inspecting position and a sample outer end, sample thickness and irradiation conditions of the primary electron beam.Type: ApplicationFiled: June 29, 2012Publication date: October 18, 2012Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Go MIYA, Seiichiro KANNO, Hiroyuki KITSUNAI, Masaru MATSUSHIMA, Toru SHUTO
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Patent number: 8232522Abstract: In the case of inspecting samples having different sizes by means of a semiconductor inspecting apparatus, a primary electron beam bends since distribution is disturbed on an equipotential surface at the vicinity of the sample at the time of inspecting vicinities of the sample, and what is called a positional shift is generated. A potential correcting electrode is arranged outside the sample and at a position lower than the sample lower surface, and a potential lower than that of the sample is applied. Furthermore, a voltage to be applied to the potential correcting electrode is controlled corresponding to a distance between the inspecting position and a sample outer end, sample thickness and irradiation conditions of the primary electron beam.Type: GrantFiled: June 23, 2009Date of Patent: July 31, 2012Assignee: Hitachi High-Technologies CorporationInventors: Go Miya, Seiichiro Kanno, Hiroyuki Kitsunai, Masaru Matsushima, Toru Shuto
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Publication number: 20110303844Abstract: It is an object of the present invention to provide an electron microscope for properly applying a retarding voltage to a sample which is brought into electrical conduction.Type: ApplicationFiled: October 15, 2009Publication date: December 15, 2011Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Seiichiro Kanno, Hiroyuki Kitsunai, Masaru Matsushima, Toru Shuto, Kazuyuki Ikenaga
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Publication number: 20110095185Abstract: In the case of inspecting samples having different sizes by means of a semiconductor inspecting apparatus, a primary electron beam bends since distribution is disturbed on an equipotential surface at the vicinity of the sample at the time of inspecting vicinities of the sample, and what is called a positional shift is generated. A potential correcting electrode is arranged outside the sample and at a position lower than the sample lower surface, and a potential lower than that of the sample is applied. Furthermore, a voltage to be applied to the potential correcting electrode is controlled corresponding to a distance between the inspecting position and a sample outer end, sample thickness and irradiation conditions of the primary electron beam.Type: ApplicationFiled: June 23, 2009Publication date: April 28, 2011Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Go Miya, Seiichiro Kanno, Hiroyuki Kitsunai, Masaru Matsushima, Toru Shuto